The present disclosure provides a resin composition, including: a component (A): 100 parts by weight of an unhydrogenated maleic anhydride-modified first polyolefin; a component (B): 20 to 100 parts by weight of an acrylate monomer, its oligomer or combination thereof, the acrylate monomer has at least two unsaturated carbon-carbon double bonds; and a component (C): 5 to 160 parts by weight of a benzocyclobutene-modified second polyolefin. In addition, the present disclosure also provides an article made from the resin composition. The resin composition and the product have improvements in one or more properties including solder floating crack rate, copper foil peeling strength, percent of thermal expansion at Z-axis, water absorption ratio, and dissipation factor. The present disclosure also provides a use of the resin composition in the resin filling process of printed circuit boards.