A method for forming an isolating layer of a crucible includes placing a round crucible sideways with a bottom surface of an inside thereof perpendicular to a horizontal plane, and then performing a plurality of spraying processes to form the isolating layer on the bottom surface and a wall surface of the round crucible. Each spraying process includes spraying a slurry on the bottom surface; using an optical positioner to set a spraying range the same as one of a plurality of partial areas divided from the wall surface; aligning one of the plurality of partial areas with the spraying range; fixing the round crucible and spraying the slurry in the spraying range; stopping the spraying; and rotating the round crucible to move another partial area to the spraying range. Then, the steps are repeated until the spraying of all the partial areas is completed.

A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 μm and less than or equal to 0.8 μm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 μm and less than or equal to 50 μm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.

A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 μm and less than or equal to 0.8 μm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 μm and less than or equal to 50 μm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.

A binder solution for manufacturing silicon-based anodes useful for lithium-ion electrochemical cells is described herein. The binder solution comprises a poly(carboxylic acid) binder dissolved in a mixed solvent system comprising an amide solvent of Formula I, as described herein, and a second solvent which can be water and/or an organic solvent. The binder preferably comprises poly(acrylic acid). The mixed solvent system comprises about 10 to about 99 vol % of the amide solvent of Formula I. The binder solution is utilized as a solvent for a slurry of silicon-containing particles for preparing a silicon-containing electrode. The slurries made with the mixed solvent systems have higher viscosity and are more stable than slurries containing the same concentrations of silicon particle, carbon particles, and binder in water as the sole solvent.

A binder solution for manufacturing silicon-based anodes useful for lithium-ion electrochemical cells is described herein. The binder solution comprises a poly(carboxylic acid) binder dissolved in a mixed solvent system comprising an amide solvent of Formula I, as described herein, and a second solvent which can be water and/or an organic solvent. The binder preferably comprises poly(acrylic acid). The mixed solvent system comprises about 10 to about 99 vol % of the amide solvent of Formula I. The binder solution is utilized as a solvent for a slurry of silicon-containing particles for preparing a silicon-containing electrode. The slurries made with the mixed solvent systems have higher viscosity and are more stable than slurries containing the same concentrations of silicon particle, carbon particles, and binder in water as the sole solvent.

Aqueous formulations containing antimicrobial materials dispersed in solutions or emulsions, methods of their preparation, application of such compositions to surfaces, and their resulting coatings. Coating of hydrophobic surfaces with aqueous solutions or suspensions containing antimicrobial materials are disclosed. Several applications of the antimicrobial coatings are described including the coating of solid and porous substrates such as fabrics which may be used for gowns, masks, and other personal protection equipment.

Aqueous formulations containing antimicrobial materials dispersed in solutions or emulsions, methods of their preparation, application of such compositions to surfaces, and their resulting coatings. Coating of hydrophobic surfaces with aqueous solutions or suspensions containing antimicrobial materials are disclosed. Several applications of the antimicrobial coatings are described including the coating of solid and porous substrates such as fabrics which may be used for gowns, masks, and other personal protection equipment.

The present invention comprises: an overlithiated layered oxide represented by chemical formula 1 below; and an ion-conductive coating layer on the overlithiated layered oxide represented by chemical formula 1: [chemical formula 1] .sub.rLi.sub.2MnO.sub.3.Math.(1-r)Li.sub.aNi.sub.xCo.sub.yMn.sub.zM1.sub.1−(x+y+z)O.sub.2 (in chemical formula 1, 0<r≤0.6, 0<a≤1, 0≤x≤1, 0≤y<1, 0≤z<1, and 0<x+y+z<1, and M1 is at least one selected from among Na, K, Mg, Al, Fe, Cr, Y, Sn, Ti, B, P, Zr, Ru, Nb, W, Ba, Sr, La, Ga, Mg, Gd, Sm, Ca, Ce, Fe, Al, Ta, Mo, Sc, V, Zn, Cu, In, S, B, Ge, Si, and Bi).

The present invention comprises: an overlithiated layered oxide represented by chemical formula 1 below; and an ion-conductive coating layer on the overlithiated layered oxide represented by chemical formula 1: [chemical formula 1] .sub.rLi.sub.2MnO.sub.3.Math.(1-r)Li.sub.aNi.sub.xCo.sub.yMn.sub.zM1.sub.1−(x+y+z)O.sub.2 (in chemical formula 1, 0<r≤0.6, 0<a≤1, 0≤x≤1, 0≤y<1, 0≤z<1, and 0<x+y+z<1, and M1 is at least one selected from among Na, K, Mg, Al, Fe, Cr, Y, Sn, Ti, B, P, Zr, Ru, Nb, W, Ba, Sr, La, Ga, Mg, Gd, Sm, Ca, Ce, Fe, Al, Ta, Mo, Sc, V, Zn, Cu, In, S, B, Ge, Si, and Bi).

An alkali-resistant water repellent member according to the present invention has: a silica layer on at least one surface of a base material, said silica layer having a film thickness of from 1 nm to 5 μm, while containing 50% by mass or more of silica nanoparticles and 1% by mass or more of an organosilicon compound that has a plurality of silanol groups in each molecule; and a water repellent oil repellent layer on the outer surface of the silica layer, said water repellent oil repellent layer having a film thickness of from 0.5 nm to 30 nm, while being mainly composed of a cured product of a hydrolyzable fluorine-containing organosilicon compound. This alkali-resistant water repellent member is able to easily provide various base materials with a water repellent oil repellent coating film in a stable manner, said coating film having excellent alkali resistance and wet wear resistance.