Patent classifications
C08L83/00
CURABLE ELASTOMER COMPOSITION, CURED PRODUCT OF SAME, FILM PROVIDED WITH CURED PRODUCT, MULTILAYER BODY PROVIDED WITH FILM, METHOD FOR PRODUCING SAID MULTILAYER BODY, ELECTRONIC COMPONENT AND DISPLAY DEVICE EACH COMPRISING CURED PRODUCT, METHOD FOR DESIGNING CURABLE ELASTOMER COMPOSITION AND METHOD FOR DESIGNING TRANSDUCER DEVICE
Performance requirements of electroactive polymer materials used for transducer devices include dielectric breakdown strength, Young's modulus, dielectric constant, thickness, and electromechanical instability. There are correlation relationships therebetween but definitions of the correlation relationships have not been achieved. Therefore, it is necessary to search for an excellent material by trial and error, which requires a great deal of work. Disclosed herein is a curable elastomer composition that includes a compound having a high dielectric functional group. A cured product of the composition satisfies the following formula:
where E is the dielectric breakdown strength in the range of 50 V/μm to 200 V/μm, α is a constant in the range of 0.4 to 0.9, Y is Young's modulus and is in the range of 0.001 MPa to 10 MPa, ε.sub.γ is a specific dielectric constant and is 100 or less, and ε.sub.0 represents the dielectric constant of vacuum.
Curable organopolysiloxane composition and a protectant or adhesive composition of electric/electronic parts
Provided is a curable organopolysiloxane composition which has a particularly excellent effect of improving initial adhesiveness in small amounts and a thin layer with respect to various base materials, in addition to being able to achieve particularly excellent adhesive durability and high adhesive strength after curing. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per one molecule; (B) a trialcoxysilyl containing siloxane having one silicon atom-bonded hydrogen atom and at least one trialcoxysilyl group per one molecule; (C) a chain or cyclic organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per one molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per one molecule; (E) a catalyst for a hydrosilylation reaction; (F) a catalyst for a condensation reaction; and (G) an adhesion promoter.
Curable organopolysiloxane composition and a protectant or adhesive composition of electric/electronic parts
Provided is a curable organopolysiloxane composition which has a particularly excellent effect of improving initial adhesiveness in small amounts and a thin layer with respect to various base materials, in addition to being able to achieve particularly excellent adhesive durability and high adhesive strength after curing. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per one molecule; (B) a trialcoxysilyl containing siloxane having one silicon atom-bonded hydrogen atom and at least one trialcoxysilyl group per one molecule; (C) a chain or cyclic organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per one molecule; (D) a chain organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per one molecule; (E) a catalyst for a hydrosilylation reaction; (F) a catalyst for a condensation reaction; and (G) an adhesion promoter.
Curable granular silicone composition, semiconductor member comprising same, and forming method thereof
A curable particulate silicone composition is disclosed. The composition comprises: (A) hot-melt silicone fine particles having a specific reactive functional group; (B) an inorganic filler; and (C) a curing agent. The content of component (B) is in the range of from 87 to 95 vol. % of the total composition. The curable particulate silicone composition provides a cured product having an average linear expansion coefficient of not greater than 15 ppm/° C. in a range of from 25° C. to 200° C. The curable particulate silicone composition provides a cured product having a very low average linear expansion coefficient over a wide temperature range when cured and is particularly suitable for overmold molding and the like.
Curable granular silicone composition, semiconductor member comprising same, and forming method thereof
A curable particulate silicone composition is disclosed. The composition comprises: (A) hot-melt silicone fine particles having a specific reactive functional group; (B) an inorganic filler; and (C) a curing agent. The content of component (B) is in the range of from 87 to 95 vol. % of the total composition. The curable particulate silicone composition provides a cured product having an average linear expansion coefficient of not greater than 15 ppm/° C. in a range of from 25° C. to 200° C. The curable particulate silicone composition provides a cured product having a very low average linear expansion coefficient over a wide temperature range when cured and is particularly suitable for overmold molding and the like.
Polyorganosiloxane having poly(meth)acrylate groups and methods for the preparation and use thereof
A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer, and method for preparation of this polydiorganosiloxane are disclosed. The method preserves the aliphatically unsaturated groups when grafting the poly(meth)acrylate to the polydiorganosiloxane. This polydiorganosiloxane is useful in hydrosilylation reaction curable compositions, such as pressure sensitive adhesive compositions.
Polyorganosiloxane having poly(meth)acrylate groups and methods for the preparation and use thereof
A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer, and method for preparation of this polydiorganosiloxane are disclosed. The method preserves the aliphatically unsaturated groups when grafting the poly(meth)acrylate to the polydiorganosiloxane. This polydiorganosiloxane is useful in hydrosilylation reaction curable compositions, such as pressure sensitive adhesive compositions.
AUTOMOTIVE GRAPHENE SURFACE TREATMENT COMPOSITION AND PROCESS FOR USE THEREOF
A composition is provided that includes a graphene dispersion, a silicone microemulsion, a reactive siloxane emulsion, and water as a majority by weight of the composition. A process for imparting a durable shine to a vehicle surface is also provided. The composition is applied to the vehicle surface. The water is allowed to evaporate from the composition to form a coating imparting a durable shine to the vehicle surface. A coating is obtained after evaporation. The coating includes a silicone film formed by the evaporation of water from a silicone microemulsion and the cross-linking of a siloxane from an emulsion. Graphene particles are embedded in the silicone film. The coating has a thickness of between having a thickness of between 5 and 10,000 nanometers and a hardness of between 3 and 7 GPa.
AUTOMOTIVE GRAPHENE SURFACE TREATMENT COMPOSITION AND PROCESS FOR USE THEREOF
A composition is provided that includes a graphene dispersion, a silicone microemulsion, a reactive siloxane emulsion, and water as a majority by weight of the composition. A process for imparting a durable shine to a vehicle surface is also provided. The composition is applied to the vehicle surface. The water is allowed to evaporate from the composition to form a coating imparting a durable shine to the vehicle surface. A coating is obtained after evaporation. The coating includes a silicone film formed by the evaporation of water from a silicone microemulsion and the cross-linking of a siloxane from an emulsion. Graphene particles are embedded in the silicone film. The coating has a thickness of between having a thickness of between 5 and 10,000 nanometers and a hardness of between 3 and 7 GPa.
SOLVENT BASED AUTOMOTIVE GRAPHENE SURFACE TREATMENT AND PROCESS FOR USE THEREOF
A composition is provided that includes a graphene dispersion, a silicone microemulsion, a reactive siloxane emulsion, and organic solvent as a majority by weight of the composition. A process for imparting a durable shine to a vehicle surface is also provided. The composition is applied to the vehicle surface. The water is allowed to evaporate from the composition to form a coating imparting a durable shine to the vehicle surface. A coating is obtained after evaporation. The coating includes a silicone film formed by the evaporation of water from a silicone microemulsion and the cross-linking of a siloxane from an emulsion. Graphene particles are embedded in the silicone film. The coating has a thickness of between having a thickness of between 5 and 10,000 nanometers and a hardness of between 3 and 7 GPa.