Provided are a curing accelerator for an oxidative polymerization type unsaturated resin having a high curing accelerating ability, and a printing ink and a coating material each including the curing accelerator for an oxidative polymerization type unsaturated resin. Specifically, there are provided a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal salt (A) and an imidazole compound (B), a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal salt (A), a ligand compound (C) and an imidazole compound (B), a curing accelerator for an oxidative polymerization type unsaturated resin containing a metal complex (D) and an imidazole compound (B), and a printing ink and a coating material using the curing accelerator for an oxidative polymerization type unsaturated resin.

A method of producing a resin sheet, including: mixing blocky boron nitride particles A, blocky boron nitride particles B, and a resin composition, and molding the resin composition to a sheet form and pressurizing the sheet form resin composition, the boron nitride primary particles a having a length in a shorter direction of 0.7 μm or less, the boron nitride primary particles b having a length in a shorter direction of 1 μm or more, the blocky boron nitride particles A having an average particle diameter of 30 μm or more, the blocky boron nitride particles B having an average particle diameter that is smaller than the average particle diameter of the blocky boron nitride particles A, the compressive strengths ratio of the blocky boron nitride particles A to the blocky boron nitride particles B being 1.2 or more. Thus, the thermal conductivity of a resin sheet can be enhanced.

Provided is a method for manufacturing a spherical particle material in which the particle size distribution is easily controlled. This method has: a granulation step of granulating a raw particle material formed of an inorganic material having a D50 of not larger than 5 μm to form a granulated body; and a spherizing step of heating and melting the granulated body to form the spherical particle material having a D50 larger than a D50 of the raw particle material. A melting method is used as a basic method for manufacturing the spherical particle material having a necessary particle size distribution. The granulated body is used to manufacture the spherical particle material having the necessary particle size distribution by the melting method.

A first object of the present invention is to provide a composition having excellent fluidity and capable of forming a cured substance having excellent magnetic properties and excellent filling suitability. A second object of the present invention is to provide a magnetic particle-containing cured substance formed of the composition. A third object of the present invention is to provide a magnetic particle-introduced substrate and an electronic material that contain the magnetic particle-containing cured substance.

The composition according to an embodiment of the present invention is a composition containing magnetic particles, one or more components selected from the group consisting of a resin and a resin precursor, a solvent, in which a content of magnetic particles having a primary particle diameter of 4 m or more is 25% by mass or less with respect to a total mass of the magnetic particles, a content of the magnetic particles is 91% by mass or more with respect to a total solid content of the composition, and a content of the solvent is 3% to 24% by mass with respect to a total mass of the composition.

The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10.sup.−7 m.sup.2s.sup.−1 or more, and has a volume resistivity of 1.0×10.sup.11 Ω.Math.cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.

A salt-forming compound represented by the following general formula (3): ##STR00001##
where X.sup.1 and X.sup.2 each independently represent an aromatic ring group optionally containing a substituent; Y represents a divalent hydrocarbon group that the carbon atom directly bound to X.sup.1 or X.sup.2 does not have a π bond; Z.sup.+ represents an organic cation group; e represents an integer of from 1 to 4; and when e is 2 or more, a plurality of Ys and a plurality of Z.sup.+ s may be each the same or different; A.sup.c- represents a heteropolyoxometalate anion which is a c-valent anion and which has an oxidation-reduction potential larger than −0.3 V relative to the silver/silver chloride electrode; f and c are each an integer of 2 or more; g is an integer of 1 or more; and the salt-forming compound is a normal salt that f×e=c×g.

Provided is a glass fiber-reinforced resin molded article having high dimension stability and low dielectric characteristics. In the glass fiber-reinforced resin molded article, the fiber diameter D of glass fiber included in the glass fiber-reinforced resin molded article is in the range of 5.0 to 15.0 μm, the dielectric constant Dk at a measurement frequency of 1 GHz of the glass fiber is in the range of 4.0 to 7.0, the linear expansion coefficient C of the glass fiber is in the range of 2.0 to 6.0 ppm/K, the number average fiber length L of the glass fiber is in the range of 150 to 400 μm, and the D, Dk, C, and L satisfy the following formula (1):

57.9≤Dk×C.sup.1/4×L.sup.1/2/D.sup.1/4≤70.6  (1)

The masterbatch contains a black pigment and a masterbatch thermoplastic resin, the masterbatch satisfying the following conditions: (Conditions) when a resin plate is produced by kneading 100 parts by weight of polypropylene having a melt flow rate of 30 g/10 min (JIS K7210:1999) and a density of 0.9 g/cm.sup.3 (JIS K7112:1999) with respect to 3 parts by weight of the masterbatch and subjecting the mixture to injection molding using a mold polished by a coated abrasive with a particle size of #800 (JIS R6001:1998), a* values and b* values of a surface of the resin plate in the L*a*b* color system satisfy specific conditions.

The masterbatch contains a black pigment and a masterbatch thermoplastic resin, the masterbatch satisfying the following conditions: (Conditions) when a resin plate is produced by kneading 100 parts by weight of polypropylene having a melt flow rate of 30 g/10 min (JIS K7210:1999) and a density of 0.9 g/cm.sup.3 (JIS K7112:1999) with respect to 3 parts by weight of the masterbatch and subjecting the mixture to injection molding using a mold polished by a coated abrasive with a particle size of #800 (JIS R6001:1998), a* values and b* values of a surface of the resin plate in the L*a*b* color system satisfy specific conditions.

A resin composition for wiring board material contains a thermosetting resin and a thermally expandable microcapsule, in which the relative dielectric constant (10 GHz) of a cured product of the resin composition is more than 1.0 and 2.2 or less.