C08L71/00

COMPOSITION BASED ON POLY (ARYLENE ETHER KETONE) HAVING IMPROVED PROPERTIES
20230085897 · 2023-03-23 · ·

A composition based on poly(ether ether ketone) (PEEK) including poly(ether ketone ketone) (PEKK), wherein the poly(ether ketone ketone) (PEKK) includes a mixture of terephthalic and isophthalic units, the percentage by weight of terephthalic units, with respect to the sum of the terephthalic and isophthalic units, being between 55 and 85%, limits included, and preferably between 55 and 70%, the composition including between 1 and 40%, limits included, preferably between 5 and 40% and more preferably still between 10 and 30% by weight of PEKK, with respect to the total weight of the composition.

EPOXY COMPOSITION CONTAINING COPOLYAMIDE AND BLOCK COPOLYMER WITH POLYAMIDE AND POLYETHER BLOCKS
20230089519 · 2023-03-23 ·

A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.

EPOXY COMPOSITION CONTAINING COPOLYAMIDE AND BLOCK COPOLYMER WITH POLYAMIDE AND POLYETHER BLOCKS
20230089519 · 2023-03-23 ·

A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.

EPOXY COMPOSITION CONTAINING COPOLYAMIDE AND BLOCK COPOLYMER WITH POLYAMIDE AND POLYETHER BLOCKS
20230089519 · 2023-03-23 ·

A composition that toughens and impact modifies epoxy resin based compositions comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks. The disclosure also relates to epoxy resin compositions containing the composition comprising one or more co-polyamides and one or more block copolymers with polyamide and polyether blocks and films, adhesives, foamable compositions and foamed compositions containing such a composition.

THERMOPLASTIC POLYMER COMPOSITION
20220348742 · 2022-11-03 ·

The invention pertains to a polymer composition comprising a thermoplastic polymer, a glass fiber, and a hollow glass bead, wherein the ratio of the concentration of the hollow glass bead to the total concentration of the glass fiber and the hollow glass bead ranges from 0.2 to 0.49.

THERMOPLASTIC POLYMER COMPOSITION
20220348742 · 2022-11-03 ·

The invention pertains to a polymer composition comprising a thermoplastic polymer, a glass fiber, and a hollow glass bead, wherein the ratio of the concentration of the hollow glass bead to the total concentration of the glass fiber and the hollow glass bead ranges from 0.2 to 0.49.

Method for manufacturing a product made from polyaryletherketone and corresponding product

A process including: the provision of a semicrystalline or crystallizable composition, having a glass transition temperature T.sub.g, including at least one polyaryletherketone; the provision of a compression forming means including: a mold, the mold having at least one cavity; the preparation of the composition in the molten state in said at least one cavity, the mold having a temperature T.sub.0 at the end of the preparation stage; the compression and the cooling of the composition in the molten state, the mold being cooled from the temperature T.sub.0 down to a final temperature T.sub.fof less than or equal to (T.sub.g+30)° C., to form a compression-formed article; and the removal of the compression-formed article from the mold; in which the composition has a melting point strictly of less than 340° C.

FLUORINE-CONTAINING ALCOHOL COMPOSITE

A fluorine-containing alcohol composite comprising a condensate of a fluorine-containing alcohol represented by the general formula: HO-A-R.sub.F-A-OH [I] (wherein R.sub.F is a group containing a perfluoroalkylene group or a polyfluoroalkylene group having 6 or less carbon atoms and an ether bond, and A is an alkylene group having 1 to 3 carbon atoms), a hydroxyl group-containing polymer, and a zirconium compound. The fluorine-containing alcohol composite, using a fluorine-containing alcohol, does not produce perfluorooctanoic acid and the like when released into the environment and that has a unit easily decomposed into short chain compounds. And also, it exhibits hydrophilic oil repellency.

FLUORINE-CONTAINING ALCOHOL COMPOSITE

A fluorine-containing alcohol composite comprising a condensate of a fluorine-containing alcohol represented by the general formula: HO-A-R.sub.F-A-OH [I] (wherein R.sub.F is a group containing a perfluoroalkylene group or a polyfluoroalkylene group having 6 or less carbon atoms and an ether bond, and A is an alkylene group having 1 to 3 carbon atoms), a hydroxyl group-containing polymer, and a zirconium compound. The fluorine-containing alcohol composite, using a fluorine-containing alcohol, does not produce perfluorooctanoic acid and the like when released into the environment and that has a unit easily decomposed into short chain compounds. And also, it exhibits hydrophilic oil repellency.

UV CURABLE ADHESIVE COMPOSITION AND ADHESIVE FILM, ADHESIVE TAPE, AND BONDING COMPONENT COMPRISING THEREOF
20220340793 · 2022-10-27 ·

Disclosed are a UV curable adhesive composition, an adhesive tape comprising the UV curable adhesive composition, an adhesive film formed by UV curing of the adhesive composition, and a corresponding bonding member. The UV curable adhesive composition and the adhesive tape comprising the UV curable adhesive composition have a hybrid system of reactive polyacrylate/epoxy resin/core-shell rubber particles/hydroxy-containing compound, wherein a cationic photoinitiator is used to initiate curing of the epoxy a resin.