The polycarbonate resin composition of the present invention comprises: a polycarbonate ingredient including a copolymerized polycarbonate resin and an aromatic polycarbonate resin, the copolymerized polycarbonate resin having a repeating unit represented by chemical formula 1 of claim 1, a repeating unit represented by chemical formula 2 of claim 1, and a repeating unit represented by chemical formula 3 of claim 1; and an acrylic-based impact reinforcing agent. The polycarbonate resin composition has excellent scratch resistance, impact resistance, and heat resistance.

A thermoplastic resin composition includes (A) a first rubber-modified acrylic-based graft copolymer having an average rubber particle diameter of greater than or equal to about 100 nm and less than about 200 nm, (B) a second rubber-modified acrylic-based graft copolymer having an average rubber particle diameter of greater than or equal to about 200 nm and less than or equal to about 400 nm, (C) a first vinyl-based copolymer of an aromatic vinyl monomer and a unsaturated nitrile monomer, and (D) a second vinyl-based copolymer of an alkyl (meth)acrylate monomer, an aromatic vinyl monomer, and a unsaturated nitrile monomer. A molded article can be made using the same.

There is provided a powder that comprises a multistage polymer that comprises (a) at least one soft polymer having glass transition temperature of 40° C. or lower, and (b) at least one hard polymer having glass transition temperature higher than 40° C., wherein the glass transition temperature of said hard polymer is at least 10° C. higher than the glass transition temperature of said soft polymer,
wherein the weight ratio of said hard polymer to said soft polymer is from 1.01:1 to 100:1, and
wherein said multistage polymer, after exposure to liquid water followed by drying at temperatures below 100° C., shows maximum thermal transition temperature in an atmosphere of 0% relative humidity that differs by 20° C. or less from the maximum thermal transition temperature in an atmosphere of 75% relative humidity.

A resin composition including an epoxy resin (A), a curing agent (B), and vinyl polymer particles (C), in which the contained amount of epoxy resin (a1) having a molecular weight of 100-480 is 30-90 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of epoxy resin (a2) having a molecular weight of 2,000-40,000 is 10-70 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of the vinyl polymer particles (C) is 2-30 parts by mass per 100 parts by mass of the epoxy resin (A), and the instantaneous maximum thickening value of the vinyl polymer particles obtained by the following method is 0.3-5.0 Pa.Math.s/° C.

Provided is a thermoplastic resin composition [X] for reduction of squeaking noises containing a rubber-reinforced vinyl resin [A] obtained by polymerizing a vinyl monomer [b1] in the presence of an ethylene-α-olefin rubber polymer [a1] having Tm (melting point) of 0° C. or higher, wherein an amount of silicon contained in the thermoplastic resin composition [X] is 0.15% by mass or less based on 100% by mass of the thermoplastic resin composition [X]. According to the present invention, a structure can be provided, which is characterized in that squeaking noises that are generated when members rub against each other is remarkably reduced, that an effect of reducing squeaking noises is maintained without deterioration even when placed under high temperature for a long time, and that impact resistance and molded appearance are superior.

Disclosed are compositions comprising a copolymer comprising copolymerized units of ethylene and copolymerized units of a comonomer providing an amine-reactive site combined with a short chain polymer having from about 5 to 50 repeat units and containing one primary amine active amine site, which have a combination of enhanced gas transmission and absorption properties and antifog properties. Films and laminate structures comprising these compositions have excellent gas (e.g. oxygen, water vapor, etc.) absorption and transmission and antifogging properties.

A polyphenylene ether resin of Formula (1) and a resin composition including the polyphenylene ether resin of Formula (1) are provided. The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and excellent height of impact whitening, in addition to the desirable properties such as fully dissolvable varnish, absence of branch-like pattern or dry board on laminate appearance, high glass transition temperature, low dissipation factor, low Z-axis ratio of thermal expansion and high copper foil peeling strength.

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The object of the present invention is to provide an epoxy resin composition for casting having excellent heat resistance and thermal shock resistance. The epoxy resin composition for casting of the present invention contains a silica powder (A), a liquid epoxy resin (B), a polyether polyol (C), a liquid acid anhydride (D), a curing accelerator (E), and a core shell polymer (F).

A flexible display apparatus includes a display unit, a first adhesive film on the display unit, an optical film on the first adhesive film, a second adhesive film on the optical film, and a window film on the second adhesive film, and the second adhesive film has a higher modulus than the first adhesive film at −20° C. to 25° C.

A flexible display apparatus includes a display unit, a first adhesive film on the display unit, an optical film on the first adhesive film, a second adhesive film on the optical film, and a window film on the second adhesive film, and the second adhesive film has a higher modulus than the first adhesive film at −20° C. to 25° C.