C09D1/00

POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME
20220363948 · 2022-11-17 ·

The present disclosure relates to a polishing composition for a semiconductor process that may increase a polishing rate of a boron-doped polysilicon layer, improve polishing selectivity, prevent a defect of a wafer that may occur in a polishing process, and improving surface roughness of the wafer, and a method for polishing a substrate by using the same. In addition, the present disclosure relates to a method for manufacturing a polished substrate by using a polishing composition for a semiconductor process.

Compositions and methods for the deposition of silicon oxide films

Described herein are compositions and methods for forming silicon oxide films. In one aspect, the film is deposited from at least one silicon precursor compound, wherein the at least one silicon precursor compound is selected from the following Formulae A and B: ##STR00001##
as defined herein.

Compositions and methods for the deposition of silicon oxide films

Described herein are compositions and methods for forming silicon oxide films. In one aspect, the film is deposited from at least one silicon precursor compound, wherein the at least one silicon precursor compound is selected from the following Formulae A and B: ##STR00001##
as defined herein.

Electrical steel sheet

An electrical steel sheet is described, which has an insulating coating on its surface. The insulating coating is free of chromium and comprises plate-like particles of inorganic compound and a metal phosphate. The plate-like particles of inorganic compound are in the form of secondary particles, which are formed by aggregating primary particles, and present in an amount of not less than 0.1 parts by mass and not greater than 20 parts by mass, with respect to 100 parts by mass of the metal phosphate. The secondary particles have an average particle diameter of no less than 0.05 μm and no greater than 5 μm, and have a specific surface area of 1 to 80 m.sup.2/g. The primary particles have an aspect ratio of 50 to 1000. The electrical steel sheet has excellent heat resistance, corrosion resistance, appearance, and insulating properties.

Electrical steel sheet

An electrical steel sheet is described, which has an insulating coating on its surface. The insulating coating is free of chromium and comprises plate-like particles of inorganic compound and a metal phosphate. The plate-like particles of inorganic compound are in the form of secondary particles, which are formed by aggregating primary particles, and present in an amount of not less than 0.1 parts by mass and not greater than 20 parts by mass, with respect to 100 parts by mass of the metal phosphate. The secondary particles have an average particle diameter of no less than 0.05 μm and no greater than 5 μm, and have a specific surface area of 1 to 80 m.sup.2/g. The primary particles have an aspect ratio of 50 to 1000. The electrical steel sheet has excellent heat resistance, corrosion resistance, appearance, and insulating properties.

Metal-particle dispersion composition and aqueous coating composition
11499066 · 2022-11-15 · ·

Provided is a metal-particle dispersion composition as a composition containing dispersed metal particles and being suitable for use in aqueous coating compositions, etc., the metal-particle dispersion composition comprising 10-80 mass % metal particles, 0.01-10 mass % organic titanate compound in a chelate form, 1-40 mass % water, and 2-30 mass % organic solvent having a higher boiling point than water, the amounts being based on the whole composition, wherein the organic titanate compound is an organic compound represented by Ti(OR).sub.4 (the OR groups include at least one chelatable substituent based on triethanolamine) and the organic solvent having a higher boiling point than water is a C.sub.7 or lower alcohol compound.

Metal-particle dispersion composition and aqueous coating composition
11499066 · 2022-11-15 · ·

Provided is a metal-particle dispersion composition as a composition containing dispersed metal particles and being suitable for use in aqueous coating compositions, etc., the metal-particle dispersion composition comprising 10-80 mass % metal particles, 0.01-10 mass % organic titanate compound in a chelate form, 1-40 mass % water, and 2-30 mass % organic solvent having a higher boiling point than water, the amounts being based on the whole composition, wherein the organic titanate compound is an organic compound represented by Ti(OR).sub.4 (the OR groups include at least one chelatable substituent based on triethanolamine) and the organic solvent having a higher boiling point than water is a C.sub.7 or lower alcohol compound.

Antennas Comprising MX-ENE Films And Composites
20230038621 · 2023-02-09 ·

The present disclosure is directed to antennas for transmitting and/or receiving electrical signals comprising a MXene composition, devices comprising these antennas, and methods of transmitting and receiving signals using these antennas.

Antennas Comprising MX-ENE Films And Composites
20230038621 · 2023-02-09 ·

The present disclosure is directed to antennas for transmitting and/or receiving electrical signals comprising a MXene composition, devices comprising these antennas, and methods of transmitting and receiving signals using these antennas.

ARTICLES FOR HIGH TEMPERATURE SERVICE AND RELATED METHOD
20230045780 · 2023-02-09 ·

An article for high temperature service is presented. The article includes a substrate and a thermal barrier coating disposed on the substrate. The thermal barrier coating includes a plurality of aluminum-based particles dispersed in an inorganic binder, wherein the aluminum-based particles are substantially spaced apart from each other via the inorganic binder such that the thermal barrier coating is substantially electrically and thermally insulating. Method of making the article is also presented.