C09D135/00

CURABLE COMPOUND

Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (T.sub.d5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.

Method of producing structure containing phase-separated structure

A method of producing a structure containing a phase-separated structure, including: a step of using a resin composition for forming a phase-separated structure including a block copolymer and an ion liquid containing a compound (IL) having a cation moiety and an anion moiety to form a BCP layer (3) containing a block copolymer on a substrate (1); and a step of vaporizing at least a part of the compound (IL), and phase-separating the BCP layer (3) to obtain a structure (3′) containing a phase-separated structure.

Polymer coatings

The present disclosure relates to polymer coatings covalently attached to the surface of a substrate and the preparation of the polymer coatings, such as poly(N-(5-azidoacetamidylpentyl)acrylamide-co-acrylamide) (PAZAM), in the formation and manipulation of substrates, such as molecular arrays and flow cells. The present disclosure also relates to methods of preparing a substrate surface by using beads coated with a covalently attached polymer, such as PAZAM, and the method of determining a nucleotide sequence of a polynucleotide attached to a substrate surface described herein.

Polymer coatings

The present disclosure relates to polymer coatings covalently attached to the surface of a substrate and the preparation of the polymer coatings, such as poly(N-(5-azidoacetamidylpentyl)acrylamide-co-acrylamide) (PAZAM), in the formation and manipulation of substrates, such as molecular arrays and flow cells. The present disclosure also relates to methods of preparing a substrate surface by using beads coated with a covalently attached polymer, such as PAZAM, and the method of determining a nucleotide sequence of a polynucleotide attached to a substrate surface described herein.

Multifunctional bonding of hydrogels

A robust hydrogel-solid hybrid formed of a substrate material having a nonporous and non-topographically patterned surface and a tough hydrogel bonded to the surface, the tough hydrogel having over 90 wt % water, and the hydrogel being bonded to provide interfacial toughness over 300 Jm.sup.2, and even over 1000 Jm.sup.2. The hydrogel is formed of polyacrylamide or polyethylene glycol diacrylate, which provide long-chain polymer networks, and chitosan, hyaluronan, or alginate, which provide mechanically dissipative components. An anchor, which can be a silane, a sulfide, or an amine, is disposed between the surface and the hydrogel to provide chemical bonding between the surface and the long-chain networks of the hydrogel.

Multifunctional bonding of hydrogels

A robust hydrogel-solid hybrid formed of a substrate material having a nonporous and non-topographically patterned surface and a tough hydrogel bonded to the surface, the tough hydrogel having over 90 wt % water, and the hydrogel being bonded to provide interfacial toughness over 300 Jm.sup.2, and even over 1000 Jm.sup.2. The hydrogel is formed of polyacrylamide or polyethylene glycol diacrylate, which provide long-chain polymer networks, and chitosan, hyaluronan, or alginate, which provide mechanically dissipative components. An anchor, which can be a silane, a sulfide, or an amine, is disposed between the surface and the hydrogel to provide chemical bonding between the surface and the long-chain networks of the hydrogel.

Curable aqueous composition
10870776 · 2020-12-22 · ·

The present invention provides a curable aqueous composition comprising a (co)polymer and an epoxy crosslinker. The (co)polymer comprises, as (co)polymerized units, from 0.05% to 10% by dry weight, based on total monomers of the (co)polymer, ethylenically unsaturated acidic monomers having at least two carboxylic acid groups, and the epoxy crosslinker is an aliphatic compound having at least two reactive oxirane groups. It further provides a method for forming a treated substrate and a substrate formed by the method.

Curable aqueous composition
10870776 · 2020-12-22 · ·

The present invention provides a curable aqueous composition comprising a (co)polymer and an epoxy crosslinker. The (co)polymer comprises, as (co)polymerized units, from 0.05% to 10% by dry weight, based on total monomers of the (co)polymer, ethylenically unsaturated acidic monomers having at least two carboxylic acid groups, and the epoxy crosslinker is an aliphatic compound having at least two reactive oxirane groups. It further provides a method for forming a treated substrate and a substrate formed by the method.

Curable aqueous composition
10870776 · 2020-12-22 · ·

The present invention provides a curable aqueous composition comprising a (co)polymer and an epoxy crosslinker. The (co)polymer comprises, as (co)polymerized units, from 0.05% to 10% by dry weight, based on total monomers of the (co)polymer, ethylenically unsaturated acidic monomers having at least two carboxylic acid groups, and the epoxy crosslinker is an aliphatic compound having at least two reactive oxirane groups. It further provides a method for forming a treated substrate and a substrate formed by the method.

MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND FOR FORMING ORGANIC FILM

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent,

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noting that in the general formula (1A), when W.sub.1 represents any of

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R.sub.1 does not represent any of

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