The present invention relates to methods for producing at least one vinyl ether compound of formula (1) and to a vinyl ether compound of formula (1) preferably obtainable by the methods according to the invention. Furthermore, the present invention relates to a polymer obtainable by polymerizing the vinyl ether compound of formula (1) according to the invention, to an adhesive comprising the at least one polymer according to the invention and to the use of at least one vinyl ether compound of formula (I) according to the invention or at least one polymer according to the invention for the production of UV adhesives, cationic curings or 1-component or 2-component systems.

The present invention relates to methods for producing at least one vinyl ether compound of formula (1) and to a vinyl ether compound of formula (1) preferably obtainable by the methods according to the invention. Furthermore, the present invention relates to a polymer obtainable by polymerizing the vinyl ether compound of formula (1) according to the invention, to an adhesive comprising the at least one polymer according to the invention and to the use of at least one vinyl ether compound of formula (I) according to the invention or at least one polymer according to the invention for the production of UV adhesives, cationic curings or 1-component or 2-component systems.

A process for creating an assembly with a pressure sensitive adhesive includes the application of a light curable composition to a first substrate of the assembly. The light curable composition is cured with a single light exposure step to form a fully polymerized pressure sensitive adhesive. The resulting pressure sensitive adhesive is brought into contact with to a second substrate with sufficient force to bond the second substrate to the first substrate to complete the assembly with the pressure sensitive adhesive.

A process for creating an assembly with a pressure sensitive adhesive includes the application of a light curable composition to a first substrate of the assembly. The light curable composition is cured with a single light exposure step to form a fully polymerized pressure sensitive adhesive. The resulting pressure sensitive adhesive is brought into contact with to a second substrate with sufficient force to bond the second substrate to the first substrate to complete the assembly with the pressure sensitive adhesive.

Two-part cyanoacrylate/cationically curable adhesive systems, are provided.

Two-part cyanoacrylate/cationically curable adhesive systems, are provided.

Provided is a compound represented by Formula (1) given below. (In the formula, R.sup.1 represents a hydrogen atom or a methyl group, R.sup.2 represents a hydrogen atom, a phenyl group, a C.sub.1 to 8 alkyl group, or a C.sub.1 to 4 perfluoroalkyl group, X.sup.1 represents a hydrogen atom or a hydroxy group, Y.sup.1 represents a C.sub.1 to 9 alkylene group containing a fluorine atom or a C.sub.1 to 9 alkylene group containing no fluorine atom, and n.sup.1 is an integer from 0 to 3.)

Provided is a compound represented by Formula (1) given below. (In the formula, R.sup.1 represents a hydrogen atom or a methyl group, R.sup.2 represents a hydrogen atom, a phenyl group, a C.sub.1 to 8 alkyl group, or a C.sub.1 to 4 perfluoroalkyl group, X.sup.1 represents a hydrogen atom or a hydroxy group, Y.sup.1 represents a C.sub.1 to 9 alkylene group containing a fluorine atom or a C.sub.1 to 9 alkylene group containing no fluorine atom, and n.sup.1 is an integer from 0 to 3.)

Provided is a compound represented by Formula (1) given below. (In the formula, R.sup.1 represents a hydrogen atom or a methyl group, R.sup.2 represents a hydrogen atom, a phenyl group, a C.sub.1 to 8 alkyl group, or a C.sub.1 to 4 perfluoroalkyl group, X.sup.1 represents a hydrogen atom or a hydroxy group, Y.sup.1 represents a C.sub.1 to 9 alkylene group containing a fluorine atom or a C.sub.1 to 9 alkylene group containing no fluorine atom, and n.sup.1 is an integer from 0 to 3.)

The present application provides methods and compositions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface. The application also provides kits having instructions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface.