In one aspect, a cohesive product comprises a substrate and a cohesive layer provided on at least one surface of the substrate. The cohesive layer comprises a cohesive composition including a cohesive component admixed with a glitter component. The cohesive component further comprising a thickening agent in an amount sufficient to maintain the glitter component substantially uniformly distributed in the cohesive composition. In a further aspect, a method of manufacturing a cohesive produce is provided.

The invention provides a resin-thin-film-forming composition employed in hydrofluoric acid etching, which composition contains a hydrogenated polybutadiene compound having a (meth)acrylic group and a radical polymerization initiator.

An electrophotographic apparatus comprising an electrophotographic photosensitive member, a charging device and a developing device, wherein the charging device comprises a conductive member arranged to be capable of contacting the electrophotographic photosensitive member, a conductive layer of the conductive member comprises a matrix domain structure, at least a part of the domains Dt is exposed at the conductive member outer surface, the matrix has a volume resistivity R1 of larger than 1.00×10.sup.12 Ω.Math.cm, the domains Dt has a volume resistivity of smaller than R1, the developing device comprises the toner, domains Dc formed of the crystalline material exist in a cross section of the toner, distances between adjacent wall surfaces of the domains Dc is from 30 to 1,100 nm, and a weight-average particle diameter D4 of the toner and distances Dms between adjacent wall surfaces between the domains Dt satisfies D4≥Dms.

The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.

The present invention provides a process for preparing a pre-treated low Dk-type glass fabric for constituting a circuit board, comprising pre-treating low Dk-type glass fabric with a pre-treating varnish having a Dk close to the Dk of the used low Dk-type glass fabric at different temperatures and having a small Df. The present invention further provides a bonding sheet and a circuit board prepared thereby. The circuit boards prepared by the preparation process of the present invention have a Dk having small differences in warp and weft directions, and can effectively solve the problem of signal propagation delay. The circuit boards have a small Df, so as to have a small signal loss. Meanwhile, the cured, partially-cured or uncured dry glue obtained after drying the solvent of the pre-treating varnish has similar dielectric properties at different temperatures to the used low Dk-type glass fabric, so that the circuit boards have a very small signal propagation delay at different temperatures.

An elastic body layer is composed of a conductive rubber composition containing an isoprene rubber, a rubber other than the isoprene rubber, and carbon black. The elastic body layer is phase-separated into a first rubber phase containing the isoprene rubber and a second rubber phase containing the rubber other than the isoprene rubber; in the range of a 5 μm×5 μm square of an arbitrary cross section of the elastic body layer, the area ratio of the first rubber phase is within a range of 10 to 90%. The resistance value of the elastic body layer is within a range of 1.0×10.sup.3 to 1.0×10.sup.6Ω. A surface layer contains an electronic conductive agent and a crosslinked body of at least one polyurethane resin of an ether polyurethane resin and a carbonate polyurethane resin, and the glass transition point of the surface layer is within a range of −10 to −70° C.

An elastic body layer is composed of a conductive rubber composition containing an isoprene rubber, a rubber other than the isoprene rubber, and carbon black. The elastic body layer is phase-separated into a first rubber phase containing the isoprene rubber and a second rubber phase containing the rubber other than the isoprene rubber; in the range of a 5 μm×5 μm square of an arbitrary cross section of the elastic body layer, the area ratio of the first rubber phase is within a range of 10 to 90%. The resistance value of the elastic body layer is within a range of 1.0×10.sup.3 to 1.0×10.sup.6Ω. A surface layer contains an electronic conductive agent and a crosslinked body of at least one polyurethane resin of an ether polyurethane resin and a carbonate polyurethane resin, and the glass transition point of the surface layer is within a range of −10 to −70° C.

Disclosed herein are an anisotropic conductive film including a polymer layer that restricts a movement of conductive particles and a method of manufacturing the same. An anisotropic conductive film (ACF) including a plurality of conductive particles according to an embodiment includes a polymer layer in which the plurality of conductive particles is dispersed and disposed and which restricts a movement of the plurality of conductive particles by capturing the conductive particles and an adhesive layer configured on the upper and lower parts of the polymer layer to assign adhesiveness.

Disclosed herein are an anisotropic conductive film including a polymer layer that restricts a movement of conductive particles and a method of manufacturing the same. An anisotropic conductive film (ACF) including a plurality of conductive particles according to an embodiment includes a polymer layer in which the plurality of conductive particles is dispersed and disposed and which restricts a movement of the plurality of conductive particles by capturing the conductive particles and an adhesive layer configured on the upper and lower parts of the polymer layer to assign adhesiveness.

The present invention relates to new coating compositions for the preparation of functional surface coatings on various base material substrates. The coating compositions are polysilazane polybutadiene hybrid coating compositions which are based on a silazane polymer and a specific functionalized butadiene polymer. The coating compositions are particularly suitable for the preparation of functional surface coatings on various base material substrates to provide improved physical and/or chemical surface properties.