Gels and gel-containing materials, including hydrogels, are described. A gel can be formed by blending polyacrylic acid (PAA) and a polyglycol, such as polytetramethylene ether glycol (PTMEG) at room temperature and, in some cases, without using a catalyst. The blend material can be used to form soft or hard materials, films and particles. The blend material can be combined with vinyl monomers and polymerize to form a hydrogel. The hydrogel can have a high mechanical strength and high water absorbency.

Gels and gel-containing materials, including hydrogels, are described. A gel can be formed by blending polyacrylic acid (PAA) and a polyglycol, such as polytetramethylene ether glycol (PTMEG) at room temperature and, in some cases, without using a catalyst. The blend material can be used to form soft or hard materials, films and particles. The blend material can be combined with vinyl monomers and polymerize to form a hydrogel. The hydrogel can have a high mechanical strength and high water absorbency.

A thermoplastic composition includes a thermoplastic polymer and a polyaryletherketone polymer in admixture with the thermoplastic polymer.

The invention relates to a process for preparing polymeric particles, based on the use of a polyester polymer (PE) comprising units from a dicarboxylic acid component and a diol component, wherein at least 2 mol. % of the diol component is a poly(alkylene glycol). The process comprises the melt-blending of the aromatic polymer (P) with the PE, the cooling the blend and the recovery of the particles by dissolution of the PE into water. The present invention relates to polymeric particles obtained therefrom and to the use of these particles in SLS 3D printing, coatings and toughening of thermoset resins.

The invention relates to a process for preparing polymeric particles, based on the use of a polyester polymer (PE) comprising units from a dicarboxylic acid component and a diol component, wherein at least 2 mol. % of the diol component is a poly(alkylene glycol). The process comprises the melt-blending of the aromatic polymer (P) with the PE, the cooling the blend and the recovery of the particles by dissolution of the PE into water. The present invention relates to polymeric particles obtained therefrom and to the use of these particles in SLS 3D printing, coatings and toughening of thermoset resins.

The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.

The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.

A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320 C, preferably 245 to 312 C, and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260 C, preferably 260 to 350 C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.

A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320 C, preferably 245 to 312 C, and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260 C, preferably 260 to 350 C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.

A fastener comprising a polymer composition [composition (C)] comprising at least one polyaryletherketone polymer [(PAEK) polymer], and at least one nitride (NI) of an element having an electronegativity (ε) of from 1.3 to 2.5, as listed in <<Handbook of Chemistry and Physics>>, CRC Press, 64.sup.th edition, pages B-65 to B-158, based on the total weight of the composition (C).