Coated articles are provided comprising: (a) a substrate that demonstrates electrical conductivity, wherein the substrate is an electronic component of a circuit assembly; (b) a moisture barrier coating layer; and (c) an encapsulating plastic coating layer. The moisture barrier coating layer may be applied to the surface of the substrate with the encapsulating plastic coating layer applied on top of the moisture barrier coating layer, or vice versa.

The present invention provides a compound represented by following formula (0):

##STR00001##

The present invention provides a compound represented by following formula (0):

##STR00001##

The present invention aims to provide a photocurable resin composition capable of constituting a composition having high printability. The present invention relates to a photocurable resin composition containing (A) an allylic polymer produced by polymerization of an allylic compound represented by the following formula (I), and (B) a gelling agent, ##STR00001##
wherein R.sup.1 and R.sup.2 each represent H or CH.sub.3; X represents an a-valent group having an unsubstituted saturated or partially unsaturated four- to eight-membered cyclic structure; and a represents 2 or 3.

The present invention aims to provide a photocurable resin composition capable of constituting a composition having high printability. The present invention relates to a photocurable resin composition containing (A) an allylic polymer produced by polymerization of an allylic compound represented by the following formula (I), and (B) a gelling agent, ##STR00001##
wherein R.sup.1 and R.sup.2 each represent H or CH.sub.3; X represents an a-valent group having an unsubstituted saturated or partially unsaturated four- to eight-membered cyclic structure; and a represents 2 or 3.

Thermosetting resin composition, prepreg and metal foil clad laminate made therefrom. The thermosetting resin composition comprises (A): a solvent-soluble multifunctional vinyl aromatic copolymer, wherein same is a multifunctional vinyl aromatic copolymer having structural units from monomers comprising a divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and (B), wherein same is selected from olefin resins having a number-average molecular weight of 500-10,000 and containing 10%-50% by weight of a styrene structure, and the molecules thereof contain a 1,2-addition butadiene structure. The prepreg and copper foil clad laminate made from the thermosetting resin composition of the present invention have a good toughness, and maintain a high glass transition temperature, a low water absorption, excellent dielectric properties and damp heat resistance thereof, and are suitable for use in the field of high frequency and high speed printed circuit boards, and are also suitable for processing multilayer printed circuit boards.

Thermosetting resin composition, prepreg and metal foil clad laminate made therefrom. The thermosetting resin composition comprises (A): a solvent-soluble multifunctional vinyl aromatic copolymer, wherein same is a multifunctional vinyl aromatic copolymer having structural units from monomers comprising a divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and (B), wherein same is selected from olefin resins having a number-average molecular weight of 500-10,000 and containing 10%-50% by weight of a styrene structure, and the molecules thereof contain a 1,2-addition butadiene structure. The prepreg and copper foil clad laminate made from the thermosetting resin composition of the present invention have a good toughness, and maintain a high glass transition temperature, a low water absorption, excellent dielectric properties and damp heat resistance thereof, and are suitable for use in the field of high frequency and high speed printed circuit boards, and are also suitable for processing multilayer printed circuit boards.

A primer composition and a copper foil substrate using the same are provided. The primer composition includes a mixture of a hydrocarbon resin and a compound having three or more carbon-carbon double bonds, wherein a molar ratio of the hydrocarbon resin to the compound having three or more carbon-carbon double bonds is 1:0.2 to 1:10.

A primer composition and a copper foil substrate using the same are provided. The primer composition includes a mixture of a hydrocarbon resin and a compound having three or more carbon-carbon double bonds, wherein a molar ratio of the hydrocarbon resin to the compound having three or more carbon-carbon double bonds is 1:0.2 to 1:10.

A moisture barrier coating includes the reaction product of (A) at least one polyglycidyl ether resin, and (B) at least one epoxy curing agent comprising amines. The moisture barrier coating further includes at least one amorphous thermoplastic material that is nonreactive with A and with B, and that forms a homogeneous mixture with at least one of A or B. A controlled release fertilizer, a method for the production of a controlled release fertilizer, and a moisture barrier coating system are also disclosed.