Provided is a room temperature moisture-curable silicone gel composition containing: (A) diorganopolysiloxane, both terminals of which are blocked by silanol groups; (B) hydrolysable organosilicon compound represented by Formula (2) and/or a partial hydrolysate thereof ##STR00001##
(where R.sup.2 is a monovalent hydrocarbon group, R.sup.3 is an alkyl group or a cycloalkyl group, and a is 2 or 3.); (C) a curing catalyst; and (D) a heat-resistant aid containing a homogeneous mixture of (D-a), (D-b), and (D-c) (where (D-a) is organopolysiloxane having a viscosity of 10-10,000 mPa.Math.s at 25° C., (D-b) is carboxylate of cerium, and (D-c) is a titanium compound and/or a partial hydrolytic condensate thereof). This room temperature moisture-curable silicone gel composition can be a silicone gel cured product which has a small variation rate of low-stress properties evaluated by the index such as penetration even under heat-resistant conditions exceeding 230° C. and which has excellent heat-resistance.

Provided is a room temperature moisture-curable silicone gel composition containing: (A) diorganopolysiloxane, both terminals of which are blocked by silanol groups; (B) hydrolysable organosilicon compound represented by Formula (2) and/or a partial hydrolysate thereof ##STR00001##
(where R.sup.2 is a monovalent hydrocarbon group, R.sup.3 is an alkyl group or a cycloalkyl group, and a is 2 or 3.); (C) a curing catalyst; and (D) a heat-resistant aid containing a homogeneous mixture of (D-a), (D-b), and (D-c) (where (D-a) is organopolysiloxane having a viscosity of 10-10,000 mPa.Math.s at 25° C., (D-b) is carboxylate of cerium, and (D-c) is a titanium compound and/or a partial hydrolytic condensate thereof). This room temperature moisture-curable silicone gel composition can be a silicone gel cured product which has a small variation rate of low-stress properties evaluated by the index such as penetration even under heat-resistant conditions exceeding 230° C. and which has excellent heat-resistance.

A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.

A pressure sensitive adhesive composition includes (A) 0.1% to 5% an anchorage additive and (B) 95% to 99.9% of a silicone pressure sensitive adhesive composition. This pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.

Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and is less likely to flow out and slip off/drop off from a surface on which the gel composition is placed, even when the composition that has not been cured is placed on a sloped surface or in a vertical direction, and has excellent gap-filling ability with respect to a heat dissipation part, etc., and excellent repairability if desired; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for a hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The gel composition has certain viscosity properties as disclosed herein.

Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and is less likely to flow out and slip off/drop off from a surface on which the gel composition is placed, even when the composition that has not been cured is placed on a sloped surface or in a vertical direction, and has excellent gap-filling ability with respect to a heat dissipation part, etc., and excellent repairability if desired; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for a hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The gel composition has certain viscosity properties as disclosed herein.

A two-component silicone composition made of a component A including a hydroxyl-group terminated polydiorganosiloxane P; between 0.05-5.0 wt. % water, relative to component A; and component B including a non-condensable polydiorganosiloxane; a catalyst K cross-linking polydiorganosiloxanes; between 0-50 wt. % of a first organosilane V1 according to formula (I), between 2-60 wt. % of a second organosilane V2 according to formula (II), up to 25 wt. % of organosilanes V3 having hydrolyzable alkoxysilane groups Si—ORa not falling under the formulae (I) and (II), with Ra being a hydrogen atom or monovalent, linear or branched alkyl group with 1-6 carbon atoms, Rb being a divalent, linear or branched alkyl group or alkenyl group with 2-20 carbon atoms, and Rc being a divalent, linear or branched alkyl group with 2-20 carbon atoms containing a secondary amino group; the composition containing less than 10 mole-%, relative to the amount of organosilane V2, of organosilanes with epoxy groups.

A two-component silicone composition made of a component A including a hydroxyl-group terminated polydiorganosiloxane P; between 0.05-5.0 wt. % water, relative to component A; and component B including a non-condensable polydiorganosiloxane; a catalyst K cross-linking polydiorganosiloxanes; between 0-50 wt. % of a first organosilane V1 according to formula (I), between 2-60 wt. % of a second organosilane V2 according to formula (II), up to 25 wt. % of organosilanes V3 having hydrolyzable alkoxysilane groups Si—ORa not falling under the formulae (I) and (II), with Ra being a hydrogen atom or monovalent, linear or branched alkyl group with 1-6 carbon atoms, Rb being a divalent, linear or branched alkyl group or alkenyl group with 2-20 carbon atoms, and Rc being a divalent, linear or branched alkyl group with 2-20 carbon atoms containing a secondary amino group; the composition containing less than 10 mole-%, relative to the amount of organosilane V2, of organosilanes with epoxy groups.

The invention relates to a laminate comprising a first layer and a second layer directly covering the first layer, the first layer being a layer of a silicone rubber composition comprising a micrometric silicone powder and a mixture of crosslinkable organopolysiloxanes, the second layer being a layer of a silicone rubber composition comprising a hydrophobic silica and a mixture of crosslinkable organopolysiloxanes, the first layer and the second layer being crosslinked. The laminate, in particular when it is used as a coating for the outer surface of an expandable bladder for a tyre curing mould, makes it possible to eliminate moulding defects on the inner liner of the tyre.

The invention relates to a laminate comprising a first layer and a second layer directly covering the first layer, the first layer being a layer of a silicone rubber composition comprising a micrometric silicone powder and a mixture of crosslinkable organopolysiloxanes, the second layer being a layer of a silicone rubber composition comprising a hydrophobic silica and a mixture of crosslinkable organopolysiloxanes, the first layer and the second layer being crosslinked. The laminate, in particular when it is used as a coating for the outer surface of an expandable bladder for a tyre curing mould, makes it possible to eliminate moulding defects on the inner liner of the tyre.