The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition is calculated as 100%, wherein the main resin comprises 60-90% of a flexible epoxy resin having a structure as shown in Formula I and 10-40% of a phenoxy resin when the total weight of the main resin is calculated as 100%. The resin composition provided by the present disclosure has a low modulus, can alleviate the stress generated by thermal shocks and can withstand more than 1000 thermal cycles.

The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition is calculated as 100%, wherein the main resin comprises 60-90% of a flexible epoxy resin having a structure as shown in Formula I and 10-40% of a phenoxy resin when the total weight of the main resin is calculated as 100%. The resin composition provided by the present disclosure has a low modulus, can alleviate the stress generated by thermal shocks and can withstand more than 1000 thermal cycles.

Provided are a curable composition and an application thereof. The curable composition contains: a compound A having a polymerizable group (a) and an oxyfluoroalkylene group; a polymerization initiator; and a compound B having a polymerizable group different from the polymerizable group (a). The polymerizable group (a) in the compound A is at least one selected from the group consisting of a vinylphenyl group, a vinylphenyloxy group, a vinylbenzyloxy group, a vinyloxy group, a vinyloxycarbonyl group, a vinylamino group, a vinylaminocarbonyl group, a vinylthio group, an allyloxy group, an allyloxycarbonyl group, an allylamino group, an allylaminocarbonyl group, an allylthio group, an epoxy group, and an epoxycycloalkyl group.

Provided are a curable composition and an application thereof. The curable composition contains: a compound A having a polymerizable group (a) and an oxyfluoroalkylene group; a polymerization initiator; and a compound B having a polymerizable group different from the polymerizable group (a). The polymerizable group (a) in the compound A is at least one selected from the group consisting of a vinylphenyl group, a vinylphenyloxy group, a vinylbenzyloxy group, a vinyloxy group, a vinyloxycarbonyl group, a vinylamino group, a vinylaminocarbonyl group, a vinylthio group, an allyloxy group, an allyloxycarbonyl group, an allylamino group, an allylaminocarbonyl group, an allylthio group, an epoxy group, and an epoxycycloalkyl group.

A polymer includes a first structural unit represented by formula (1-1), (1-2) or (1-3) and a second structural unit represented by formula (2) or (3). In the formulae (1-1) to (1-3), (2) and (3), R.sup.1, R.sup.10 and R.sup.11 each represent a halogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, a monovalent halogenated hydrocarbon group having 1 to 20 carbon atoms, a nitro group or a cyano group; Zs each represent —O— or —S—; R.sup.4s each represent a methylene group or an alkylene group having 2 to 4 carbon atoms; and L represents a divalent group represented by formula (2-1). In the formula (2-1), R.sup.a represents a divalent alicyclic hydrocarbon group having 5 to 30 ring atoms or a divalent fluorinated alicyclic hydrocarbon group having 5 to 30 ring atoms.

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Compositions and methods for a semicrystalline poly(aryl ether ketone) copolymers incorporating 2-benzimidazolinone and 4,4′-biphenol as comonomer units with 4,4′-dihalobenzophenone are described herein. The copolymers have advantageous properties, particularly in terms of high glass transition temperatures (T.sub.g), high melting temperatures (T.sub.m), crystallinity and chemical resistance. The copolymers are suitable for manufacturing high temperature and chemical resistance molded systems and other articles of manufacture via injection molding, extrusion, compression molding, coating, and additive manufacturing.

Compositions and methods for a semicrystalline poly(aryl ether ketone) copolymers incorporating 2-benzimidazolinone and 4,4′-biphenol as comonomer units with 4,4′-dihalobenzophenone are described herein. The copolymers have advantageous properties, particularly in terms of high glass transition temperatures (T.sub.g), high melting temperatures (T.sub.m), crystallinity and chemical resistance. The copolymers are suitable for manufacturing high temperature and chemical resistance molded systems and other articles of manufacture via injection molding, extrusion, compression molding, coating, and additive manufacturing.

Compositions and methods for a semicrystalline poly(aryl ether ketone) copolymers incorporating 2-benzimidazolinone and 4,4′-biphenol as comonomer units with 4,4′-dihalobenzophenone are described herein. The copolymers have advantageous properties, particularly in terms of high glass transition temperatures (T.sub.g), high melting temperatures (T.sub.m), crystallinity and chemical resistance. The copolymers are suitable for manufacturing high temperature and chemical resistance molded systems and other articles of manufacture via injection molding, extrusion, compression molding, coating, and additive manufacturing.

A curable composition including a silicone copolymer, a fluoropolyether group-containing compound, and a matrix-forming composition, wherein the silicone copolymer has two or more crosslinkable groups; and the crosslinkable group is a group containing a carbon-carbon double bond, a carbon-carbon triple bond, a cyclic ether group, a hydroxyl group, a thiol group, an amino group, an azide group, a nitrogen-containing heterocyclic group, an isocyanate group, a halogen atom, a phosphoric acid-containing group, or a silane coupling group, or a precursor group thereof. Also disclosed is a film formed from the curable composition, and an article including a substrate and a layer on a surface of the substrate formed from the curable composition.

A curable composition including a silicone copolymer, a fluoropolyether group-containing compound, and a matrix-forming composition, wherein the silicone copolymer has two or more crosslinkable groups; and the crosslinkable group is a group containing a carbon-carbon double bond, a carbon-carbon triple bond, a cyclic ether group, a hydroxyl group, a thiol group, an amino group, an azide group, a nitrogen-containing heterocyclic group, an isocyanate group, a halogen atom, a phosphoric acid-containing group, or a silane coupling group, or a precursor group thereof. Also disclosed is a film formed from the curable composition, and an article including a substrate and a layer on a surface of the substrate formed from the curable composition.