The present application provides methods and compositions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface. The application also provides kits having instructions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface.

The present application provides methods and compositions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface. The application also provides kits having instructions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface.

An adhesive composition, an adhesive layer, and a display apparatus for a three-dimensional (3D) head-up display (HUD) including the adhesive layer are provided. The adhesive composition may include an acrylic acid ester-based monomer, an acrylic acid-based monomer, an initiator, and a curing agent.

An adhesive composition, an adhesive layer, and a display apparatus for a three-dimensional (3D) head-up display (HUD) including the adhesive layer are provided. The adhesive composition may include an acrylic acid ester-based monomer, an acrylic acid-based monomer, an initiator, and a curing agent.

A double-sided pressure-sensitive adhesive tape includes an acrylic pressure-sensitive adhesive, wherein the acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition, wherein the acrylic pressure-sensitive adhesive composition contains an acrylic partially polymerized product obtained by polymerizing a monomer component (m1), a monomer component (m2), a cross-linking agent, and a photopolymerization initiator, wherein the monomer component (m2) contains an alkyl (meth)acrylate having, at an ester terminal thereof, an alkyl group having 4 to 10 carbon atoms, and a polymerizable monomer whose corresponding homopolymer has a Tg of 0° C. or more, wherein in the monomer component (m2), a content of the polymerizable monomer whose corresponding homopolymer has a Tg of 0° C. or more is from 10 parts by weight to 90 parts by weight with respect to 100 parts by weight of the alkyl (meth)acrylate having, at an ester terminal thereof, an alkyl group having 4 to 10 carbon atoms.

Articles that include at least one application layer; at least one bead bond layer (10); a layer of optical elements (20) that are partially embedded in the at least one bead bond layer (10); and at least one reflective layer (30) that is located functionally between the layer of optical elements (20) and the bead bond layer (10), wherein the at least one bead bond layer (10), the at least one application layer, or both comprise a cured product of an adhesive compositions that include polymerized units of one or more (meth)acrylate ester monomers derived from an alcohol containing 1 to 14 carbon atoms; at least one of urethane acrylate polymer or at least one acrylic copolymer; and at least one initiator.

Articles that include at least one application layer; at least one bead bond layer (10); a layer of optical elements (20) that are partially embedded in the at least one bead bond layer (10); and at least one reflective layer (30) that is located functionally between the layer of optical elements (20) and the bead bond layer (10), wherein the at least one bead bond layer (10), the at least one application layer, or both comprise a cured product of an adhesive compositions that include polymerized units of one or more (meth)acrylate ester monomers derived from an alcohol containing 1 to 14 carbon atoms; at least one of urethane acrylate polymer or at least one acrylic copolymer; and at least one initiator.

A method for manufacturing an electronic device includes at least a step (1) of preparing a structure comprising (i) an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, and an adhesive resin layer (B) provided on a second surface side of the base material layer, (ii) an electronic component attached to the adhesive resin layer (A) of the adhesive film, and (iii) a support substrate attached to the adhesive resin layer (B) of the adhesive film; a step (2) of sealing the electronic component with a sealing material; a step (3) of peeling the support substrate from the structure by reducing an adhesive force of the adhesive resin layer (B) by applying an external stimulus; and a step (4) of peeling the adhesive film from the electronic component.

According to various embodiments of the present disclosure, a composition includes about 5 to about 40 parts by weight of a solute copolymer component. The solute component optionally has one T.sub.g or T.sub.m of at least 25° C. The composition further includes about 60 to about 95 parts by weight of a solvent monomer. The solvent monomer component includes (meth)acrylate monomers and a multifunctional acrylate. The sum of the solute copolymer component and the solvent monomer component is 100 parts by weight. The composition further includes about 5 to about 100 parts of a plasticizer, relative to the 100 parts. The plasticizer component comprises at least one plasticizer comprising an acid group.

According to various embodiments of the present disclosure, a composition includes about 5 to about 40 parts by weight of a solute copolymer component. The solute component optionally has one T.sub.g or T.sub.m of at least 25° C. The composition further includes about 60 to about 95 parts by weight of a solvent monomer. The solvent monomer component includes (meth)acrylate monomers and a multifunctional acrylate. The sum of the solute copolymer component and the solvent monomer component is 100 parts by weight. The composition further includes about 5 to about 100 parts of a plasticizer, relative to the 100 parts. The plasticizer component comprises at least one plasticizer comprising an acid group.