C09D147/00

UV-CURABLE COMPOSITIONS COMPRISING CLEAVAGE TYPE PHOTOINITIATORS

The present invention is drawn to UV-curable ink and coating compositions comprising cleavage type photoinitiators and acids. The acids may be inorganic or organic acids, or acids generated by a photoacid generator during UV-cure. Incorporation of the acids into the UV-curable ink and coating compositions results in a reduction of migratable photodecomposition products that are produced by cleavage type photoinitiators during UV-cure. The ink and coating compositions are particularly useful for use in applications that require low migration of low molecular weight materials, such as, for example, food packaging.

Multifunctional water-borne high solids tile paint

Described herein is a coated building panel that comprises a side surface that is textured and exhibits a white and/or color. The building panel comprising an upper surface opposite a lower surface and a side surface extending between the upper surface and the lower surface, a coating applied to the side surface, the coating comprising an inorganic particle having a disk shape and an ionic dispersant comprising an ionic group that are present on a repeating unit and the ionic dispersant comprising at least two of the repeating units.

Multifunctional water-borne high solids tile paint

Described herein is a coated building panel that comprises a side surface that is textured and exhibits a white and/or color. The building panel comprising an upper surface opposite a lower surface and a side surface extending between the upper surface and the lower surface, a coating applied to the side surface, the coating comprising an inorganic particle having a disk shape and an ionic dispersant comprising an ionic group that are present on a repeating unit and the ionic dispersant comprising at least two of the repeating units.

RESIN COMPOSITION, AND PREPREG AND CIRCUIT MATERIAL USING THE SAME
20210301130 · 2021-09-30 ·

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

RESIN COMPOSITION, AND PREPREG AND CIRCUIT MATERIAL USING THE SAME
20210301130 · 2021-09-30 ·

The present application provides a resin component, and a prepreg and a circuit material using the same. The resin component comprises unsaturated polyphenylene ether resin, polyolefin resin, terpene resin and an initiator. When the total weight of the unsaturated polyphenylene ether resin, polyolefin resin and terpene resin is defined as 100 parts by weight, the terpene resin is in an amount of 3-40 parts by weight. The polyolefin resin is one or a combination of at least two selected from the group consisting of unsaturated polybutadiene resin, SBS resin and styrene butadiene resin. The present application discloses that the resulting resin composition has good film-forming properties, adhesion and dielectric properties through the coordination of unsaturated polyphenylene ether resin, unsaturated polyphenylene ether resin, polyolefin resin and terpene resin, and the circuit boards using the same have higher interlayer peel strength and lower dielectric loss.

MICROORGANISMS AND METHODS FOR PRODUCING BUTADIENE AND RELATED COMPOUNDS BY FORMATE ASSIMILATION

Provided herein are non-naturally occurring microbial organisms having a FaldFP, a FAP and/or metabolic modifications which can further include a MMP, a MOP, a hydrogenase and/or a CODH. These microbial organisms can further include a butadiene, 13BDO, CrotOH, MVC or 3-buten-1-ol pathway. Additionally provided are methods of using such microbial organisms to produce butadiene, 13BDO, CrotOH, MVC or 3-buten-1-ol.

MICROORGANISMS AND METHODS FOR PRODUCING BUTADIENE AND RELATED COMPOUNDS BY FORMATE ASSIMILATION

Provided herein are non-naturally occurring microbial organisms having a FaldFP, a FAP and/or metabolic modifications which can further include a MMP, a MOP, a hydrogenase and/or a CODH. These microbial organisms can further include a butadiene, 13BDO, CrotOH, MVC or 3-buten-1-ol pathway. Additionally provided are methods of using such microbial organisms to produce butadiene, 13BDO, CrotOH, MVC or 3-buten-1-ol.

Composition containing fluorinated polymer and method for producing fluorinated polymer film-provided substrate
11084946 · 2021-08-10 · ·

To provide a composition which comprises a fluorinated polymer having an alicyclic ring, from which a film having excellent in-plane uniformity and small surface roughness can be formed by an electrospraying apparatus, and a method for producing a film-provided substrate using the composition. A composition comprising a fluorinated polymer having an alicyclic ring and a solvent, wherein the solvent contains at least one high boiling point solvent having a boiling point of at least 150° C., and the solvent has a dielectric constant of at least 5. And, a method for producing a film-provided substrate, which comprises applying the composition to a substrate by an electrospraying apparatus to form a film containing the fluorinated polymer.

Composition containing fluorinated polymer and method for producing fluorinated polymer film-provided substrate
11084946 · 2021-08-10 · ·

To provide a composition which comprises a fluorinated polymer having an alicyclic ring, from which a film having excellent in-plane uniformity and small surface roughness can be formed by an electrospraying apparatus, and a method for producing a film-provided substrate using the composition. A composition comprising a fluorinated polymer having an alicyclic ring and a solvent, wherein the solvent contains at least one high boiling point solvent having a boiling point of at least 150° C., and the solvent has a dielectric constant of at least 5. And, a method for producing a film-provided substrate, which comprises applying the composition to a substrate by an electrospraying apparatus to form a film containing the fluorinated polymer.

Use of latent metathesis polymerization systems for additive manufacturing

The invention is directed to latent metathesis-active resin compositions and additive manufacturing approaches. The latent metathesis-active compositions comprise at least one latent metathesis catalyst, at least one curable metathesis-active monomer, and optional fillers, photosensitizers, and/or a secondary monomer resin system for dual-cure. A method comprises extruding a latent metathesis-active resin from a dispensing apparatus and spatially triggering a ring-opening metathesis polymerization by directed irradiation with light or directed application of a thermal stimuli for direct-ink write printing of objects. Another method uses a latent metathesis-active resin for vat photopolymerization and stereolithographic printing of objects.