The present invention provides a resist underlayer forming composition, which is well in heat resistance and gap filling. Further, the present invention provides methods of manufacturing a resist underlayer and semiconductor device using it. [Means for Solution] A composition comprising a allyloxy derivative having a specific group and a solvent, and methods of manufacturing a resist underlayer and semiconductor device using it.

Disclosed is a coating comprising a polymeric layer, wherein the polymeric layer comprises a reaction product of a first monomer comprising two or more aromatic acetylene groups and a second monomer comprising two or more cyclopentadienone groups, or a cured product of the reaction product. The coating may or may not additionally contain a crosslinker and/or a thermal acid generator. Optical thin films made from the coatings exhibit refractive indices that make them useful as interlayers for matching refractive indices between adjacent layers of display devices; thereby improving device output efficiency.

Disclosed is a coating comprising a polymeric layer, wherein the polymeric layer comprises a reaction product of a first monomer comprising two or more aromatic acetylene groups and a second monomer comprising two or more cyclopentadienone groups, or a cured product of the reaction product. The coating may or may not additionally contain a crosslinker and/or a thermal acid generator. Optical thin films made from the coatings exhibit refractive indices that make them useful as interlayers for matching refractive indices between adjacent layers of display devices; thereby improving device output efficiency.

A material for forming an organic film, including: a compound for forming an organic film shown by the following general formula (1A); and an organic solvent, where W.sub.1 represents a tetravalent organic group, n1 an integer of 0 or 1, n2 an integer of 1 to 3, and R.sub.1 an alkynyl group having 2 to 10 carbon atoms. A compound for forming an organic film is cured not only under air, but also under film formation conditions of inert gas, and forms an organic film having not only excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but also favorable adhesion to a substrate, and a material for forming an organic film containing the compound, and a substrate for manufacturing a semiconductor device using the material, a method for forming an organic film using the material, and a patterning process using the material.

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A material for forming an organic film, including: a compound for forming an organic film shown by the following general formula (1A); and an organic solvent, where W.sub.1 represents a tetravalent organic group, n1 an integer of 0 or 1, n2 an integer of 1 to 3, and R.sub.1 an alkynyl group having 2 to 10 carbon atoms. A compound for forming an organic film is cured not only under air, but also under film formation conditions of inert gas, and forms an organic film having not only excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but also favorable adhesion to a substrate, and a material for forming an organic film containing the compound, and a substrate for manufacturing a semiconductor device using the material, a method for forming an organic film using the material, and a patterning process using the material.

##STR00001##

Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (T.sub.d5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.

Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (T.sub.d5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.

The present invention provides a resist underlayer forming composition, which is well in heat resistance and gap filling. Further, the present invention provides methods of manufacturing a resist underlayer and semiconductor device using it. [Means for Solution] A composition comprising a allyloxy derivative having a specific group and a solvent, and methods of manufacturing a resist underlayer and semiconductor device using it.

The present invention provides a resist underlayer forming composition, which is well in heat resistance and gap filling. Further, the present invention provides methods of manufacturing a resist underlayer and semiconductor device using it. [Means for Solution] A composition comprising a allyloxy derivative having a specific group and a solvent, and methods of manufacturing a resist underlayer and semiconductor device using it.

Disclosed is a coating comprising a polymeric layer, wherein the polymeric layer comprises a reaction product of a first monomer comprising two or more aromatic acetylene groups and a second monomer comprising two or more cyclopentadienone groups, or a cured product of the reaction product. The coating may or may not additionally contain a crosslinker and/or a thermal acid generator. Optical thin films made from the coatings exhibit refractive indices that make them useful as interlayers for matching refractive indices between adjacent layers of display devices; thereby improving device output efficiency.