A polyimide composition, comprising a functionalized polyimide prepared from a substituted or unsubstituted C.sub.4-40 bisanhydride; a substituted or unsubstituted C.sub.1-40 organic diamine; and optionally an organic compound comprising at least two functional groups per molecule, wherein a first functional group is reactive with an anhydride group, an amine group, or a combination thereof, and the first functional group is different from a second functional group, wherein the functionalized polyimide comprises a reactive end group of the formula (C.sub.1-40 hydrocarbylene)-NH.sub.2, (C.sub.1-40 hydrocarbylene)-OH, (C.sub.1-40 hydrocarbylene)-SH, (C.sub.4-40 hydrocarbylene)-G, or a combination thereof, wherein G is an anhydride group, a carboxylic acid, a carboxylic ester, or a combination thereof, wherein the functionalized polyimide has a total reactive end group concentration of 50-1,500 μeq/g of the functionalized polyimide, and wherein the polyimide composition has 0.05-1,000 ppm of residual organic diamine, wherein the functionalized polyimide is obtained by precipitation from a solution using an organic anti-solvent or by devolatilization.

A polyimide composition, comprising a functionalized polyimide prepared from a substituted or unsubstituted C.sub.4-40 bisanhydride; a substituted or unsubstituted C.sub.1-40 organic diamine; and optionally an organic compound comprising at least two functional groups per molecule, wherein a first functional group is reactive with an anhydride group, an amine group, or a combination thereof, and the first functional group is different from a second functional group, wherein the functionalized polyimide comprises a reactive end group of the formula (C.sub.1-40 hydrocarbylene)-NH.sub.2, (C.sub.1-40 hydrocarbylene)-OH, (C.sub.1-40 hydrocarbylene)-SH, (C.sub.4-40 hydrocarbylene)-G, or a combination thereof, wherein G is an anhydride group, a carboxylic acid, a carboxylic ester, or a combination thereof, wherein the functionalized polyimide has a total reactive end group concentration of 50-1,500 μeq/g of the functionalized polyimide, and wherein the polyimide composition has 0.05-1,000 ppm of residual organic diamine, wherein the functionalized polyimide is obtained by precipitation from a solution using an organic anti-solvent or by devolatilization.

A coating solution comprising an organic solvent solution containing polyol-crosslinkable fluororubber, a polyol vulcanizing agent, and N-phenyl-3-aminopropyltrialkoxysilane, preferably a coating solution further containing an epoxy resin in addition thereto, and a fluororubber metal laminated sheet formed by applying the above coating solution to a metal sheet, followed by vulcanization. The coating solution can not only impart stability over time to the fluororubber paste, but also improve the interlayer adhesion and abrasion resistance of the fluororubber metal laminated sheet. Therefore, when it is used as a cylinder head gasket, it is possible to cope with the reduction in rigidity due to the increase in combustion pressure of the engine, and with weight saving. As a result, it will greatly contribute to the improvement of fuel efficiency of automobiles.

A coating solution comprising an organic solvent solution containing polyol-crosslinkable fluororubber, a polyol vulcanizing agent, and N-phenyl-3-aminopropyltrialkoxysilane, preferably a coating solution further containing an epoxy resin in addition thereto, and a fluororubber metal laminated sheet formed by applying the above coating solution to a metal sheet, followed by vulcanization. The coating solution can not only impart stability over time to the fluororubber paste, but also improve the interlayer adhesion and abrasion resistance of the fluororubber metal laminated sheet. Therefore, when it is used as a cylinder head gasket, it is possible to cope with the reduction in rigidity due to the increase in combustion pressure of the engine, and with weight saving. As a result, it will greatly contribute to the improvement of fuel efficiency of automobiles.

An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.

An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.

A resin composition, comprising a thermoplastic elastomer and an epoxy resin as resins, and zinc cyanurate.

A resin composition, comprising a thermoplastic elastomer and an epoxy resin as resins, and zinc cyanurate.

The present invention relates to an epoxy resin system having a phase separation structure, a preparation method therefor and an application thereof. After mixing an epoxy resin, an amine curing agent and an epoxy diluent, pre-polymerization is carried out to obtain a prepolymer 1; or, after mixing an epoxy resin and an amine curing agent, pre-polymerization is carried out to obtain a prepolymer 1; after mixing an epoxy resin, an anhydride curing agent and an accelerator, polymerization is carried out to obtain a prepolymer 2; and after the prepolymer 1 and the prepolymer 2 are mixed, curing is carried out to obtain an epoxy resin system having a phase separation structure. The present invention controls the formation of a thermosetting epoxy resin system having a phase separation structure by means of preparing different epoxy resin pre-polymerization systems and using an interface reaction between the different pre-polymerization systems.

The present invention relates to an epoxy resin system having a phase separation structure, a preparation method therefor and an application thereof. After mixing an epoxy resin, an amine curing agent and an epoxy diluent, pre-polymerization is carried out to obtain a prepolymer 1; or, after mixing an epoxy resin and an amine curing agent, pre-polymerization is carried out to obtain a prepolymer 1; after mixing an epoxy resin, an anhydride curing agent and an accelerator, polymerization is carried out to obtain a prepolymer 2; and after the prepolymer 1 and the prepolymer 2 are mixed, curing is carried out to obtain an epoxy resin system having a phase separation structure. The present invention controls the formation of a thermosetting epoxy resin system having a phase separation structure by means of preparing different epoxy resin pre-polymerization systems and using an interface reaction between the different pre-polymerization systems.