Provided are a photocurable resin composition that can be suitably used for an optical three-dimensional shaping method, and a cured product obtained by photocuring the composition and a three-dimensional shaped object including the cured product. The photocurable resin composition contains a compound represented by the formula (1) and a compound containing two or more epoxy groups. ##STR00001##

Provided are a photocurable resin composition that can be suitably used for an optical three-dimensional shaping method, and a cured product obtained by photocuring the composition and a three-dimensional shaped object including the cured product. The photocurable resin composition contains a compound represented by the formula (1) and a compound containing two or more epoxy groups. ##STR00001##

Provided are a photocurable resin composition that can be suitably used for an optical three-dimensional shaping method, and a cured product obtained by photocuring the composition and a three-dimensional shaped object including the cured product. The photocurable resin composition contains a compound represented by the formula (1) and a compound containing two or more epoxy groups. ##STR00001##

Disclosed are a resin composite having excellent soundproofing and mechanical properties, and a molded product including the same. The resin composite may include a resin composition, porous particles and a reinforcing material, and the molded product including the same include no volatile organic compounds (VOCs). As consequence, displeasure caused by generation of the VOCs and exhaust of toxic gas during combustion may be reduced thereby being environmentally friendly. Further, the resin composite and the molded product including the same demonstrate sufficient mechanical strength and may thus be directly applied to a housing or the like of an apparatus which generates noise without introduction of any additional soundproofing material. For example, the resin composite and the molded product may include a specific content of the porous particles having pores having a specific size to secure an appropriate volume fraction and may thus efficiently and economically block noise transmission.

Disclosed are a resin composite having excellent soundproofing and mechanical properties, and a molded product including the same. The resin composite may include a resin composition, porous particles and a reinforcing material, and the molded product including the same include no volatile organic compounds (VOCs). As consequence, displeasure caused by generation of the VOCs and exhaust of toxic gas during combustion may be reduced thereby being environmentally friendly. Further, the resin composite and the molded product including the same demonstrate sufficient mechanical strength and may thus be directly applied to a housing or the like of an apparatus which generates noise without introduction of any additional soundproofing material. For example, the resin composite and the molded product may include a specific content of the porous particles having pores having a specific size to secure an appropriate volume fraction and may thus efficiently and economically block noise transmission.

A multilayer ceramic capacitor includes a ceramic base body including ceramic layers and internal electrode layers, which are stacked on each other, and a pair of external electrodes provided on the end surfaces of the ceramic base body and electrically connected to the internal electrode layers. Each of the external electrodes includes an underlying electrode layer and a resin external electrode layer stacked on the underlying electrode layer. The resin external electrode layer includes a thermosetting resin, a metal powder, and an alkyl-based silane coupling agent.

A multilayer ceramic capacitor includes a ceramic base body including ceramic layers and internal electrode layers, which are stacked on each other, and a pair of external electrodes provided on the end surfaces of the ceramic base body and electrically connected to the internal electrode layers. Each of the external electrodes includes an underlying electrode layer and a resin external electrode layer stacked on the underlying electrode layer. The resin external electrode layer includes a thermosetting resin, a metal powder, and an alkyl-based silane coupling agent.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

The present invention relates to fiber composite plastic (11, 13) comprising a polymer (40, 41) and at least one textile (50), which has at least one palpably inhomogeneous surface (60, 61) with a textile structure and is entirely surrounded by polymer (40, 41), wherein the fiber composite plastic (11, 13) has at least one palpably inhomogeneous surface (60, 61), wherein inhomogeneities of this fiber composite plastic surface are caused by the textile structure, and a method for producing the fiber composite plastic (11, 13).