A method of manufacturing copper powder according to the present invention includes: a first step of reducing copper particles in water by using at least one compound selected from the group consisting of potassium borohydride, sodiumborohydride, and lithium borohydride; after the first step, a second step of washing with water; a third step of washing copper powder obtained in the second step with at least one compound selected from the group consisting of ether compounds and alcohol compounds; and a fourth step of bringing the copper powder obtained in the third step into contact with an organic acid solution, in which at least one compound selected from the group consisting of ether compounds and alcohol compounds is used as a solvent.

The present disclosure relates to multi-compound fiber reinforced composites and methods of making the same using frontal polymerization and targeted photosensitizer additives. In various aspects, the method may include disposing one or more layers in a mold cavity, where each of the one or more layers includes a fiber material and a first compound. The method may further includes disposing a second compound in the mold cavity, where the second compound includes a photosensitizer material. Further still, the method may include initiating photopolymerization of the photosensitizer using an ultraviolet light source, removing ultraviolet light source, and/or completing polymerization of the one or more layers so as to form the fiber-reinforced composite.

The present disclosure relates to multi-compound fiber reinforced composites and methods of making the same using frontal polymerization and targeted photosensitizer additives. In various aspects, the method may include disposing one or more layers in a mold cavity, where each of the one or more layers includes a fiber material and a first compound. The method may further includes disposing a second compound in the mold cavity, where the second compound includes a photosensitizer material. Further still, the method may include initiating photopolymerization of the photosensitizer using an ultraviolet light source, removing ultraviolet light source, and/or completing polymerization of the one or more layers so as to form the fiber-reinforced composite.

Certain embodiments of the invention described herein comprise a composition of matter, and method for preparing the same, which provide the benefits of pre-reaction molecular configuration favoring high liquidity properties, and post-reaction configuration that favors mechanical strength, stiffness, and properties associated with high viscous and/or solid-state materials. In some embodiments, the composition of matter can comprise relaxing photo-isomerizable fragments, of which a fraction can be transformed from trans to cis configurations upon exposure to a photon source. In some embodiments, the composition of matter further comprises thermally reactive fragments, of which can enable thermal solidification of a mixture upon exposure to elevated temperatures. In some embodiments, a composition of matter can be combined with reinforcing additives to form a prepreg combination.

Certain embodiments of the invention described herein comprise a composition of matter, and method for preparing the same, which provide the benefits of pre-reaction molecular configuration favoring high liquidity properties, and post-reaction configuration that favors mechanical strength, stiffness, and properties associated with high viscous and/or solid-state materials. In some embodiments, the composition of matter can comprise relaxing photo-isomerizable fragments, of which a fraction can be transformed from trans to cis configurations upon exposure to a photon source. In some embodiments, the composition of matter further comprises thermally reactive fragments, of which can enable thermal solidification of a mixture upon exposure to elevated temperatures. In some embodiments, a composition of matter can be combined with reinforcing additives to form a prepreg combination.

Disclosed herein are tire tread rubber compositions comprising a specified elastomer component, reinforcing silica filler, a specified hydrocarbon resin, a cure package, and optionally oil. The elastomer component includes styrene-butadiene rubber and polybutadiene.

Disclosed herein are tire tread rubber compositions comprising a specified elastomer component, reinforcing silica filler, a specified hydrocarbon resin, a cure package, and optionally oil. The elastomer component includes styrene-butadiene rubber and polybutadiene.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

The present invention relates to pigments which comprise niobium-doped titanium dioxide as well as a layer encapsulating the niobium-doped titanium dioxide, to polymer materials containing same and to the use of said pigments as laser absorbing additive in products comprising at least one polymer material and said encapsulated niobium-doped titanium dioxide containing pigments.