An aqueous ink composition including: an aqueous medium and resin fine particles, in which a proportion of a high-boiling solvent occupied in the aqueous medium is 3% by mass or less, and a resin constituting the resin fine particle contains constitutional units represented by General Formula (1) or (2).

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In the formulae, R.sup.1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, A.sup.1 represents O, NH, or N(L.sup.2-Y.sup.2), and L.sup.1 and L.sup.2 each are represent a specific divalent group such as an alkylene group or the like.

Y.sup.1 and Y.sup.2 each represent OH, OR.sup.2, NH.sub.2, NR.sup.2H, NR.sup.2R.sup.3, SH, S(O).sub.2OM, or OP(O)(OM).sub.2. R.sup.2 and R.sup.3 each represent a specific substituent, and M represents a hydrogen atom, an alkali metal ion, or an ammonium ion.

Provided is a resin composition that has high moisture resistance reliability after curing (particularly, high shear strength after a moisture resistance test), is curable at low temperature, and has light curing properties and heat curing properties. There are also provided an adhesive agent containing this resin composition, a cured product of the resin composition, a semiconductor device containing this cured product, and an electronic component containing the semiconductor device. The resin composition includes (A) a multifunctional (meth)acrylate resin, (B) a multifunctional thiol resin, and (C) a calcium carbonate filler having a purity of 99% or more. The component (B) preferably contains a multifunctional thiol resin having no ester bond in the molecule. The resin composition more preferably further contains talc.

Provided is a resin composition that has high moisture resistance reliability after curing (particularly, high shear strength after a moisture resistance test), is curable at low temperature, and has light curing properties and heat curing properties. There are also provided an adhesive agent containing this resin composition, a cured product of the resin composition, a semiconductor device containing this cured product, and an electronic component containing the semiconductor device. The resin composition includes (A) a multifunctional (meth)acrylate resin, (B) a multifunctional thiol resin, and (C) a calcium carbonate filler having a purity of 99% or more. The component (B) preferably contains a multifunctional thiol resin having no ester bond in the molecule. The resin composition more preferably further contains talc.

The present invention provides methods, processes, and systems for the manufacture of three-dimensional articles made of polymers using 3D printing. A layer of prepolymer is deposited on a build plate to form a powder bed. Then, solutions of first and/or second binding agents are printed on the powder bed in a predetermined pattern. After a predetermined period of time, sequential layers are printed to provide the three-dimensional article. The removable binding agent is then removed. The three-dimensional object can be cured to produce the three-dimensional article composed of the final polymers.

The present invention provides methods, processes, and systems for the manufacture of three-dimensional articles made of polymers using 3D printing. A layer of prepolymer is deposited on a build plate to form a powder bed. Then, solutions of first and/or second binding agents are printed on the powder bed in a predetermined pattern. After a predetermined period of time, sequential layers are printed to provide the three-dimensional article. The removable binding agent is then removed. The three-dimensional object can be cured to produce the three-dimensional article composed of the final polymers.

A star-shaped polyacrylamide copolymer and a preparation method thereof are provided, as well as a drilling fluid containing the star-shaped polyacrylamide copolymer. Only the star-shaped polyacrylamide copolymer is added into the drilling fluid; under a high-temperature environment, the filtration volume of the drilling fluid can be reduced, the high-temperature rheological property of the drilling fluid is improved, and the pressure loss of a circulation system of the drilling fluid is reduced.

A star-shaped polyacrylamide copolymer and a preparation method thereof are provided, as well as a drilling fluid containing the star-shaped polyacrylamide copolymer. Only the star-shaped polyacrylamide copolymer is added into the drilling fluid; under a high-temperature environment, the filtration volume of the drilling fluid can be reduced, the high-temperature rheological property of the drilling fluid is improved, and the pressure loss of a circulation system of the drilling fluid is reduced.

A resist composition comprising a base polymer and a quencher in the form of a heterocyclic amine compound having a tertiary ester structure offers a high sensitivity and minimal LWR or improved CDU, independent of whether it is of positive or negative tone.

A resist composition comprising a base polymer and a quencher in the form of a heterocyclic amine compound having a tertiary ester structure offers a high sensitivity and minimal LWR or improved CDU, independent of whether it is of positive or negative tone.

A conductive ink containing a diacetylene diol monomer and a conductive polymer and a method for producing a fine pattern using the same are provided. The conductive ink comprises a conductive polymer and a diacetylene diol monomer represented by Chemical Formula 1 below: [Chemical Formula 1] HO(R.sub.1).sub.nCCCC(R.sub.2).sub.mOH. In Chemical Formula 1, n and m are 1 to 10 irrespective of each other, R.sub.1 and R.sub.2, regardless of each other, are CR.sub.aR.sub.b or (CR.sub.aR.sub.b).sub.xO, R.sub.a and R.sub.b are each independently hydrogen or halogen, and x is an integer of 1 to 3. In Chemical Formula 1, R.sub.1 and R.sub.2 may be both CH.sub.2, and n and m may be integers of 1 to 4 irrespective of each other.