An adhesive tape and methods of use in cold or hot environments, such as in the construction industry, wherein the adhesive tape includes a pressure sensitive adhesive layer (preferably, an acrylic pressure sensitive adhesive layer) disposed on a backing (preferably, a multilayer backing).

An adhesive tape and methods of use in cold or hot environments, such as in the construction industry, wherein the adhesive tape includes a pressure sensitive adhesive layer (preferably, an acrylic pressure sensitive adhesive layer) disposed on a backing (preferably, a multilayer backing).

A 2-cyanoacrylate compound represented by Formula (1) and an adhesive composition containing the 2-cyanoacrylate compound represented by Formula (1). In Formula (1), R.sup.1 represents a divalent linking group having 1 to 20 carbon atoms, R.sup.2 and R.sup.3 each independently represent an alkylene group having 2 to 4 carbon atoms, and R.sup.4 represents an alkyl group having 1 to 20 carbon atoms.

##STR00001##

A 2-cyanoacrylate compound represented by Formula (1) and an adhesive composition containing the 2-cyanoacrylate compound represented by Formula (1). In Formula (1), R.sup.1 represents a divalent linking group having 1 to 20 carbon atoms, R.sup.2 and R.sup.3 each independently represent an alkylene group having 2 to 4 carbon atoms, and R.sup.4 represents an alkyl group having 1 to 20 carbon atoms.

##STR00001##

The present invention aims to provide an adhesive composition capable of suppressing shrinkage on curing and excellent in storage stability and depth curability, or an adhesive composition excellent in adhesion on photocuring, curability by heating at low temperature, and low shrinkability on curing. The present invention also aims to provide an optical component, an electronic component, and an electronic module each including the adhesive composition. Provided is an adhesive composition including: a polymerizable compound; a photopolymerization initiator; and a radical scavenger, the polymerizable compound including a (meth)acrylic compound and a vinyl group-containing cyclic amide compound, the vinyl group-containing cyclic amide compound being contained in an amount of 20 parts by weight or more and 150 parts by weight or less relative to 100 parts by weight of the (meth)acrylic compound, or an adhesive composition including: a polymerizable compound; a photopolymerization initiator; and a heat curing agent, the polymerizable compound including a radical polymerizable compound containing no epoxy group, an epoxy compound containing no radical polymerizable group, and a compound containing an epoxy group and a radical polymerizable group, the heat curing agent including a heat curing agent having a lowest value of a starting range temperature of 80° C. or lower.

The present invention aims to provide an adhesive composition capable of suppressing shrinkage on curing and excellent in storage stability and depth curability, or an adhesive composition excellent in adhesion on photocuring, curability by heating at low temperature, and low shrinkability on curing. The present invention also aims to provide an optical component, an electronic component, and an electronic module each including the adhesive composition. Provided is an adhesive composition including: a polymerizable compound; a photopolymerization initiator; and a radical scavenger, the polymerizable compound including a (meth)acrylic compound and a vinyl group-containing cyclic amide compound, the vinyl group-containing cyclic amide compound being contained in an amount of 20 parts by weight or more and 150 parts by weight or less relative to 100 parts by weight of the (meth)acrylic compound, or an adhesive composition including: a polymerizable compound; a photopolymerization initiator; and a heat curing agent, the polymerizable compound including a radical polymerizable compound containing no epoxy group, an epoxy compound containing no radical polymerizable group, and a compound containing an epoxy group and a radical polymerizable group, the heat curing agent including a heat curing agent having a lowest value of a starting range temperature of 80° C. or lower.

Provided is a curable-type composition, including a methylene malonate compound, a Lewis acidic compound, and a photo base generator.

Provided is a curable-type composition, including a methylene malonate compound, a Lewis acidic compound, and a photo base generator.

Among a photocurable thermochromic adhesive, an adhesive composition and preparation as well as application thereof, the photocurable thermochromic adhesive includes: 20-60 wt. % of acrylic polyurethane, 10-20 wt. % of Bis-GMA, 10-20 wt. % of triethylene glycol dimethacrylic acid, 10-20 wt. % of ethoxylated trimethylolpropane triacrylate, 10-20 wt. % of HEMA, 10-20 wt. % of modified silica, 1-5 wt. % of a photoinitiator component, 1-5 wt. % of BHT, 1-5 wt. % of KH570, and 1-2 wt. % of a thermochromic component. The adhesive of the present invention is colored in vitro and colorless in oral environment, which helps the doctor to easily remove residues on tooth surfaces when adhering and removing brackets.

Among a photocurable thermochromic adhesive, an adhesive composition and preparation as well as application thereof, the photocurable thermochromic adhesive includes: 20-60 wt. % of acrylic polyurethane, 10-20 wt. % of Bis-GMA, 10-20 wt. % of triethylene glycol dimethacrylic acid, 10-20 wt. % of ethoxylated trimethylolpropane triacrylate, 10-20 wt. % of HEMA, 10-20 wt. % of modified silica, 1-5 wt. % of a photoinitiator component, 1-5 wt. % of BHT, 1-5 wt. % of KH570, and 1-2 wt. % of a thermochromic component. The adhesive of the present invention is colored in vitro and colorless in oral environment, which helps the doctor to easily remove residues on tooth surfaces when adhering and removing brackets.