C08L71/00

CURABLE COMPOSITION

A curable composition contains (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and a hydrolyzable group, (B) a compound (other than (A)) having at least two OR.sup.2 groups bonded to an Si atom (in the formula, R.sup.2 each independently are a hydrogen atom or a monovalent organic group at each occurrence) or a partial hydrolysis condensate thereof, (C) a condensation catalyst, and (D) surface-treated silica.

CURABLE COMPOSITION

A curable composition contains (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and a hydrolyzable group, (B) a compound (other than (A)) having at least two OR.sup.2 groups bonded to an Si atom (in the formula, R.sup.2 each independently are a hydrogen atom or a monovalent organic group at each occurrence) or a partial hydrolysis condensate thereof, (C) a condensation catalyst, and (D) surface-treated silica.

CURABLE COMPOSITION

A curable composition includes: (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and hydrolyzable groups; (B) a compound having at least two OR.sup.2 groups (in the formula, R.sup.2 is independently a hydrogen atom or a monovalent organic group at each occurrence) bonded to an Si atom (provided that (A) and (D) are excluded) or a partially hydrolyzed condensate thereof; (C) a condensation catalyst; and (D) a compound containing two or more alkoxysilyl groups in one molecule or a partially hydrolyzed condensate thereof (provided that (A) is excluded), with the linking group between the alkoxysilyl groups being a group other than that selected from the group consisting of an —O— group and a group having a siloxane bond.

CURABLE COMPOSITION

A curable composition includes: (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and hydrolyzable groups; (B) a compound having at least two OR.sup.2 groups (in the formula, R.sup.2 is independently a hydrogen atom or a monovalent organic group at each occurrence) bonded to an Si atom (provided that (A) and (D) are excluded) or a partially hydrolyzed condensate thereof; (C) a condensation catalyst; and (D) a compound containing two or more alkoxysilyl groups in one molecule or a partially hydrolyzed condensate thereof (provided that (A) is excluded), with the linking group between the alkoxysilyl groups being a group other than that selected from the group consisting of an —O— group and a group having a siloxane bond.

COMPOSITION, THERMALLY CONDUCTIVE SHEET, AND DEVICE WITH THERMALLY CONDUCTIVE SHEET

An object of the present invention is to provide a composition capable of forming a thermally conductive sheet having excellent peel strength. In addition, another object of the present invention is to provide a thermally conductive sheet formed of the composition and a device with a thermally conductive sheet.

The composition of the present invention contains a disk-like compound, a high-molecular-weight compound which is at least one selected from the group consisting of a thermoplastic resin and rubber, and inorganic particles.

Curable composition
11629267 · 2023-04-18 · ·

A curable composition including a perfluoro(poly)ether group-containing silane compound having two or more Si atoms each bonding to at least one selected from a hydroxyl and hydrolyzable group, and a group represented by: —(OC.sub.6F.sub.12).sub.a—(OC.sub.5F.sub.10).sub.b—(OC.sub.4F.sub.8).sub.c—(OC.sub.3X.sup.10.sub.6).sub.d—(OC.sub.2F.sub.4).sub.e—(OCF.sub.2).sub.f—, wherein a, b, c and d are each independently an integer of 0 to 30, e and f are each independently an integer of 1 to 200, the sum of a, b, c, d, e and f is 5 or more, the occurrence order of the respective repeating units with the subscript a, b, c, d, e or f is not limited, a ratio of e to f is 1.0 or more, and each X.sup.10 is independently a hydrogen, fluorine or chlorine atom; an organosilicon compound having at least two —O—R.sup.g3(s) each bonding to a Si atom, wherein each R.sup.g3, at each occurrence, is independently a hydrogen atom or a monovalent organic group; and a catalyst.

Curable composition
11629267 · 2023-04-18 · ·

A curable composition including a perfluoro(poly)ether group-containing silane compound having two or more Si atoms each bonding to at least one selected from a hydroxyl and hydrolyzable group, and a group represented by: —(OC.sub.6F.sub.12).sub.a—(OC.sub.5F.sub.10).sub.b—(OC.sub.4F.sub.8).sub.c—(OC.sub.3X.sup.10.sub.6).sub.d—(OC.sub.2F.sub.4).sub.e—(OCF.sub.2).sub.f—, wherein a, b, c and d are each independently an integer of 0 to 30, e and f are each independently an integer of 1 to 200, the sum of a, b, c, d, e and f is 5 or more, the occurrence order of the respective repeating units with the subscript a, b, c, d, e or f is not limited, a ratio of e to f is 1.0 or more, and each X.sup.10 is independently a hydrogen, fluorine or chlorine atom; an organosilicon compound having at least two —O—R.sup.g3(s) each bonding to a Si atom, wherein each R.sup.g3, at each occurrence, is independently a hydrogen atom or a monovalent organic group; and a catalyst.

Curable composition
11629267 · 2023-04-18 · ·

A curable composition including a perfluoro(poly)ether group-containing silane compound having two or more Si atoms each bonding to at least one selected from a hydroxyl and hydrolyzable group, and a group represented by: —(OC.sub.6F.sub.12).sub.a—(OC.sub.5F.sub.10).sub.b—(OC.sub.4F.sub.8).sub.c—(OC.sub.3X.sup.10.sub.6).sub.d—(OC.sub.2F.sub.4).sub.e—(OCF.sub.2).sub.f—, wherein a, b, c and d are each independently an integer of 0 to 30, e and f are each independently an integer of 1 to 200, the sum of a, b, c, d, e and f is 5 or more, the occurrence order of the respective repeating units with the subscript a, b, c, d, e or f is not limited, a ratio of e to f is 1.0 or more, and each X.sup.10 is independently a hydrogen, fluorine or chlorine atom; an organosilicon compound having at least two —O—R.sup.g3(s) each bonding to a Si atom, wherein each R.sup.g3, at each occurrence, is independently a hydrogen atom or a monovalent organic group; and a catalyst.

RESIN COMPOSITION AND ARTICLE MADE THEREFROM
20230062178 · 2023-03-02 ·

A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.

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RESIN COMPOSITION AND ARTICLE MADE THEREFROM
20230062178 · 2023-03-02 ·

A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.

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