A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

The present invention relates to a particulate filler which has a coating on support particles in each case surrounding the latter, which comprises a titanium dioxide doped with niobium and at least one further element, to a process for the preparation of a particulate filler of this type and to the use thereof, in particular as varistor filler having nonlinear electrical properties in coating compositions and moulding compounds.

The present invention relates to a particulate filler which has a coating on support particles in each case surrounding the latter, which comprises a titanium dioxide doped with niobium and at least one further element, to a process for the preparation of a particulate filler of this type and to the use thereof, in particular as varistor filler having nonlinear electrical properties in coating compositions and moulding compounds.

An object of the present invention is to provide a composition capable of forming a thermally conductive material having excellent thermally conductive properties and excellent handleability in a semi-cured state. In addition, another object of the present invention is to provide a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer.

The composition of the present invention contains a phenolic compound, an epoxy compound, a compound represented by Formula (1), and an inorganic nitride.

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An object of the present invention is to provide a composition capable of forming a thermally conductive material having excellent thermally conductive properties and excellent handleability in a semi-cured state. In addition, another object of the present invention is to provide a thermally conductive material, a thermally conductive sheet, and a device with a thermally conductive layer.

The composition of the present invention contains a phenolic compound, an epoxy compound, a compound represented by Formula (1), and an inorganic nitride.

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According to an example aspect of the present invention, there is provided a composition comprising colloidal lignin particles and an epoxy compound.

According to an example aspect of the present invention, there is provided a composition comprising colloidal lignin particles and an epoxy compound.

According to an example aspect of the present invention, there is provided a composition comprising colloidal lignin particles and an epoxy compound.

The present description provides a Michael Addition curable composition, comprising A) at least one reactive donor capable of providing two or more nucleophilic carbanions; B) at least one reactive acceptor comprising two or more carbon-carbon double bonds; and C) at least one catalyst for catalyzing the Michael Addition crosslinking reaction between the at least one reactive donor and the at least one reactive acceptor. The present description further provides a coating composition containing the composition and a coated article made therefrom.