A UV-curable and recyclable thermoset shape memory polymer is provided. The polymer includes a vitrimer-based monomer and a photoinitiator. The vitrimer-based monomer includes a first unit rendering a high chain stiffness upon polymerization of the monomer, and a second photopolymerizable unit for photopolymerization of the monomer under a UV irradiation. The polymer has high strength, high stiffness, high recovery stress, high energy storage, reasonable recycling efficiency, and is printable using SLA with high resolution.

A UV-curable and recyclable thermoset shape memory polymer is provided. The polymer includes a vitrimer-based monomer and a photoinitiator. The vitrimer-based monomer includes a first unit rendering a high chain stiffness upon polymerization of the monomer, and a second photopolymerizable unit for photopolymerization of the monomer under a UV irradiation. The polymer has high strength, high stiffness, high recovery stress, high energy storage, reasonable recycling efficiency, and is printable using SLA with high resolution.

The present invention generally relates to various polymer solid electrolyte materials suitable for various electrochemical devices and methods for making or using the same. Certain embodiments of the invention are generally directed to solid electrolytes having relatively high ionic conductivity and/or other mechanical or electrical properties, e.g., tensile strength or decomposition potential. Certain aspects include a polymer, a plasticizer, and an electrolyte salt. In some cases, the polymer may exhibit certain structures such as: ##STR00001##
where R.sub.1 can be one of the following groups: ##STR00002##
where n is an integer between 1 and 10000, m is a integer between 1 and 5000, and R.sub.2 to R.sub.6 are each independently selected from the group consisting of hydrogen, methyl, ethyl, phenyl, benzyl, acryl, epoxy ethyl, isocyanate, cyclic carbonate, lactone, lactam, and vinyl; and * indicates a point of attachment.

The present invention relates to a method for increasing adhesion strength between a surface of a metal, a metal alloy or a metal oxide and a surface of an organic material comprising as a main step contacting of at least one section of said metal, metal alloy or metal oxide with a specific azole silane compound, a specific azole silane oligomer, or a mixture comprising said compound and/or said oligomer. Furthermore, the present invention relates to a use of said specific azole silane compound, said specific azole silane oligomer, or said mixture in a method for increasing adhesion strength between a surface of a metal, a metal alloy or a metal oxide and a surface of an organic material.

The present invention relates to a method for increasing adhesion strength between a surface of a metal, a metal alloy or a metal oxide and a surface of an organic material comprising as a main step contacting of at least one section of said metal, metal alloy or metal oxide with a specific azole silane compound, a specific azole silane oligomer, or a mixture comprising said compound and/or said oligomer. Furthermore, the present invention relates to a use of said specific azole silane compound, said specific azole silane oligomer, or said mixture in a method for increasing adhesion strength between a surface of a metal, a metal alloy or a metal oxide and a surface of an organic material.

A resin composition comprises a urethane (meth)acrylate oligomer. The resin composition has a storage modulus of about 2×10.sup.3 Pa to about 2×10.sup.4 Pa when irradiated with 200 mJ/cm.sup.2 of an ultraviolet light.

A resin composition comprises a urethane (meth)acrylate oligomer. The resin composition has a storage modulus of about 2×10.sup.3 Pa to about 2×10.sup.4 Pa when irradiated with 200 mJ/cm.sup.2 of an ultraviolet light.

A resin composition comprises a urethane (meth)acrylate oligomer. The resin composition has a storage modulus of about 2×10.sup.3 Pa to about 2×10.sup.4 Pa when irradiated with 200 mJ/cm.sup.2 of an ultraviolet light.

Provided are a chemical polymerization initiator including (a) a thiourea compound, (b) a peroxyester, (c) a divalent copper compound, and (d) an aryl borate compound, an adhesive composition, an adhesive composition kit, a dental material, and a dental material kit each using the chemical polymerization initiator, and a method of storing the adhesive composition.

Provided are a chemical polymerization initiator including (a) a thiourea compound, (b) a peroxyester, (c) a divalent copper compound, and (d) an aryl borate compound, an adhesive composition, an adhesive composition kit, a dental material, and a dental material kit each using the chemical polymerization initiator, and a method of storing the adhesive composition.