Provided herein are the polymers shown below. The value n is a positive integer. R.sup.1 is an organic group, and each R.sup.2 is H or a chemisorbed group, with at least one R.sup.2 being a chemisorbed group. The polymer may be a nanostructured film. Also provided herein is a method of: converting a di-p-xylylene paracyclophane dimer to a reactive vapor of monomers; depositing the reactive vapor onto a substrate held at an angle relative to the vapor flux to form nanostructured poly(p-xylylene) film; reacting the film with an agent to form hydrogen atoms that are reactive with a precursor of a chemisorbed group, if the film does not contain the hydrogen atoms; and reacting the hydrogen atoms with the precursor. Also provided herein is a device having a nanostructured poly(p-xylylene) film on a pivotable substrate. The film has directional hydrophobic or oleophobic properties and directional adhesive properties.

##STR00001##

To provide a thermosetting resin composition which is useful for an antenna module capable of coping with a signal in a high-frequency band and having excellent mesh passability. Specifically disclosed is a thermosetting resin composition containing (A) a thermosetting resin and (B) at least one inorganic filler selected from the group consisting of a titanium-based inorganic filler and a zircon-based inorganic filler, in which in the component (B), a content of particles having a particle diameter of 1.0 m or less is 30% by volume or less based on the component (B). And to provide a prepreg, a resin film, a laminate, a printed wiring board, an antenna device, an antenna module, and a communication device obtained by using the thermosetting resin composition.

An object of the present invention is to provide a masking material having excellent peeling properties even if the drying step is reduced, preferably without the drying step. There is provided a curable composition comprising: (A1) a prepolymer represented by (Formula 1): (CH.sub.2C(R.sup.1)COOR.sup.2OCONHR.sup.3NHCO).sub.nR.sup.4 wherein each of R.sup.1 is independently a hydrogen atom or a methyl group, each of R.sup.2 is independently an aliphatic group having 1 to 8 carbon atoms, each of R.sup.3 is independently an aromatic or aliphatic group having 1 to 30 carbon atoms and R.sup.4 is an aromatic or aliphatic group having a number average molecular weight at least 500 and having a polycarbonate backbone and/or a polyester backbone and n is an integer from 2 to 4 and (A2) a non-polymer represented by (Formula 2): (CH.sub.2C(R.sup.5)COOR.sup.6OCONH).sub.mR.sup.7 wherein each of R.sup.5 is independently a hydrogen atom or a methyl group, each of R.sup.6 is independently an aliphatic group having 1 to 8 carbon atoms, R.sup.7 is independently an aromatic or aliphatic group having 1 to 30 carbon atoms and m is an integer from 2 to 4.

The present invention provides: a maleimide resin mixture having an excellent low dielectric loss tangent and excellent storage stability in varnished form; a curable resin composition; and a cured product thereof. The maleimide resin mixture comprises: a maleimide resin having repeating units represented by formulas (a) and (b); and bis(3-ethyl-5-methyl-4-maleimidephenyl)methane represented by formula (c), wherein the content of the bismaleimide represented by formula (c) in the total amount of the maleimide resin mixture is 5.0-30.0 area % in terms of GPC area percentage. In the formulas, m is the average number of repetitions and is 0<m<200. n is the average number of repetitions and is 0<n<100. (a) and (b) are each bonded at *, and repetition positions may be random.

##STR00001##