Described herein is a 2K clearcoat composition including, Component I including a). at least one resin having carboxylic acid groups with acid value of 50 to 400 mg KOH/g; b). at least one resin having hydroxyl functional groups with a hydroxyl value of 10 to 800 mg KOH/g; c). at least one catalyst; and d). at least one solvent, and Component II including e). at least one epoxy-functional alkoxysilane and/or its oligomer and/or its polymer; and f). at least one crosslinker reactive to hydroxyl groups.

Also described herein are a substrate coated with the dried and cured 2K clearcoat composition and an automotive including the substrate.

Described herein is a 2K clearcoat composition including, Component I including a). at least one resin having carboxylic acid groups with acid value of 50 to 400 mg KOH/g; b). at least one resin having hydroxyl functional groups with a hydroxyl value of 10 to 800 mg KOH/g; c). at least one catalyst; and d). at least one solvent, and Component II including e). at least one epoxy-functional alkoxysilane and/or its oligomer and/or its polymer; and f). at least one crosslinker reactive to hydroxyl groups.

Also described herein are a substrate coated with the dried and cured 2K clearcoat composition and an automotive including the substrate.

A polymerization process includes contacting an olefin or a mixture of the olefin and one or more copolymerizable comonomers under polymerization conditions with a catalyst composition and forming a polymer with a total ash content of less than 15 ppm. The catalyst composition includes one or more polymerization catalysts; and a mixed external electron donor comprising a selectivity control agent comprising at least one silicon-containing compound containing at least one C1-C10 alkoxy group bonded to a silicon atom.

A polymerization process includes contacting an olefin or a mixture of the olefin and one or more copolymerizable comonomers under polymerization conditions with a catalyst composition and forming a polymer with a total ash content of less than 15 ppm. The catalyst composition includes one or more polymerization catalysts; and a mixed external electron donor comprising a selectivity control agent comprising at least one silicon-containing compound containing at least one C1-C10 alkoxy group bonded to a silicon atom.

The invention provides a stabilising composition for a polyol and/or a polyurethane, comprising: a) a first derivatised phenolic antioxidant having a molecular weight of at least about 400 g/mol and a melting point of less than about 100° C.; b) a second derivatised phenolic antioxidant having lower steric hindrance than the first derivatised phenolic antioxidant, which is a solid at ambient conditions; and c) a secondary antioxidant comprising a phosphite and/or a thioester,
and also disclosed is a fire retardant blend comprising the stabilising composition and a fire retardant.

The invention provides a stabilising composition for a polyol and/or a polyurethane, comprising: a) a first derivatised phenolic antioxidant having a molecular weight of at least about 400 g/mol and a melting point of less than about 100° C.; b) a second derivatised phenolic antioxidant having lower steric hindrance than the first derivatised phenolic antioxidant, which is a solid at ambient conditions; and c) a secondary antioxidant comprising a phosphite and/or a thioester,
and also disclosed is a fire retardant blend comprising the stabilising composition and a fire retardant.

A thermoplastic resin composition having good formability and low dielectric characteristics that have not been achieved by conventional liquid crystal polymer resin compositions, while maintaining excellent heat resistance and flame retardancy of liquid crystal polymers, and usable for information and communication devices used in a high frequency range is provided. A thermoplastic resin composition contains liquid crystal polymers (A) and a modified polyolefin (B) having a polar group. The liquid crystal polymer (A) contains a first liquid crystal polymer (a-1) that has a melting point of less than 300° C. and a second liquid crystal polymer (a-2) that has a melting point of 300° C. or more. It is preferable for the thermoplastic resin composition that the phase structure is a sea-island structure or a bicontinuous structure, and the second liquid crystal polymer (a-2) is contained at least in a sea phase or a continuous phase.

A thermoplastic resin composition having good formability and low dielectric characteristics that have not been achieved by conventional liquid crystal polymer resin compositions, while maintaining excellent heat resistance and flame retardancy of liquid crystal polymers, and usable for information and communication devices used in a high frequency range is provided. A thermoplastic resin composition contains liquid crystal polymers (A) and a modified polyolefin (B) having a polar group. The liquid crystal polymer (A) contains a first liquid crystal polymer (a-1) that has a melting point of less than 300° C. and a second liquid crystal polymer (a-2) that has a melting point of 300° C. or more. It is preferable for the thermoplastic resin composition that the phase structure is a sea-island structure or a bicontinuous structure, and the second liquid crystal polymer (a-2) is contained at least in a sea phase or a continuous phase.

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.