The masterbatch contains a black pigment and a masterbatch thermoplastic resin, the masterbatch satisfying the following conditions: (Conditions) when a resin plate is produced by kneading 100 parts by weight of polypropylene having a melt flow rate of 30 g/10 min (JIS K7210:1999) and a density of 0.9 g/cm.sup.3 (JIS K7112:1999) with respect to 3 parts by weight of the masterbatch and subjecting the mixture to injection molding using a mold polished by a coated abrasive with a particle size of #800 (JIS R6001:1998), a* values and b* values of a surface of the resin plate in the L*a*b* color system satisfy specific conditions.

Provided is a thermoplastic resin composition which contains three components, i.e., a polyethylene, a polyamide and a compatibilizer and is excellent in impact resistance while realizing a reduction in environmental load, and a modifier capable of imparting impact resistance to a polyolefin (provided that polyethylene is excluded). The composition and the modifier each contain a polyethylene, a polyamide and a compatibilizer. The compatibilizer is a modified elastomer having a reactive group that reacts with the polyamide, and the polyethylene and the polyamide have a bio-based carbon content rate of 80% or more according to ISO 16620-2.

Provided is a thermoplastic resin composition which contains three components, i.e., a polyethylene, a polyamide and a compatibilizer and is excellent in impact resistance while realizing a reduction in environmental load, and a modifier capable of imparting impact resistance to a polyolefin (provided that polyethylene is excluded). The composition and the modifier each contain a polyethylene, a polyamide and a compatibilizer. The compatibilizer is a modified elastomer having a reactive group that reacts with the polyamide, and the polyethylene and the polyamide have a bio-based carbon content rate of 80% or more according to ISO 16620-2.

The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments may be prepared from a polymer composition comprising: A) 55 to 95 weight percent semi-aromatic copolyamide having a melting point; and B) 5 to 45 weight percent amorphous copolyamide having a melting point.

The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments may be prepared from a polymer composition comprising: A) 55 to 95 weight percent semi-aromatic copolyamide having a melting point; and B) 5 to 45 weight percent amorphous copolyamide having a melting point.

The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments may be prepared from a polymer composition comprising: A) 55 to 95 weight percent semi-aromatic copolyamide having a melting point; and B) 5 to 45 weight percent amorphous copolyamide having a melting point.

It has been established that optimizing cell seeding onto tissue engineering vascular grafts (TEVG) is associated with reduced inflammatory responses and reduced post-operative stenosis of TEVG. Cell seeding increased TEVG patency in a dose dependent manner, and TEVG patency improved when more cells were seeded, however duration of incubation time showed minimal effect on TEVG patency. Methods of engineering patient specific TEVG including optimal numbers of cells to maintain graft patency and reduce post-operative stenosis are provided. Closed, single-use customizable systems for seeding TEVG are also provided. Preferably the systems are custom-designed based on morphology of the patient specific graft, to enhance the efficacy of cell seeding.

It has been established that optimizing cell seeding onto tissue engineering vascular grafts (TEVG) is associated with reduced inflammatory responses and reduced post-operative stenosis of TEVG. Cell seeding increased TEVG patency in a dose dependent manner, and TEVG patency improved when more cells were seeded, however duration of incubation time showed minimal effect on TEVG patency. Methods of engineering patient specific TEVG including optimal numbers of cells to maintain graft patency and reduce post-operative stenosis are provided. Closed, single-use customizable systems for seeding TEVG are also provided. Preferably the systems are custom-designed based on morphology of the patient specific graft, to enhance the efficacy of cell seeding.