The present invention relates to a polyorganosiloxane and a moisture and radiation curable adhesive composition comprising the same, in particular, to a polyorganosiloxane and a moisture and radiation curable adhesive composition used in a liquid optical clear adhesive (LOCA) for handheld device and display (HHDD).

The present invention relates to a polyorganosiloxane and a moisture and radiation curable adhesive composition comprising the same, in particular, to a polyorganosiloxane and a moisture and radiation curable adhesive composition used in a liquid optical clear adhesive (LOCA) for handheld device and display (HHDD).

An alkoxysilyl group-containing organic silazane compound having an average composition represented by formula (1) below: ##STR00001##
wherein R.sup.1 is a monovalent hydrocarbon group, R.sup.2 is a divalent hydrocarbon group, Y is a group represented by formula (6) or (7) below: ##STR00002##
wherein R.sup.3, R.sup.4, and R.sup.6 are a monovalent hydrocarbon group, X is an oxygen atom or a divalent hydrocarbon group, p is an integer of 0 to 9, and n is 0, 1, or 2, R.sup.5 is a monovalent hydrocarbon group, m is 0 or 1, r is 0, 1, or 2, and a and b are numbers which satisfy 0<a≤1, 0≤b<1, and a+b=1.

An alkoxysilyl group-containing organic silazane compound having an average composition represented by formula (1) below: ##STR00001##
wherein R.sup.1 is a monovalent hydrocarbon group, R.sup.2 is a divalent hydrocarbon group, Y is a group represented by formula (6) or (7) below: ##STR00002##
wherein R.sup.3, R.sup.4, and R.sup.6 are a monovalent hydrocarbon group, X is an oxygen atom or a divalent hydrocarbon group, p is an integer of 0 to 9, and n is 0, 1, or 2, R.sup.5 is a monovalent hydrocarbon group, m is 0 or 1, r is 0, 1, or 2, and a and b are numbers which satisfy 0<a≤1, 0≤b<1, and a+b=1.

A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R.sup.1SiO.sub.3/2 unit, 30 to 80 mol % of an (R.sup.2).sub.2SiO.sub.2/2 unit, and 1 to 30 mol % of an (R.sup.3).sub.3SiO.sub.1/2 unit. At least a part of the (R.sup.2).sub.2SiO.sub.2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

A curable organosilicon resin composition includes; (A) an organopolysiloxane having a resin structure containing 10 to 60 mol % of an R.sup.1SiO.sub.3/2 unit, 30 to 80 mol % of an (R.sup.2).sub.2SiO.sub.2/2 unit, and 1 to 30 mol % of an (R.sup.3).sub.3SiO.sub.1/2 unit. At least a part of the (R.sup.2).sub.2SiO.sub.2/2 unit is in continuous repeating units with the average number of the repeating units being 3 to 80. The organopolysiloxane has a weight average molecular weight of 5,000 to 50,000; the amount of the hydroxy groups bonded to silicon atoms is 0.001 to 1.0 mol/100 g; and the amount of the alkoxy groups, each having 1 to 10 carbon atoms, bonded to silicon atoms is 1.0 mol/100 g or less. A curable organosilicon resin composition has excellent workability, can give a cured product rapidly, and can make the cured product excellent in mechanical properties, heat resistance, crack resistance, and adhesive property, the surface tackiness being suppressed.

The present invention relates to a flame-retardant polycarbonate composition comprising the following components, relative to the total weight of the composition: A) 30-70 wt. % of at least one aromatic polycarbonate, B) 20-60 wt. % of at least one polysiloxane-polycarbonate block condensate, C) 0.5-5 wt. % of at least one cyclic phosphazene, D) 1-5 wt. % of at least one silicone-acrylate rubber based impact modifier, E) 0.3-3 wt % of kaolin, F) 0.1-1 wt. % of at least one anti-dripping agent, and G) 0.1-1 wt. % of at least one UV absorber. The present invention also relates to a shaped article produced from the composition. The polycarbonate composition according to the present invention has a good combination of low-temperature impact performance, flame-retardancy, hydrolytic stability, anti-UV performance, and heat resistance.

The present invention relates to a flame-retardant polycarbonate composition comprising the following components, relative to the total weight of the composition: A) 30-70 wt. % of at least one aromatic polycarbonate, B) 20-60 wt. % of at least one polysiloxane-polycarbonate block condensate, C) 0.5-5 wt. % of at least one cyclic phosphazene, D) 1-5 wt. % of at least one silicone-acrylate rubber based impact modifier, E) 0.3-3 wt % of kaolin, F) 0.1-1 wt. % of at least one anti-dripping agent, and G) 0.1-1 wt. % of at least one UV absorber. The present invention also relates to a shaped article produced from the composition. The polycarbonate composition according to the present invention has a good combination of low-temperature impact performance, flame-retardancy, hydrolytic stability, anti-UV performance, and heat resistance.

A composition crosslinkable by condensation reaction and producible using (A) organopolysiloxanes of the formula (R.sup.2O).sub.3-aSiR.sup.1.sub.aO(SiR.sub.2O).sub.nSiR.sup.1.sub.a(OR.sup.2).sub.3-a (I), (B1) silanes of the formula R.sup.3.sub.4-b(R.sup.4O).sub.bSi (II), and optionally (B2) silicon compounds consisting of units of the formula R.sup.7.sub.c(R.sup.8O).sub.dSiO.sub.(4-c-d)/2 (III). The composition contains organosilicon compounds having a molecular weight of less than or equal to 195 g/mol maximally in amounts of less than 0.5 wt%, based on organopolysiloxane (A).

A composition crosslinkable by condensation reaction and producible using (A) organopolysiloxanes of the formula (R.sup.2O).sub.3-aSiR.sup.1.sub.aO(SiR.sub.2O).sub.nSiR.sup.1.sub.a(OR.sup.2).sub.3-a (I), (B1) silanes of the formula R.sup.3.sub.4-b(R.sup.4O).sub.bSi (II), and optionally (B2) silicon compounds consisting of units of the formula R.sup.7.sub.c(R.sup.8O).sub.dSiO.sub.(4-c-d)/2 (III). The composition contains organosilicon compounds having a molecular weight of less than or equal to 195 g/mol maximally in amounts of less than 0.5 wt%, based on organopolysiloxane (A).