A barrier free quantum dot particles film includes a free standing layer comprising shielded quantum dot particles; wherein the shielded quantum dot particles are formed by shielding quantum dot particles by at least one shielding method; wherein the shielded quantum dot particles are characterized in resisting at least one condition selected from the group consisting of high temperature, high humidity and water; and wherein the shielded quantum dot particles are dispersed in an acrylate adhesive. A method of fabricating a barrier free quantum dot particles free standing film is also disclosed. The method of fabrication of shielded quantum dot particles film on a light emitting diode (LED) lens is also disclosed.

A method of manufacturing a laminated steel plate capable of simplifying the manufacturing process. This is achieved by a method of manufacturing a laminated steel plate including a step of applying a mixture containing an oil and an adhesive composition for a laminated steel plate including at least one kind of a (meth)acrylate compound compatible with the oil and an organic peroxide to one side or both sides of a strip-like steel plate; and a step of punching a steel plate body from the strip-like steel plate with a punch portion of a press forming device, and laminating and bonding the steel plate bodies.

A method of manufacturing a laminated steel plate capable of simplifying the manufacturing process. This is achieved by a method of manufacturing a laminated steel plate including a step of applying a mixture containing an oil and an adhesive composition for a laminated steel plate including at least one kind of a (meth)acrylate compound compatible with the oil and an organic peroxide to one side or both sides of a strip-like steel plate; and a step of punching a steel plate body from the strip-like steel plate with a punch portion of a press forming device, and laminating and bonding the steel plate bodies.

A method of manufacturing a laminated steel plate capable of simplifying the manufacturing process. This is achieved by a method of manufacturing a laminated steel plate including a step of applying a mixture containing an oil and an adhesive composition for a laminated steel plate including at least one kind of a (meth)acrylate compound compatible with the oil and an organic peroxide to one side or both sides of a strip-like steel plate; and a step of punching a steel plate body from the strip-like steel plate with a punch portion of a press forming device, and laminating and bonding the steel plate bodies.

Provided are an adhesive film and an optical member comprising same, the adhesive film comprising at least two types of (meth)acrylic monomers for a (meth)acrylic prepolymer, and (meth)acrylate containing silicon, wherein the release force of the adhesive film with respect to a polyimide film is approximately 0.5 gf/in to 5 gf/in.

Provided are an adhesive film and an optical member comprising same, the adhesive film comprising at least two types of (meth)acrylic monomers for a (meth)acrylic prepolymer, and (meth)acrylate containing silicon, wherein the release force of the adhesive film with respect to a polyimide film is approximately 0.5 gf/in to 5 gf/in.

The present invention relates to an electrically conductive adhesive composition including: a conductive powder (A) and a curable component (B) which has a content of 20 5 parts by mass or more when an amount of the conductive powder (A) is 100 parts by mass; and a phosphoric acid-containing curable component (C) having a general formula of formula (1) or (2), and having a molecular weight within a range of 150 to 1000, in which the phosphoric acid-containing curable component (C) has a content of 0.01 parts by mass or more and 5 parts by mass or less when a total amount of the conductive powder (A) and the 10 curable component (B) is 100 parts by mass.

The present invention relates to an electrically conductive adhesive composition including: a conductive powder (A) and a curable component (B) which has a content of 20 5 parts by mass or more when an amount of the conductive powder (A) is 100 parts by mass; and a phosphoric acid-containing curable component (C) having a general formula of formula (1) or (2), and having a molecular weight within a range of 150 to 1000, in which the phosphoric acid-containing curable component (C) has a content of 0.01 parts by mass or more and 5 parts by mass or less when a total amount of the conductive powder (A) and the 10 curable component (B) is 100 parts by mass.

Cyanoacrylic adhesive compositions of the type comprising at least one cyanoacrylic acid ester or one malonic acid ester having an allyl, acrylic or methacrylic group, wherein there is also present at least one radical initiator of the polymerization reaction of the allyl, acrylic or methacrylic ester of cyanoacrylic acid or malonic acid and at least one radical inhibitor of said polymerization reaction. In comparison with known cyanoacrylic adhesive compositions, those according to the invention offer the advantage of maintaining their bonding capability even at high temperatures, in particular up to 150° C.

Cyanoacrylic adhesive compositions of the type comprising at least one cyanoacrylic acid ester or one malonic acid ester having an allyl, acrylic or methacrylic group, wherein there is also present at least one radical initiator of the polymerization reaction of the allyl, acrylic or methacrylic ester of cyanoacrylic acid or malonic acid and at least one radical inhibitor of said polymerization reaction. In comparison with known cyanoacrylic adhesive compositions, those according to the invention offer the advantage of maintaining their bonding capability even at high temperatures, in particular up to 150° C.