A method for using an adhesive comprising applying the adhesive to a substrate in a first position, adhering the adhesive to the substrate by applying pressure to the adhesive, optionally removing the adhesive from the substrate and re-applying the adhesive to the substrate in a second position and curing the adhesive at room temperature. The application also claims a tape material comprising: a substrate; an adhesive impregnated within the substrate, the adhesive comprising: i. one or more acrylates; ii. optionally one or more impact modifiers; iii. one or more elastomers; and iv. one or more initiators.

A process for creating an assembly with a pressure sensitive adhesive includes the application of a light curable composition to a first substrate of the assembly. The light curable composition is cured with a single light exposure step to form a fully polymerized pressure sensitive adhesive. The resulting pressure sensitive adhesive is brought into contact with to a second substrate with sufficient force to bond the second substrate to the first substrate to complete the assembly with the pressure sensitive adhesive.

A process for creating an assembly with a pressure sensitive adhesive includes the application of a light curable composition to a first substrate of the assembly. The light curable composition is cured with a single light exposure step to form a fully polymerized pressure sensitive adhesive. The resulting pressure sensitive adhesive is brought into contact with to a second substrate with sufficient force to bond the second substrate to the first substrate to complete the assembly with the pressure sensitive adhesive.

A compound has at least three functionalities, including a first functionality (a) that is a sulfonate group or a sulfate group of the formula —(O).sub.d—SO.sub.3M with d=0 or 1 and with M=hydrogen or a monovalent metal cation or a corresponding portion of a multivalent metal cation; a second functionality (b) that is a (meth)acryl residue; and a third functionality (c) that is a carboxylic acid function and/or a thioether group. When the compound is free of silicon, the sulfonate or sulfate group and the (meth)acryl residue are separated from each other by a hydrocarbon-containing residue having a carbon chain. The carbon chain is interrupted by S or NH, or the carbon chain contains a linking group, selected from C(O)NH, NHC(O), NR.sup.8C(O), NHC(O)O, NR.sup.8C(O)O, NHC(O)NH, C(O)NHC(O) and —C(O)S—, wherein R.sup.8 is alkyl or alkenyl or a (meth)acryl group.

A compound has at least three functionalities, including a first functionality (a) that is a sulfonate group or a sulfate group of the formula —(O).sub.d—SO.sub.3M with d=0 or 1 and with M=hydrogen or a monovalent metal cation or a corresponding portion of a multivalent metal cation; a second functionality (b) that is a (meth)acryl residue; and a third functionality (c) that is a carboxylic acid function and/or a thioether group. When the compound is free of silicon, the sulfonate or sulfate group and the (meth)acryl residue are separated from each other by a hydrocarbon-containing residue having a carbon chain. The carbon chain is interrupted by S or NH, or the carbon chain contains a linking group, selected from C(O)NH, NHC(O), NR.sup.8C(O), NHC(O)O, NR.sup.8C(O)O, NHC(O)NH, C(O)NHC(O) and —C(O)S—, wherein R.sup.8 is alkyl or alkenyl or a (meth)acryl group.

A fastener sealing material for application to fasteners is formulated from an acrylate present in a concentration of about 90 to about 97 percent by weight of the sealing material and a nanostructured material present in a concentration of about 3 to about 10 percent by weight of the sealing material. The sealant is applied to the fastener as a liquid and is cured using an ultraviolet or LED light source and without the use of heat.

A fastener sealing material for application to fasteners is formulated from an acrylate present in a concentration of about 90 to about 97 percent by weight of the sealing material and a nanostructured material present in a concentration of about 3 to about 10 percent by weight of the sealing material. The sealant is applied to the fastener as a liquid and is cured using an ultraviolet or LED light source and without the use of heat.

A fastener sealing material for application to fasteners is formulated from an acrylate present in a concentration of about 90 to about 97 percent by weight of the sealing material and a nanostructured material present in a concentration of about 3 to about 10 percent by weight of the sealing material. The sealant is applied to the fastener as a liquid and is cured using an ultraviolet or LED light source and without the use of heat.

The present invention is a method of curing an adhesive composition positioned at least partially under a light-absorbing layer. The method includes providing an adhesive composition, positioning the light-absorbing layer over a surface of the adhesive composition such that there is an exposed area of the adhesive composition and a covered area of the adhesive composition and irradiating the exposed area of the adhesive composition and the covered area of the adhesive composition at the surface at a dosage of between about 100 mJ/cm.sup.2 and about 10,000 mJ/cm.sup.2. The adhesive composition includes a solute (meth)acryolyl oligomer having a molecular weight of 4 to 30 k and a Tg of less than about 20° C., a diluents monomer component and a photoinitiator.

The present invention is a method of curing an adhesive composition positioned at least partially under a light-absorbing layer. The method includes providing an adhesive composition, positioning the light-absorbing layer over a surface of the adhesive composition such that there is an exposed area of the adhesive composition and a covered area of the adhesive composition and irradiating the exposed area of the adhesive composition and the covered area of the adhesive composition at the surface at a dosage of between about 100 mJ/cm.sup.2 and about 10,000 mJ/cm.sup.2. The adhesive composition includes a solute (meth)acryolyl oligomer having a molecular weight of 4 to 30 k and a Tg of less than about 20° C., a diluents monomer component and a photoinitiator.