The invention relates to a two-component composition comprising: a part A comprising a complex of organoborane with an amine; a part B comprising a polymer comprising at least one acrylic group and at least one isocyanate group;

the composition comprising at least one acrylic monomer or oligomer in part A and/or in part B of the composition.

The invention also relates to the use of said composition as an adhesive for binding two substrates together.

The invention relates to a two-component composition comprising: a part A comprising a complex of organoborane with an amine; a part B comprising a polymer comprising at least one acrylic group and at least one isocyanate group;

the composition comprising at least one acrylic monomer or oligomer in part A and/or in part B of the composition.

The invention also relates to the use of said composition as an adhesive for binding two substrates together.

A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.

##STR00001##

A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.

##STR00001##

A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength. ##STR00001##

A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength. ##STR00001##

Provided is an object forming liquid containing a resin containing at least one structural unit selected from the group consisting of a structural unit represented by a predetermined structural formula (1) and a structural unit represented by a predetermined structural formula (2), and an organic solvent, and substantially free of water. The object forming liquid is applied to a layer of a powder containing metal particles.

Provided is an object forming liquid containing a resin containing at least one structural unit selected from the group consisting of a structural unit represented by a predetermined structural formula (1) and a structural unit represented by a predetermined structural formula (2), and an organic solvent, and substantially free of water. The object forming liquid is applied to a layer of a powder containing metal particles.

Photocurable (meth)acrylate compositions with low viscosity when uncured, and high flexibility and shear/tensile strength when cured, further possessing rapid tack-free fixture times, comprising mixtures of urethane acrylate resin, isobornyl acrylate, N,N-dimethylacrylamide, a photoinitiator component, and a low percentage of tetrahydrofurfuryl acrylate, for example from about 9% to about 15% by weight based on the weight of the composition. Applications can include adhesive bonding of medical tubing, UV/Visible transparent plastics material medical devices or equipment, or other flexible UV/Visible transparent material substrates.

Photocurable (meth)acrylate compositions with low viscosity when uncured, and high flexibility and shear/tensile strength when cured, further possessing rapid tack-free fixture times, comprising mixtures of urethane acrylate resin, isobornyl acrylate, N,N-dimethylacrylamide, a photoinitiator component, and a low percentage of tetrahydrofurfuryl acrylate, for example from about 9% to about 15% by weight based on the weight of the composition. Applications can include adhesive bonding of medical tubing, UV/Visible transparent plastics material medical devices or equipment, or other flexible UV/Visible transparent material substrates.