An asphalt concrete composition having improved waterproof performance, and a construction method using the composition. The composition includes 100 parts by weight of virgin asphalt, 5 to 25 parts by weight of styrene isoprene styrene, 5 to 15 parts by weight of petroleum resin, 250 to 1,000 parts by weight of reclaimed asphalt pavement, 1 to 10 parts by of a performance improving agent, 250 to 1,000 parts by weight of virgin aggregate, 30 to 150 parts by weight of fine powder aggregate, and 0.1 to 2 parts by weight of cellulose fiber. The composition's waterproof performance is due to its high cohesion and adhesion. The composition is durable and is not easily rutted, aged and/or stripped. In addition, the composition has a performance grade of PG 82-34, can prevent water penetration and potholes, and enables a placement process to be easily performed at low costs.

An asphalt concrete composition having improved waterproof performance, and a construction method using the composition. The composition includes 100 parts by weight of virgin asphalt, 5 to 25 parts by weight of styrene isoprene styrene, 5 to 15 parts by weight of petroleum resin, 250 to 1,000 parts by weight of reclaimed asphalt pavement, 1 to 10 parts by of a performance improving agent, 250 to 1,000 parts by weight of virgin aggregate, 30 to 150 parts by weight of fine powder aggregate, and 0.1 to 2 parts by weight of cellulose fiber. The composition's waterproof performance is due to its high cohesion and adhesion. The composition is durable and is not easily rutted, aged and/or stripped. In addition, the composition has a performance grade of PG 82-34, can prevent water penetration and potholes, and enables a placement process to be easily performed at low costs.

The present invention provides a hot-melt coating agent that is excellent in bubble-suppression properties during coating, that is cured in a short period of time after coating, and that is excellent in tack-free properties and bleed-out resistance properties. The present invention provides a hot-melt coating agent for a component-mounted electronic circuit board that contains a thermoplastic resin (A) and a liquid softener (B); and that has a melt viscosity at 160° C. (η1) of 20000 mPa.Math.s or less and a melt viscosity at 180° C. (η2) of 10000 mPa.Math.s or less, wherein the ratio of the melt viscosity at 160° C. (η1) to the melt viscosity at 180° C. (η2) (η1/η2) is 1.0 to 5.0.

The present invention provides a hot-melt coating agent that is excellent in bubble-suppression properties during coating, that is cured in a short period of time after coating, and that is excellent in tack-free properties and bleed-out resistance properties. The present invention provides a hot-melt coating agent for a component-mounted electronic circuit board that contains a thermoplastic resin (A) and a liquid softener (B); and that has a melt viscosity at 160° C. (η1) of 20000 mPa.Math.s or less and a melt viscosity at 180° C. (η2) of 10000 mPa.Math.s or less, wherein the ratio of the melt viscosity at 160° C. (η1) to the melt viscosity at 180° C. (η2) (η1/η2) is 1.0 to 5.0.

The present invention provides a curable composition, a pressure-sensitive adhesive, an adhesive tape, and an adhesive product. The present invention belongs to the technical field of acrylate pressure-sensitive adhesives. The pressure-sensitive adhesive formed of the curable composition of the present invention has good high-temperature and high-humidity repulsion resistance. The curable composition comprises: a monomer component, comprising at least two polymerizable monomers, wherein the polymerizable monomers comprise a non-tertiary alcohol (meth)acrylate monomer, and an acid-functional non-ester unsaturated monomer having at least one olefinic bond; a (meth)acrylate polymer tackifying resin having a specific molecular weight and a glass transition temperature; a non-(meth)acrylate polymer tackifying resin component, comprising at least two non-(meth)acrylate polymer tackifying resins, wherein at least a part of non-(meth)acrylate polymer tackifying resins has a softening point greater than or equal to 130° C.; a cross-linking agent component, comprising an isocyanate cross-linking agent and at least one non-isocyanate cross-linking agent.

The present invention provides a curable composition, a pressure-sensitive adhesive, an adhesive tape, and an adhesive product. The present invention belongs to the technical field of acrylate pressure-sensitive adhesives. The pressure-sensitive adhesive formed of the curable composition of the present invention has good high-temperature and high-humidity repulsion resistance. The curable composition comprises: a monomer component, comprising at least two polymerizable monomers, wherein the polymerizable monomers comprise a non-tertiary alcohol (meth)acrylate monomer, and an acid-functional non-ester unsaturated monomer having at least one olefinic bond; a (meth)acrylate polymer tackifying resin having a specific molecular weight and a glass transition temperature; a non-(meth)acrylate polymer tackifying resin component, comprising at least two non-(meth)acrylate polymer tackifying resins, wherein at least a part of non-(meth)acrylate polymer tackifying resins has a softening point greater than or equal to 130° C.; a cross-linking agent component, comprising an isocyanate cross-linking agent and at least one non-isocyanate cross-linking agent.

Provided is an adhesive tape that has higher self-adhesion force and higher self-adhesive creep resistance and does not have an odor problem of the adhesive face while maintaining HM workability. A hot-melt adhesive composition of the present invention contains at least an elastomer, a tackifier resin, a filler, and a petroleum-based plasticizer, in which the elastomer is a specific styrene-isoprene-styrene block copolymer and a terpene resin, a C5/C9 petroleum resin, and a homopolymer of a styrene-based monomer and/or a copolymer of a styrene-based monomer/an aliphatic monomer are contained as the tackifier resin.

Provided is an adhesive tape that has higher self-adhesion force and higher self-adhesive creep resistance and does not have an odor problem of the adhesive face while maintaining HM workability. A hot-melt adhesive composition of the present invention contains at least an elastomer, a tackifier resin, a filler, and a petroleum-based plasticizer, in which the elastomer is a specific styrene-isoprene-styrene block copolymer and a terpene resin, a C5/C9 petroleum resin, and a homopolymer of a styrene-based monomer and/or a copolymer of a styrene-based monomer/an aliphatic monomer are contained as the tackifier resin.

The use of a low molecular weight farnesene, poly(farnesene), and farnesene copolymer in a golf ball is disclosed herein. In a core, low molecular weight farnesene, poly(farnesene) or farnesene copolymer is blended with 1,4 polybutadiene or a polyalkenamer. In a mantle layer, low molecular weight farnesene, poly(farnesene), and/or farnesene copolymer can be blended with non- or partially neutralized copolymeric or terpolymeric ionomer(s). In a cover, low molecular weight farnesene, poly(farnesene), and farnesene copolymer can be blended with highly neutralized ionomer.

The use of a low molecular weight farnesene, poly(farnesene), and farnesene copolymer in a golf ball is disclosed herein. In a core, low molecular weight farnesene, poly(farnesene) or farnesene copolymer is blended with 1,4 polybutadiene or a polyalkenamer. In a mantle layer, low molecular weight farnesene, poly(farnesene), and/or farnesene copolymer can be blended with non- or partially neutralized copolymeric or terpolymeric ionomer(s). In a cover, low molecular weight farnesene, poly(farnesene), and farnesene copolymer can be blended with highly neutralized ionomer.