An anti-icing honeycomb core composite manufactured by forming an electromagnetic wave absorption layer by using dielectric fiber, molding the electromagnetic wave absorption layer into a honeycomb core structure by using a molded part including a first base, a second base, and an inner block, hardening the honeycomb core structure, and removing the molded part. The molding step includes first stacking, on the first base including a plurality of grooves in which the inner blocks each having a hexagonal column shape are able to be seated, a plurality of the inner blocks and a plurality of the electromagnetic wave absorption layers as the honeycomb core structure so that the electromagnetic wave absorption layer is disposed between the plurality of inner blocks, and second stacking covering the inner blocks and the electromagnetic wave absorption layers stacked on the first base with the second base having the same shape as the first base.

A curable epoxy composition suitable for surface application, comprising one or more epoxy resin (s); 2, 4, 6-tribromophenyl end-capped tetrabromobisphenol A epoxy-based flame retardant; and phosphorus-containing compound selected from the group consisting of one or more of: ammonium polyphosphate; resorcinol bis (diphenyl phosphate); and liquid alkylated triphenyl phosphate ester. The composition is substantially Sb.sub.2O.sub.3-free.

A curable epoxy composition suitable for surface application, comprising one or more epoxy resin (s); 2, 4, 6-tribromophenyl end-capped tetrabromobisphenol A epoxy-based flame retardant; and phosphorus-containing compound selected from the group consisting of one or more of: ammonium polyphosphate; resorcinol bis (diphenyl phosphate); and liquid alkylated triphenyl phosphate ester. The composition is substantially Sb.sub.2O.sub.3-free.

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.

An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.

An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.

The present invention relates to an ultraviolet curable ink composition including a colorant, an epoxy monomer, an oxetane monomer, a cationic photopolymerization initiator, and a polymerization inhibitor, wherein the weight ratio of epoxy monomer:oxetane monomer is 1:0.5 to 1:6, to a method for forming a bezel pattern by using the same, to a bezel pattern manufactured thereby, and to a display substrate having the same.

The present invention relates to an ultraviolet curable ink composition including a colorant, an epoxy monomer, an oxetane monomer, a cationic photopolymerization initiator, and a polymerization inhibitor, wherein the weight ratio of epoxy monomer:oxetane monomer is 1:0.5 to 1:6, to a method for forming a bezel pattern by using the same, to a bezel pattern manufactured thereby, and to a display substrate having the same.