A method of preparing a fiberboard is described herein, the method comprising treating a particulate plant-derived material with plasma to obtain a plasma-treated particulate material, and compressing the plasma-treated particulate material. Further described herein is a fiberboard comprising a particulate plant-derived material, and being substantially devoid of an adhesive, or substantially devoid of an adhesive which is urea-formaldehyde resin, melamine-formaldehyde resin, polyurethane resin, epoxy resin, and/or phenol formaldehyde resin. The fiberboard may be characterized by a density of less than 500 kg/m.sup.3, a particulate plant-derived material particle area of at least 1 mm.sup.2, and/or a particulate plant-derived material water contact angle of no more than 20°.

A method of preparing a fiberboard is described herein, the method comprising treating a particulate plant-derived material with plasma to obtain a plasma-treated particulate material, and compressing the plasma-treated particulate material. Further described herein is a fiberboard comprising a particulate plant-derived material, and being substantially devoid of an adhesive, or substantially devoid of an adhesive which is urea-formaldehyde resin, melamine-formaldehyde resin, polyurethane resin, epoxy resin, and/or phenol formaldehyde resin. The fiberboard may be characterized by a density of less than 500 kg/m.sup.3, a particulate plant-derived material particle area of at least 1 mm.sup.2, and/or a particulate plant-derived material water contact angle of no more than 20°.

The present invention relates to a resin composition containing: an epoxy resin; and an aromatic polysulfone resin containing an amino group-containing aromatic polysulfone having an amino group at at least one terminal of a main chain of a polymer chain, in which a number average molecular weight of the aromatic polysulfone resin is 10,000 or less.

The present invention relates to a resin composition containing: an epoxy resin; and an aromatic polysulfone resin containing an amino group-containing aromatic polysulfone having an amino group at at least one terminal of a main chain of a polymer chain, in which a number average molecular weight of the aromatic polysulfone resin is 10,000 or less.

The present invention relates to a resin composition containing: an epoxy resin; and an aromatic polysulfone resin containing an amino group-containing aromatic polysulfone having an amino group at at least one terminal of a main chain of a polymer chain, in which a number average molecular weight of the aromatic polysulfone resin is 10,000 or less.

Two-part curable compositions capable of demonstrating substantially no phase separation at room temperature over time and improved adhesion strength retention at elevated temperature conditions.

Two-part curable compositions capable of demonstrating substantially no phase separation at room temperature over time and improved adhesion strength retention at elevated temperature conditions.

A first object of the present invention is to provide a composition having excellent fluidity and capable of forming a cured substance having excellent magnetic properties and excellent filling suitability. A second object of the present invention is to provide a magnetic particle-containing cured substance formed of the composition. A third object of the present invention is to provide a magnetic particle-introduced substrate and an electronic material that contain the magnetic particle-containing cured substance.

The composition according to an embodiment of the present invention is a composition containing magnetic particles, one or more components selected from the group consisting of a resin and a resin precursor, a solvent, in which a content of magnetic particles having a primary particle diameter of 4 m or more is 25% by mass or less with respect to a total mass of the magnetic particles, a content of the magnetic particles is 91% by mass or more with respect to a total solid content of the composition, and a content of the solvent is 3% to 24% by mass with respect to a total mass of the composition.

Boron nitride nanotube (BNNT)-polymide (PI) and poly-xylene (PX) nano-composites, in the form of thin films, powder, and mats may be useful as layers in electronic circuits, windows, membranes, and coatings. The processes described chemical vapor deposition (CVD) processes for coating the BNNTs with polymeric material, specifically PI and PX. The processes rely on surface adsorption of polymeric material onto BNNTs as to modify their surface properties or create a uniform dispersion of polymer around nanotubes. The resulting functionalized BNNTs have numerous valuable applications.

Boron nitride nanotube (BNNT)-polymide (PI) and poly-xylene (PX) nano-composites, in the form of thin films, powder, and mats may be useful as layers in electronic circuits, windows, membranes, and coatings. The processes described chemical vapor deposition (CVD) processes for coating the BNNTs with polymeric material, specifically PI and PX. The processes rely on surface adsorption of polymeric material onto BNNTs as to modify their surface properties or create a uniform dispersion of polymer around nanotubes. The resulting functionalized BNNTs have numerous valuable applications.