Patent classifications
C09D179/00
BARRIER COATING STRUCTURE
The present disclosure provides a barrier-coating structure that includes a polymer-matrix composite having a first surface and a second surface. The barrier-coating structure includes a flexible layer having a first surface and a second surface and a sol-gel layer having a first surface and a second surface. The first surface of the flexible layer contacts the second surface of the flexible layer. The barrier-coating structure includes a barrier layer having a first surface and a second surface. The sol-gel and/or the barrier layer may comprise one or more reactive substituents. The first surface of the barrier layer may be a laser-ablated surface.
USE OF BENZOXAZINE AS A STRUCTURAL THERMAL PROTECTIVE SYSTEM (TPS) AND HEAT SHIELD MATERIAL
A heat shield includes a substrate having a surface; and a benzoxazine composite material disposed onto the surface of the substrate, the benzoxazine composite material comprising a benzoxazine compound and a reinforcing fiber.
USE OF BENZOXAZINE AS A STRUCTURAL THERMAL PROTECTIVE SYSTEM (TPS) AND HEAT SHIELD MATERIAL
A heat shield includes a substrate having a surface; and a benzoxazine composite material disposed onto the surface of the substrate, the benzoxazine composite material comprising a benzoxazine compound and a reinforcing fiber.
Dispersants with multiple aromatic imide anchor groups
Polymeric dispersants are disclosed that include a urethane backbone at least one pendantly attached imide group, wherein the carbonyl of the imide are chemically bonded to a single or fused aromatic ring. The aromatic ring can be substituted with various electron withdrawing or releasing groups. The dispersant also includes solvent-solubilizing chains of polyether, polyester, polyacrylate, and or polyolefin Desirably, the imide groups are derived from an imide that has two isocyanate reactive groups such that the imide is attached to the urethane backbone at two separate locations.
HYBRID COMPOSITE FILM, METHOD OF FABRICATING THE SAME, AND INTEGRATED CIRCUIT DEVICE INCLUDING HYBRID COMPOSITE FILM
A hybrid composite film, a method of fabricating the hybrid composite film, and an integrated circuit device including the hybrid composite film, the hybrid composite film including a polymer film; and a plurality of organic-inorganic composite particles dispersed in the polymer film, wherein each particle of the plurality of organic-inorganic composite particles includes an inorganic particle and an organic capping layer surrounding the inorganic particle, the organic capping layer having a hydroxyl group-terminated end.
Phosphorus-containing polyphenylene oxide resin, its preparation method, method for preparing prepolymer of phosphorus-containing polyphenylene oxide, resin composition and its application
The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): ##STR00001## wherein R is ##STR00002## R is ##STR00003## R is hydrogen, ##STR00004## Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.
Phosphorus-containing polyphenylene oxide resin, its preparation method, method for preparing prepolymer of phosphorus-containing polyphenylene oxide, resin composition and its application
The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): ##STR00001## wherein R is ##STR00002## R is ##STR00003## R is hydrogen, ##STR00004## Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.
Use of benzoxazine as a structural thermal protective system (TPS) and heat shield material
A heat shield includes a substrate having a surface; and a benzoxazine composite material disposed onto the surface of the substrate, the benzoxazine composite material comprising a benzoxazine compound and a reinforcing fiber.
Use of benzoxazine as a structural thermal protective system (TPS) and heat shield material
A heat shield includes a substrate having a surface; and a benzoxazine composite material disposed onto the surface of the substrate, the benzoxazine composite material comprising a benzoxazine compound and a reinforcing fiber.
Barrier coating system
The present disclosure provides a barrier-coating structure that includes a polymer-matrix composite having a first surface and a second surface. The barrier-coating structure includes a flexible layer having a first surface and a second surface and a sol-gel layer having a first surface and a second surface. The first surface of the flexible layer contacts the second surface of the flexible layer. The barrier-coating structure includes a barrier layer having a first surface and a second surface. The sol-gel and/or the barrier layer may comprise one or more reactive substituents. The first surface of the barrier layer may be a laser-ablated surface.