A thermoplastic composition includes a thermoplastic polymer and a polyaryletherketone polymer in admixture with the thermoplastic polymer.

A thermoplastic composition includes a thermoplastic polymer and a polyaryletherketone polymer in admixture with the thermoplastic polymer.

A thermoplastic composition includes a thermoplastic polymer and electrically conductive particles dispersed in the thermoplastic polymer.

A thermoplastic composition includes a thermoplastic polymer and electrically conductive particles dispersed in the thermoplastic polymer.

A curable fluoropolyether adhesive composition which comprises, each in a specific amount, (A) a straight-chain polyfluoro compound having two or more alkenyl groups per molecule and having a perfluoropolyether structure in the main chain, (B) a fluorine-containing organohydrogen siloxane having, per molecule, a perfluoroalkyl group, a perfluorooxyalkyl group, a perfluoroalkylene group or a perfluorooxyalkylene group and two or more SiH groups, and not having an epoxy group or an alkoxy group directly bonded to a silicon atom, (C) a platinum-group metal catalyst, and (D) a cyclic organopolysiloxane having, per molecule, an SiH group and an epoxy group and/or a trialkoxysilyl group bonded to a silicon atom via a divalent hydrocarbon group optionally containing an oxygen atom, and not having fluorine in molecule, and a cured product of which having a thickness of 2 mm shows a transmittance to light with a wavelength of 500 nm of 80% or higher. This curable fluoropolyether adhesive composition is capable of providing a cured product having good light transmittance and high adhesiveness to glass materials.

A curable fluoropolyether adhesive composition which comprises, each in a specific amount, (A) a straight-chain polyfluoro compound having two or more alkenyl groups per molecule and having a perfluoropolyether structure in the main chain, (B) a fluorine-containing organohydrogen siloxane having, per molecule, a perfluoroalkyl group, a perfluorooxyalkyl group, a perfluoroalkylene group or a perfluorooxyalkylene group and two or more SiH groups, and not having an epoxy group or an alkoxy group directly bonded to a silicon atom, (C) a platinum-group metal catalyst, and (D) a cyclic organopolysiloxane having, per molecule, an SiH group and an epoxy group and/or a trialkoxysilyl group bonded to a silicon atom via a divalent hydrocarbon group optionally containing an oxygen atom, and not having fluorine in molecule, and a cured product of which having a thickness of 2 mm shows a transmittance to light with a wavelength of 500 nm of 80% or higher. This curable fluoropolyether adhesive composition is capable of providing a cured product having good light transmittance and high adhesiveness to glass materials.

A coating agent includes a main component containing a polyphenol derivative and a polymerizing agent. The coating agent has a pH of no greater than 9, and the polymerizing agent contains a compound having two or more functional groups selected from the group consisting of an amino group and a mercapto group per molecule.

A method of making a PEEK-PEoEK copolymer having R.sub.PEEK and RPEoEK repeat units in a molar ratio R.sub.PEEK/R.sub.PEoEK ranging from 95/5 to 45/55, the PEEK-PEoEK copolymer obtained from the method and the polymer composition including the PEEK-PEoEK copolymer, at least one reinforcing filler, at least one additive, or a combination thereof, shaped articles including the polymer composition, polymer-metal junctions including the polymer composition. Also described are methods of making the polymer composition, methods of making the shaped articles, and methods of making the polymer-metal junctions.

A method of making a PEEK-PEoEK copolymer having R.sub.PEEK and RPEoEK repeat units in a molar ratio R.sub.PEEK/R.sub.PEoEK ranging from 95/5 to 45/55, the PEEK-PEoEK copolymer obtained from the method and the polymer composition including the PEEK-PEoEK copolymer, at least one reinforcing filler, at least one additive, or a combination thereof, shaped articles including the polymer composition, polymer-metal junctions including the polymer composition. Also described are methods of making the polymer composition, methods of making the shaped articles, and methods of making the polymer-metal junctions.

An adhesive composition containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D), in which the phenoxy resin (C) has an elastic modulus of 500 MPa or more at 25° C., a proportion of the phenoxy resin (C) in a total content of the epoxy resin (A) and the phenoxy resin (C) is 10 to 60 mass%, a nanoindentation hardness at 25° C. of a film-like adhesive before curing formed using the adhesive composition is 0.10 MPa or more, and the Young’s modulus at 25° C. of a film-like adhesive before curing formed using the adhesive composition is 100 MPa or more; a film-like adhesive using the adhesive composition; and a semiconductor package using the film-like adhesive and a producing method thereof.