An improved approach toward the formation of an adhesive comprising a separated liquid component and solid component and application of the adhesive to a substrate immediately upon mixing the liquid and solid components.

An improved approach toward the formation of an adhesive comprising a separated liquid component and solid component and application of the adhesive to a substrate immediately upon mixing the liquid and solid components.

Negative pressure wound dressings comprising pressure-sensitive adhesives with enhanced adhesion to wet surfaces, obtained from crosslinking a pre-adhesive composition comprising poly(meth)acrylate macromolecules that comprise a number-average molecular weight of from about 25000 to about 200000, and methods of using such dressings.

Negative pressure wound dressings comprising pressure-sensitive adhesives with enhanced adhesion to wet surfaces, obtained from crosslinking a pre-adhesive composition comprising poly(meth)acrylate macromolecules that comprise a number-average molecular weight of from about 25000 to about 200000, and methods of using such dressings.

The present invention aims to provide a polyvinyl acetal resin composition that is excellent in thermal stability and moldable by an extrusion method and can exhibit a high storage modulus even under high temperature, an adhesive sheet prepared from the polyvinyl acetal resin composition, an interlayer filling material for a touch panel prepared from the polyvinyl acetal resin composition, and a laminate produced using the interlayer filling material for a touch panel. The present invention relates to a polyvinyl acetal resin composition containing: a polyvinyl acetal; a photoradical polymerization initiator; and a monomer or oligomer having a radical polymerizable double bond.

A crosslinking adhesive composition containing an acrylic copolymer with 3 parts by mass or more and less than 25 parts by mass of component (A1), having two or more hydroxyl group-containing (meth)acrylate monomers, each of which has a defined molecular structure; 5 parts by mass or more and less than 25 parts by mass of component (A2) having a carboxylic acid group-containing (meth)acrylate monomer; 5 parts by mass or more and less than 30 parts by mass of component (A3) having a (meth)acrylic acid alkyl ester monomer with a defined molecular structure; and 50 parts by mass or more and less than 90 parts by mass of component (A4) having a (meth)acrylic acid alkyl ester monomer having a defined molecular structure, with respect to 100 parts by mass consisting of the sum of components (A1) to (A4).

A crosslinking adhesive composition containing an acrylic copolymer with 3 parts by mass or more and less than 25 parts by mass of component (A1), having two or more hydroxyl group-containing (meth)acrylate monomers, each of which has a defined molecular structure; 5 parts by mass or more and less than 25 parts by mass of component (A2) having a carboxylic acid group-containing (meth)acrylate monomer; 5 parts by mass or more and less than 30 parts by mass of component (A3) having a (meth)acrylic acid alkyl ester monomer with a defined molecular structure; and 50 parts by mass or more and less than 90 parts by mass of component (A4) having a (meth)acrylic acid alkyl ester monomer having a defined molecular structure, with respect to 100 parts by mass consisting of the sum of components (A1) to (A4).

Provided is a gas leak locating material used for locating a gas leaking position by application thereof at a position suspected to have a gas leak. The gas leak locating material satisfies the following formula: A/B≥21.0, where A represents a viscosity (Pa.Math.s) of the gas leak locating material at 25° C. at a shear rate of 0.1 s.sup.−1 and B represents a viscosity (Pa.Math.s) of the gas leak locating material at 25° C. at a shear rate of 10 s.sup.−1. The gas leak locating material has an elastic modulus E′ of 10 MPa or higher at 50° C. after being cured.

Provided is a gas leak locating material used for locating a gas leaking position by application thereof at a position suspected to have a gas leak. The gas leak locating material satisfies the following formula: A/B≥21.0, where A represents a viscosity (Pa.Math.s) of the gas leak locating material at 25° C. at a shear rate of 0.1 s.sup.−1 and B represents a viscosity (Pa.Math.s) of the gas leak locating material at 25° C. at a shear rate of 10 s.sup.−1. The gas leak locating material has an elastic modulus E′ of 10 MPa or higher at 50° C. after being cured.

The present application provides methods and compositions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface. The application also provides kits having instructions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface.