C08L39/00

RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE

A resin composition that has excellent adhesiveness to chips and substrates such as printed wiring boards and excellent flux activity is provided. The present application provides a resin composition containing: a benzoxazine compound (A); an organic compound (B) having a flux function; and at least one thermosetting component (C) selected from a phenolic resin and a radical polymerizable thermosetting resin, wherein the radical polymerizable thermosetting resin is a resin or a compound having at least one or more functional groups selected from the group consisting of an alkenyl group, a maleimide group and a (meth)acryloyl group, and wherein a mass ratio between the benzoxazine compound (A) and the thermosetting component (C) ((A)/(C)) is 20/80 to 90/10.

Composite compositions and modification of inorganic particles for use in composite compositions

A composition formed by dispersing at least a plurality of first particles within a matrix material and dispersing at least a plurality of second particles within the matrix material, the second particles being different from the first particles, wherein interaction between the at least a plurality of second particles and the at least a plurality of first particles determines a spatial distribution of the plurality of second particles within the matrix material.

Composite compositions and modification of inorganic particles for use in composite compositions

A composition formed by dispersing at least a plurality of first particles within a matrix material and dispersing at least a plurality of second particles within the matrix material, the second particles being different from the first particles, wherein interaction between the at least a plurality of second particles and the at least a plurality of first particles determines a spatial distribution of the plurality of second particles within the matrix material.

POLYMER, RESIN COMPOSITION, MOLDED ARTICLE, AND PRODUCTION METHOD FOR POLYMER

There is provided a polymer which is excellent in the water-repellent property and the oil-repellent property and with which a resin composition with excellent water-repellent property and oil-repellent property can be obtained even in case where an amount of the polymer mixed with another resin is not large.

A polymer that comprises a structural unit (A) derived from ethylene, a structural unit (B) represented by a particular formula (1), and at least one kind of structural unit (C) selected from the group consisting of structural units represented by a particular formula (2) and a structural unit represented by a particular formula (3), in which the number of the structural unit (A) is not less than 70% but not more than 99%, and the total number of the structural unit (B) and the structural unit (C) is not less than 1% but not more than 30%, where the total number of the structural unit (A), the structural unit (B), and the structural unit (C) is 100%, and the number of the structural unit (B) is not less than 1% but not more than 99%, and the number of the structural unit (C) is not less than 1% but not more than 99%, where the total number of the structural unit (B) and the structural unit (C) is 100%.

POLYMER, RESIN COMPOSITION, MOLDED ARTICLE, AND PRODUCTION METHOD FOR POLYMER

There is provided a polymer which is excellent in the water-repellent property and the oil-repellent property and with which a resin composition with excellent water-repellent property and oil-repellent property can be obtained even in case where an amount of the polymer mixed with another resin is not large.

A polymer that comprises a structural unit (A) derived from ethylene, a structural unit (B) represented by a particular formula (1), and at least one kind of structural unit (C) selected from the group consisting of structural units represented by a particular formula (2) and a structural unit represented by a particular formula (3), in which the number of the structural unit (A) is not less than 70% but not more than 99%, and the total number of the structural unit (B) and the structural unit (C) is not less than 1% but not more than 30%, where the total number of the structural unit (A), the structural unit (B), and the structural unit (C) is 100%, and the number of the structural unit (B) is not less than 1% but not more than 99%, and the number of the structural unit (C) is not less than 1% but not more than 99%, where the total number of the structural unit (B) and the structural unit (C) is 100%.

Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device

The present invention provides a resin composition containing a maleimide compound (A), and at least one selected from the group consisting of an organic compound (B) having an acidic site and an organic compound (C) having an acid anhydride site.

Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device

The present invention provides a resin composition containing a maleimide compound (A), and at least one selected from the group consisting of an organic compound (B) having an acidic site and an organic compound (C) having an acid anhydride site.

METHOD TO INCREASE BARRIER FILM REMOVAL RATE IN BULK TUNGSTEN SLURRY
20210017421 · 2021-01-21 ·

The invention relates to a chemical-mechanical polishing composition comprising (a) a first abrasive comprising cationically modified colloidal silica particles, (b) a second abrasive having a Mohs hardness of about 5.5 or more, (c) a cationic polymer, (d) an iron containing activator, (e) an oxidizing agent, and (f) water. The invention also relates to a method of chemically mechanically polishing a substrate, especially a substrate comprising tungsten and barrier layers (e.g., nitrides), with the polishing composition.

METHOD TO INCREASE BARRIER FILM REMOVAL RATE IN BULK TUNGSTEN SLURRY
20210017421 · 2021-01-21 ·

The invention relates to a chemical-mechanical polishing composition comprising (a) a first abrasive comprising cationically modified colloidal silica particles, (b) a second abrasive having a Mohs hardness of about 5.5 or more, (c) a cationic polymer, (d) an iron containing activator, (e) an oxidizing agent, and (f) water. The invention also relates to a method of chemically mechanically polishing a substrate, especially a substrate comprising tungsten and barrier layers (e.g., nitrides), with the polishing composition.

Resin composition for golf balls, and golf ball

A resin composition for golf balls includes specific amounts of (A) polyurethane or polyurea and (B) an oxazoline group-containing acrylic polymer or an oxazoline group-containing styrene polymer. A golf ball having a core encased by a cover of one or more layers, wherein at least one cover layer is formed of this resin composition, exhibits a good adhesion between adjoining layers, enabling the ball to achieve a high scuff resistance without lowering the initial velocity of the ball.