The invention discloses a method for preparation of acetoacetate ester compounds with amino alcohol catalysts which are themselves diketenized in the course of the diketenization reaction; and subsequent polymerization of these acetoacetate ester compounds with e.g. acrylate compounds to provide resins, whereby the acetoacetylated amino alcohol catalyst partakes in the polymerization reaction.

A method of making a shaped article comprising printing layers of a polymer composition comprising at least one PEEK-PEmEK copolymer having R.sub.PEEK and R.sub.PEmEK repeat units in a molar ratio R.sub.PEEK/R.sub.PEmEK ranging from 95/5 to 45/55, the polymer composition optionally including at least one reinforcing filler, at least one additive, or a combination thereof, and shaped articles obtained from the method. Also described are methods of making the PEEK-PEmEK copolymer and methods of making the polymer composition.

A method of making a shaped article comprising printing layers of a polymer composition comprising at least one PEEK-PEmEK copolymer having R.sub.PEEK and R.sub.PEmEK repeat units in a molar ratio R.sub.PEEK/R.sub.PEmEK ranging from 95/5 to 45/55, the polymer composition optionally including at least one reinforcing filler, at least one additive, or a combination thereof, and shaped articles obtained from the method. Also described are methods of making the PEEK-PEmEK copolymer and methods of making the polymer composition.

A coated polymer film, such as a coated polyester film, is disclosed. In one embodiment, the coated film may be used as a substrate for digital printing. In one embodiment, the coating contains an anionic anti-static agent comprising a sulphonated copolyester resin. In an alternative embodiment, the coating contains an anti-static agent comprising an organometallic, such as an organo zirconate, in combination with metal oxide particles. The metal oxide particles may comprise nanoparticles. In one embodiment, the coating can further contain a print enhancing agent and an adhesion promoter.

The present invention generally relates a polymer-metal junction comprising PEEK-PEmEK copolymers compositions, in contact with a metal substrate, wherein the PEEK-PEmEK copolymer having R.sub.PEEK and R.sub.PEmEK repeat units in a molar ratio R.sub.PEEK/R.sub.PEmEK ranging from 95/5 to 45/55. The present invention also relates to shaped articles including the polymer-metal junction, and methods of making the polymer-metal junctions.

The present invention generally relates a polymer-metal junction comprising PEEK-PEmEK copolymers compositions, in contact with a metal substrate, wherein the PEEK-PEmEK copolymer having R.sub.PEEK and R.sub.PEmEK repeat units in a molar ratio R.sub.PEEK/R.sub.PEmEK ranging from 95/5 to 45/55. The present invention also relates to shaped articles including the polymer-metal junction, and methods of making the polymer-metal junctions.

A method of making a PEEK-PEmEK copolymer having R.sub.PEEK and R.sub.PEmEK repeat units in a molar ratio R.sub.PEEK/R.sub.PEmEK ranging from 95/5 to 45/55, the PEEK-PEmEK copolymer obtained from the method and the polymer composition including the PEEK-PEmEK copolymer, at least one reinforcing filler, at least one additive, or a combination thereof, shaped articles including the polymer composition, polymer-metal junctions including the polymer composition. Also described are methods of making the polymer composition, methods of making the shaped articles, and methods of making the polymer-metal junctions.

The present invention provides a composition for forming an organic film, containing a polymer compound having one or more of repeating units shown by the general formulae (1) to (4) and an organic solvent containing one or more compounds selected from propylene glycol esters, ketones, and lactones, with a total concentration of more than 30 wt % with respect to the whole organic solvent. There can be provided a composition capable of forming an organic film that can be easily removed, together with a silicon residue modified by dry etching, in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process. ##STR00001##

The present invention provides a composition for forming an organic film, containing a polymer compound having one or more of repeating units shown by the general formulae (1) to (4) and an organic solvent containing one or more compounds selected from propylene glycol esters, ketones, and lactones, with a total concentration of more than 30 wt % with respect to the whole organic solvent. There can be provided a composition capable of forming an organic film that can be easily removed, together with a silicon residue modified by dry etching, in a wet manner with a removing liquid harmless to a semiconductor apparatus substrate and an organic resist underlayer film required in the patterning process, for example, an ammonia aqueous solution containing hydrogen peroxide called SC1, which is commonly used in the semiconductor manufacturing process. ##STR00001##

A coated polymer film, such as a coated polyester film, is disclosed. In one embodiment, the coated film may be used as a substrate for digital printing. In one embodiment, the coating contains an anionic anti-static agent comprising a sulphonated copolyester resin. In an alternative embodiment, the coating contains an anti-static agent comprising an organometallic, such as an organo zirconate, in combination with metal oxide particles. The metal oxide particles may comprise nanoparticles. In one embodiment, the coating can further contain a print enhancing agent and an adhesion promoter.