A thermosetting adhesive sheet and a method for manufacturing a semiconductor device capable of reducing warping of a semiconductor wafer are provided. The thermosetting adhesive sheet is to be applied to a grinding-side surface of a semiconductor wafer and cured before dicing and includes a polymer containing an elastomer, a (meth) acrylate containing more than 95% wt of a polyfunctional (meth) acrylate with respect to total (meth)acrylate content, an organic peroxide having a one-minute half-life temperature of 130° C. or lower, and a transparent filler. Thereby, the thermosetting adhesive sheet significantly shrinks and generates a stress opposing a warp direction of the semiconductor wafer, enabling the semiconductor wafer to be maintained in a flat state.

Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.

The present application provides compositions and methods for allowing surfaces such as HDPE, LDPE, polyethylene, polypropylene, Teflon (polytetrafluoroethylene), SBS, SEBS, SIS elastomers, and silicone rubber, which are notoriously difficult to apply adhesives, glues, or coatings to, to he treated with a Primer System that increases the ability of a glue, adhesive, or coating to adhere to that surface and subsequently allows other materials to be used as coatings on the surface or to be applied using a glue or adhesive.

The present application provides compositions and methods for allowing surfaces such as HDPE, LDPE, polyethylene, polypropylene, Teflon (polytetrafluoroethylene), SBS, SEBS, SIS elastomers, and silicone rubber, which are notoriously difficult to apply adhesives, glues, or coatings to, to he treated with a Primer System that increases the ability of a glue, adhesive, or coating to adhere to that surface and subsequently allows other materials to be used as coatings on the surface or to be applied using a glue or adhesive.

A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition, and a curable polymer for use therein.

Included are methods for sealing seams of resilient surface covering including the application of a curable composition at a seam and applying radiation to the curable composition. The radiation may be any suitable source such as UV or visible light.

Included are methods for sealing seams of resilient surface covering including the application of a curable composition at a seam and applying radiation to the curable composition. The radiation may be any suitable source such as UV or visible light.

There is provided a two-part urethane adhesive composition including: a main agent containing a polyisocyanate component (A); and a curing agent containing water and an active hydrogen-containing compound (B). The (B) contains a compound represented by Formula (4); the (A) contains a urethane prepolymer (A-3); an average active hydrogen concentration of the (B) is 0.50 to 3.50 mol/kg; an average active hydrogen concentration of the (B) and the water is 2.00 to 8.00 mol/kg. The main agent and the curing agent are mixed in such amounts as to satisfy conditions that: a ratio of the number of isocyanate groups of the (A) to the number of active hydrogens of the (B) is 1 to 5; and a ratio of the number of isocyanate groups of the (A) to the total number of active hydrogens of the (B) and the water is 0.5 to 2.5.

There is provided a two-part urethane adhesive composition including: a main agent containing a polyisocyanate component (A); and a curing agent containing water and an active hydrogen-containing compound (B). The (B) contains a compound represented by Formula (4); the (A) contains a urethane prepolymer (A-3); an average active hydrogen concentration of the (B) is 0.50 to 3.50 mol/kg; an average active hydrogen concentration of the (B) and the water is 2.00 to 8.00 mol/kg. The main agent and the curing agent are mixed in such amounts as to satisfy conditions that: a ratio of the number of isocyanate groups of the (A) to the number of active hydrogens of the (B) is 1 to 5; and a ratio of the number of isocyanate groups of the (A) to the total number of active hydrogens of the (B) and the water is 0.5 to 2.5.