A reactive resin component contains at least one radically curable unsaturated compound and at least one silanized filler. The proportion of all inorganic solids in the reactive resin component is at least 60 wt. % and the proportion of the at least one silanized filler, which has a grain diameter of 4 μm or smaller, is 0.5 to 60 wt. %, based on the reactive resin component. The reactive resin component can be used in a reactive resin system.

A reactive resin component contains at least one radically curable unsaturated compound and at least one silanized filler. The proportion of all inorganic solids in the reactive resin component is at least 60 wt. % and the proportion of the at least one silanized filler, which has a grain diameter of 4 μm or smaller, is 0.5 to 60 wt. %, based on the reactive resin component. The reactive resin component can be used in a reactive resin system.

Disclosed is a polyurethane-modified epoxy resin composition capable of satisfying both high toughness and high elasticity. This epoxy resin composition is an epoxy resin composition, in which (A) a polyurethane-modified epoxy resin having a polycarbonate structure in the molecule and having a urethane modification rate of 20 to 60% by weight, (B) a non-polyurethane-modified epoxy resin that is liquid at 30° C., (C) a solid epoxy resin having a glass transition temperature or melting point of 50° C. or higher and (D) an amine-based curing agent that is dicyandiamide or a derivative thereof are as essential components, and 20.0 to 50.0% by weight of (A), 0.1 to 50.0% by weight of (B) and 0.1 to 50.0% by weight of (C) are contained relative to the total of (A) to (D).

Disclosed is a polyurethane-modified epoxy resin composition capable of satisfying both high toughness and high elasticity. This epoxy resin composition is an epoxy resin composition, in which (A) a polyurethane-modified epoxy resin having a polycarbonate structure in the molecule and having a urethane modification rate of 20 to 60% by weight, (B) a non-polyurethane-modified epoxy resin that is liquid at 30° C., (C) a solid epoxy resin having a glass transition temperature or melting point of 50° C. or higher and (D) an amine-based curing agent that is dicyandiamide or a derivative thereof are as essential components, and 20.0 to 50.0% by weight of (A), 0.1 to 50.0% by weight of (B) and 0.1 to 50.0% by weight of (C) are contained relative to the total of (A) to (D).

Disclosed is a polyurethane-modified epoxy resin composition capable of satisfying both high toughness and high elasticity. This epoxy resin composition is an epoxy resin composition, in which (A) a polyurethane-modified epoxy resin having a polycarbonate structure in the molecule and having a urethane modification rate of 20 to 60% by weight, (B) a non-polyurethane-modified epoxy resin that is liquid at 30° C., (C) a solid epoxy resin having a glass transition temperature or melting point of 50° C. or higher and (D) an amine-based curing agent that is dicyandiamide or a derivative thereof are as essential components, and 20.0 to 50.0% by weight of (A), 0.1 to 50.0% by weight of (B) and 0.1 to 50.0% by weight of (C) are contained relative to the total of (A) to (D).

The present application relates to a silanized boron nitride composite and a preparation method thereof, and more specifically, to a silanized boron nitride composite, which exhibits excellent mechanical properties and excellent thermal conductivity by realizing excellent dispersibility and improved affinity for epoxy through silane surface treatment, and a preparation method thereof.

The present application relates to a silanized boron nitride composite and a preparation method thereof, and more specifically, to a silanized boron nitride composite, which exhibits excellent mechanical properties and excellent thermal conductivity by realizing excellent dispersibility and improved affinity for epoxy through silane surface treatment, and a preparation method thereof.

Disclosed is a low-temperature curable composition comprising: (A) at least one curable component selected from an epoxy resin and a blocked isocyanate, and (B) an amine-based latent curing agent, wherein a temperature peak of a reaction of the amine-based latent curing agent (B) with a bisphenol A type epoxy resin is between 70° C. and 110° C.

Disclosed is a low-temperature curable composition comprising: (A) at least one curable component selected from an epoxy resin and a blocked isocyanate, and (B) an amine-based latent curing agent, wherein a temperature peak of a reaction of the amine-based latent curing agent (B) with a bisphenol A type epoxy resin is between 70° C. and 110° C.

Provided are two-part curable adhesives that can be suitable for use in industrial bonding applications, including aero-space and automotive bonding. The adhesives include a first part that contains an epoxy resin and a first oligomeric toughener. The adhesives further include a second part comprising a curative that is reactive with the epoxy resin at ambient conditions and a second oligomeric toughener. The first and second oligomeric tougheners are immiscible with each other at ambient conditions. Advantageously, the adhesives when cured can simultaneously display both high shear strength and high peel performance at elevated temperatures.