Patent classifications
C09D9/00
CLEANING SOLUTION, SET OF INK AND CLEANING SOLUTION, CLEANING METHOD, CLEANING APPARATUS, PRINTING METHOD, AND PRINTING APPARATUS
Provided is cleaning solution used for cleaning ink containing water and resin, cleaning solution containing water and solvent. Solvent contains glycol ether compound represented by general formula 1. Ink film obtained by drying the ink has swelling ratio of 20 percent or higher but 150 percent or lower, where swelling ratio is calculated by mathematical formula 1 based on masses of ink film before/after immersed in cleaning solution at 25 degrees C. for 24 hours,
R.sup.1(OR.sup.2).sub.XOR.sup.3 General formula 1
In general formula 1, R.sup.1 and R.sup.3 represent hydrogen atom or alkyl group including from 1 through 4 carbon atoms, R.sup.2 represents alkyl group including from 2 through 3 carbon atoms, and X represents integer of from 1 through 4,
Swelling ratio (%)=100×[(B−A)/A] Mathematical formula 1
In mathematical formula 1, A represents mass of ink film before immersed, and B represents mass of ink film after immersed.
Compositions for removing support material from a 3D-printed object and methods of making thereof
Described are finishing solutions for removing support material and finishing 3D-printed objects. The finishing solution may contain a base (e.g., an aqueous base), an optional first caustic agent, an optional second caustic agent, an optional third caustic agent, an optional emulsifier, a polyol, a first antifoaming agent, an optional second antifoaming agent, and water. Also described are methods of using the finishing solution described herein.
Succulent extract and alginate combined solutions and products incorporating them
The invention provides a composition including a succulent extract and an alginic acid component consisting of alginic acid and/or one or more salts thereof, wherein the succulent extract is present in an amount in a range from 0.1 wt % to 1000 wt % relative to the alginic acid component, both on a dry basis.
IMPROVED METHOD FOR PURGING PAINT CIRCUITS AND WATERBORNE PURGE CLEANER
Described herein is a method for purging paint circuits coated with a non-cured paint with improved cleaning efficiency and a reduced COD (Chemical Oxygen Demand) in the wastewater, where a paint circuit is brought into contact with a waterborne purge cleaner solution including at least one glycolether and which additionally includes at least one water-soluble amine having at least 7 carbon atoms. Also described herein is a waterborne purge cleaner solution with improved cleaning efficiency and reduced VOC (Volatile Organic Compound) content as well as a concentrate for producing the purge cleaner solution.
IMPROVED METHOD FOR PURGING PAINT CIRCUITS AND WATERBORNE PURGE CLEANER
Described herein is a method for purging paint circuits coated with a non-cured paint with improved cleaning efficiency and a reduced COD (Chemical Oxygen Demand) in the wastewater, where a paint circuit is brought into contact with a waterborne purge cleaner solution including at least one glycolether and which additionally includes at least one water-soluble amine having at least 7 carbon atoms. Also described herein is a waterborne purge cleaner solution with improved cleaning efficiency and reduced VOC (Volatile Organic Compound) content as well as a concentrate for producing the purge cleaner solution.
Compositions including keto-ester compounds and methods of using the same
Compositions that include at least one low molecular weight to oxygen containing solvent and one or more compounds of formula (I) wherein R is a C.sub.1-C.sub.6 alkyl; X is a C.sub.1-C.sub.10 alkyl and n is an integer from 0 to 5. Methods of removing polymeric material containing heteroatoms from a surface by contacting the surface with such compositions and wiping the composition at least some portion of the polymeric material from the surface. ##STR00001##
METHODS OF REDUCING THE ADHESION OF A MASKANT
A method for reducing adhesion between a maskant and a substrate, wherein the maskant is adhered to a surface of the substrate, the method comprising applying a composition to the maskant.
Composition and method for removing a coating from a surface
A stripping composition and method for removing a coating, such as a water-based or oil-based paint or stain, from a surface without requiring the use of methylene chloride. The stripping composition preferably comprises at least one ether, at least one ester, at least one amine, at least one alcohol, and at least one glycoside and does not contain any methylene chloride. Preferred ingredients comprise 1,3 dioxolane, acetic acid methyl ester or a carbonate ester or both, MEA (2-aminoethanol), benzene methanol, an alkyl polyglucoside, and methylcellulose. The stripping composition is applied to a coating for a period of time between 5-10 minutes for most water and oil-based coatings and 20-90 minutes for most epoxy coatings to effectively remove at least 80% and preferably at least 90% of the coating.
Azeotrope or azeotrope-like compositions of 1,2,2-trifluoro-1-trifluoromethylcyclobutane (TFMCB) and applications thereof
The present disclosure provides minimum-boiling, homogeneous azeotropic and azeotrope-like compositions of 1,2,2-trifluoro-1-trifluoromethylcyclobutane (“TFMCB”) with each of ethanol, n-pentane, cyclopentane, trans-1,2-dichloroethylene, and perfluoro(2-methyl-3-pentanone).
COMPOSITION, SILICON-CONTAINING FILM, METHOD OF FORMING SILICON-CONTAINING FILM, AND METHOD OF TREATING SEMICONDUCTOR SUBSTRATE
A composition includes a solvent and at least one compound selected from the group consisting of: a first compound which comprises a first structural unit comprising a Si—H bond, and a second structural unit represented by formula (2), and a second compound which comprises the second structural unit represented by the formula (2). X represents a monovalent organic group having 1 to 20 carbon atoms which comprises a nitrogen atom; e is an integer of 1 to 3; R.sup.4 represents a monovalent organic group having 1 to 20 carbon atoms, or a hydroxy group, a hydrogen atom, or a halogen atom; and f is an integer of 0 to 2. A sum of e and f is no greater than 3. In the case where the at least one compound is the second compound, f is 1 or 2, and at least one R.sup.4 represents a hydrogen atom.
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