The present invention relates to azeotropic blends and pseudoazeotropic blends and to coating compositions including such blends. In one aspect, an azeotropic blend or a pseudoazeotropic blend consists essentially of hexamethyldisiloxane and a second component selected from the following: isobutanol, n-propyl acetate, n-butanol, and 1-methoxy-2-propanol.

The present invention relates to azeotropic blends and pseudoazeotropic blends and to coating compositions including such blends. In one aspect, an azeotropic blend or a pseudoazeotropic blend consists essentially of hexamethyldisiloxane and a second component selected from the following: isobutanol, n-propyl acetate, n-butanol, and 1-methoxy-2-propanol.

Provided is a surface protectant that suppresses corrosion of a semiconductor wafer surface by a basic compound, and reduces defects in the semiconductor wafer. The semiconductor wafer surface protectant of the present invention includes a compound represented by Formula (1) below;
R.sup.1O—(C.sub.3H.sub.6O.sub.2).sub.n—H  (1) where R.sup.1 denotes a hydrogen atom, a hydrocarbon group that has from 1 to 24 carbon atoms and may have a hydroxyl group, or a group represented by R.sup.2CO, where the R.sup.2 denotes a hydrocarbon group having from 1 to 24 carbon atoms; and n indicates an average degree of polymerization of a glycerin unit shown in the parentheses, and is from 2 to 60.

Provided is a surface protectant that suppresses corrosion of a semiconductor wafer surface by a basic compound, and reduces defects in the semiconductor wafer. The semiconductor wafer surface protectant of the present invention includes a compound represented by Formula (1) below;
R.sup.1O—(C.sub.3H.sub.6O.sub.2).sub.n—H  (1) where R.sup.1 denotes a hydrogen atom, a hydrocarbon group that has from 1 to 24 carbon atoms and may have a hydroxyl group, or a group represented by R.sup.2CO, where the R.sup.2 denotes a hydrocarbon group having from 1 to 24 carbon atoms; and n indicates an average degree of polymerization of a glycerin unit shown in the parentheses, and is from 2 to 60.

A hardener for epoxy resins includes at least one amine of the formula (I) and an amine-functional adduct of at least one polyoxyalkylene polyamine and a diepoxide. The hardener enables transparent epoxy resin compositions of high clarity, which are free of toxic diluents such as nonylphenol, upon curing show a low heat generation but still cure fast and reliably and have a high robustness against yellowing. Such epoxy resin compositions are particularly suitable as casting resin for the manufacturing of transparent articles with a glass-like appearance.

The radiation-curable coating compositions disclosed herein are provided for use as photo-stable coatings for an optical article substrate. The compositions may be applied by a variety of methods, including spin coating, dip coating, and inkjet coating. The coating compositions are fast cured and exhibit robust adhesion to the substrates.

The radiation-curable coating compositions disclosed herein are provided for use as photo-stable coatings for an optical article substrate. The compositions may be applied by a variety of methods, including spin coating, dip coating, and inkjet coating. The coating compositions are fast cured and exhibit robust adhesion to the substrates.

In general, the present invention is directed to a gypsum board comprising a gypsum core and a glass mat facing material including a coating. The coating comprises a resin including an acrylic resin, a siloxane rubber, or a mixture thereof and hydrophobic additive comprising an organosilane. The gypsum board passes at least one of the three air and water barrier tests specified in AC-212 wherein the tests comprise a water penetration barrier test as conducted in accordance with ASTM E331-00, a hydrostatic head test as conducted in accordance with AATCC 127-2008, or an air barrier test as conducted in accordance with ASTM E2357-11.

In general, the present invention is directed to a gypsum board comprising a gypsum core and a glass mat facing material including a coating. The coating comprises a resin including an acrylic resin, a siloxane rubber, or a mixture thereof and hydrophobic additive comprising an organosilane. The gypsum board passes at least one of the three air and water barrier tests specified in AC-212 wherein the tests comprise a water penetration barrier test as conducted in accordance with ASTM E331-00, a hydrostatic head test as conducted in accordance with AATCC 127-2008, or an air barrier test as conducted in accordance with ASTM E2357-11.

The invention relates to an aqueous resin dispersion D comprising a mixture of a hydrophilically modified epoxy-based resin P and a resole R, and a co-crosslinker E, to a process for the preparation of the aqueous resin dispersion D, and to a method of use thereof to prepare coating films to prevent corrosion of the coated substrate.