Patent classifications
C08L59/00
POLYACETAL RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME
The purpose of the present invention is to provide: a polyacetal resin composition which is excellent in terms of impact resistance, thermal stability, and releasability; and a process for producing the polyacetal resin composition. The polyacetal resin composition comprises 100 parts by mass of a polyacetal resin (A) in which the molecular chain has neither a crosslink nor a branch therein, 0.01-10.0 parts by mass of an antioxidant (B), 0.01-5.0 parts by mass of a nitrogenous compound (C), and 0.05-1.0 parts by mass of a fatty acid amide (D), and has a melt index, as measured in accordance with ISO 1133, of 0.5-1.5 g/10 min. A process for producing the polyacetal resin compositions is also provided.
POLYACETAL RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME
The purpose of the present invention is to provide: a polyacetal resin composition which is excellent in terms of impact resistance, thermal stability, and releasability; and a process for producing the polyacetal resin composition. The polyacetal resin composition comprises 100 parts by mass of a polyacetal resin (A) in which the molecular chain has neither a crosslink nor a branch therein, 0.01-10.0 parts by mass of an antioxidant (B), 0.01-5.0 parts by mass of a nitrogenous compound (C), and 0.05-1.0 parts by mass of a fatty acid amide (D), and has a melt index, as measured in accordance with ISO 1133, of 0.5-1.5 g/10 min. A process for producing the polyacetal resin compositions is also provided.
Dielectric resin composition for film capacitor and film capacitor
A dielectric resin composition for a film capacitor is a mixture containing an organic material A and an organic material B. The organic material A includes at least two kinds of organic material components A1, A2, . . . having reactive groups (for example, OH, NCO) that cross-link each other. The organic material B does not have a reactive site capable of reacting with the organic material A and has a dielectric loss tan of 0.3% or less at a temperature of 125 C. The mixture has a glass transition temperature of 130 C. or higher and preferably 280 C. or lower.
Dielectric resin composition for film capacitor and film capacitor
A dielectric resin composition for a film capacitor is a mixture containing an organic material A and an organic material B. The organic material A includes at least two kinds of organic material components A1, A2, . . . having reactive groups (for example, OH, NCO) that cross-link each other. The organic material B does not have a reactive site capable of reacting with the organic material A and has a dielectric loss tan of 0.3% or less at a temperature of 125 C. The mixture has a glass transition temperature of 130 C. or higher and preferably 280 C. or lower.
POLYACETAL RESIN COMPOSITION AND SLIDING MEMBER
A polyacetal resin composition includes: in addition to a polyacetal resin as a principal component, 1.5 to 7% by mass of an ethylene-propylene-diene rubber; 0.5 to 3% by mass of a saponified ethylene-vinyl acetate copolymer; and 0.05 to 0.3% by mass of an ethylene--olefin copolymer.
POLYACETAL RESIN COMPOSITION AND SLIDING MEMBER
A polyacetal resin composition includes: in addition to a polyacetal resin as a principal component, 1.5 to 7% by mass of an ethylene-propylene-diene rubber; 0.5 to 3% by mass of a saponified ethylene-vinyl acetate copolymer; and 0.05 to 0.3% by mass of an ethylene--olefin copolymer.
COMPOSITIONS COMPRISING AMORPHOUS POLYHYDROXYALKANOATE AND USE THEREOF
The present disclosure relates to a polymer composition having an amorphous polyhydroxyalkanoate (PHA) and a polymer, and use thereof.
COMPOSITIONS COMPRISING AMORPHOUS POLYHYDROXYALKANOATE AND USE THEREOF
The present disclosure relates to a polymer composition having an amorphous polyhydroxyalkanoate (PHA) and a polymer, and use thereof.
SOLE STRUCTURES INCLUDING POLYOLEFIN PLATES AND ARTICLES OF FOOTWEAR FORMED THEREFROM
A variety of plates for footwear are provided including a polyolefin resin. Sole structures and articles of footwear formed therefrom are also provided. Methods of making the polyolefin resin compositions, plates, sole structures, and articles of footwear are also provided. In some aspects, the polyolefin resin composition includes an effective amount of a polymeric resin modifier. The effective amount can be an amount effective to allow the resin composition to pass a flex test, and in particular to pass a flex test without significant change in abrasion loss. In some aspects, the resin composition also includes a clarifying agent to improve optical clarity of the plate. In some aspects, the plates include a textile disposed on one or both of a first side and the second side of the plate. The textile can provide for improved bonding of the plate to other components such as a chassis or an upper.
SOLE STRUCTURES INCLUDING POLYOLEFIN PLATES AND ARTICLES OF FOOTWEAR FORMED THEREFROM
A variety of plates for footwear are provided including a polyolefin resin. Sole structures and articles of footwear formed therefrom are also provided. Methods of making the polyolefin resin compositions, plates, sole structures, and articles of footwear are also provided. In some aspects, the polyolefin resin composition includes an effective amount of a polymeric resin modifier. The effective amount can be an amount effective to allow the resin composition to pass a flex test, and in particular to pass a flex test without significant change in abrasion loss. In some aspects, the resin composition also includes a clarifying agent to improve optical clarity of the plate. In some aspects, the plates include a textile disposed on one or both of a first side and the second side of the plate. The textile can provide for improved bonding of the plate to other components such as a chassis or an upper.