The objective of the present invention is to provide a polyarylketone resin composition, a fiber-reinforced resin base material, and formed products therefrom having excellent thermal stability and mechanical properties. In order to achieve the above objective, the present invention has the following constitution. That is, the polyaryletherketone resin composition comprises (A) a polyaryletherketone and (B) a transition metal compound, wherein the transition metal content is between 0.001 parts by mass and 4 parts by mass inclusive with respect to 100 parts by mass of (A) the polyaryletherketone.

The present invention relates to a novel polyaryletherketone (PAEK) polymer composition with a significantly increased crystallization rate, and preferably, to a polyetherketoneketone (PEKK) polymer composition. According to the present invention, there is provided a polymer composition including a liquid crystal polymer (LCP), an inorganic nucleating agent, a reinforcing agent, and a filler in polyaryletherketone (PAEK). Therefore, the present invention provides an effect of improving a crystallization rate of the polymer composition and improving molding processability, thereby improving productivity, shape, dimensional stability, or the like of products.

The present invention relates to a novel polyaryletherketone (PAEK) polymer composition with a significantly increased crystallization rate, and preferably, to a polyetherketoneketone (PEKK) polymer composition. According to the present invention, there is provided a polymer composition including a liquid crystal polymer (LCP), an inorganic nucleating agent, a reinforcing agent, and a filler in polyaryletherketone (PAEK). Therefore, the present invention provides an effect of improving a crystallization rate of the polymer composition and improving molding processability, thereby improving productivity, shape, dimensional stability, or the like of products.

The present invention relates to a novel polyaryletherketone (PAEK) polymer composition with a significantly increased crystallization rate, and preferably, to a polyetherketoneketone (PEKK) polymer composition. According to the present invention, there is provided a polymer composition including a liquid crystal polymer (LCP), an inorganic nucleating agent, a reinforcing agent, and a filler in polyaryletherketone (PAEK). Therefore, the present invention provides an effect of improving a crystallization rate of the polymer composition and improving molding processability, thereby improving productivity, shape, dimensional stability, or the like of products.

A crosslinked biobased hydrophilic foam comprising a reaction product of: a cleaned biobased polyoxyalkylene glycol polyol with an ethylene oxide content of at least 40 mole percent, constituting 31.80 to 67.95 percent biogenic carbon content by weight, constituting less than 15 ppm combined sodium and potassium metals, and comprising less than 0.5% water by weight; an isocyanate, wherein the isocyanate and the cleaned biobased polyoxyalkylene glycol polyol are premixed to create a prepolymer mixture with the cleaned biobased polyoxyalkylene glycol polyol of the prepolymer mixture; and water, wherein the water is admixed with the prepolymer mixture to yield the crosslinked biobased hydrophilic foam.

A crosslinked biobased hydrophilic foam comprising a reaction product of: a cleaned biobased polyoxyalkylene glycol polyol with an ethylene oxide content of at least 40 mole percent, constituting 31.80 to 67.95 percent biogenic carbon content by weight, constituting less than 15 ppm combined sodium and potassium metals, and comprising less than 0.5% water by weight; an isocyanate, wherein the isocyanate and the cleaned biobased polyoxyalkylene glycol polyol are premixed to create a prepolymer mixture with the cleaned biobased polyoxyalkylene glycol polyol of the prepolymer mixture; and water, wherein the water is admixed with the prepolymer mixture to yield the crosslinked biobased hydrophilic foam.

An adhesive film that can be wound and punched, comprising an epoxy-based adhesive compound that can be activated by UV-radiation or thermally and an expandable filler admixed to the adhesive compound to produce an adhesive film that is compressible when not yet cured.

An adhesive film that can be wound and punched, comprising an epoxy-based adhesive compound that can be activated by UV-radiation or thermally and an expandable filler admixed to the adhesive compound to produce an adhesive film that is compressible when not yet cured.

A semicrystalline polyphenylsulfone, has the structure Formula (I) wherein n and R are defined herein. The semicrystalline polyphenylsulfone, which exhibits a crystalline melting point in a range of 215 to 270° C., can be prepared from amorphous polyphenylsulfone using a solvent-induced crystallization method. An additive manufacturing method utilizing particles of the semicrystalline polyphenylsulfone is described. ##STR00001##

A semicrystalline polyphenylsulfone, has the structure Formula (I) wherein n and R are defined herein. The semicrystalline polyphenylsulfone, which exhibits a crystalline melting point in a range of 215 to 270° C., can be prepared from amorphous polyphenylsulfone using a solvent-induced crystallization method. An additive manufacturing method utilizing particles of the semicrystalline polyphenylsulfone is described. ##STR00001##