The present invention relates to cure accelerators useful for anaerobic curable compositions, such as adhesives and sealants. The cure accelerators are embraced within ##STR00001##
where X is CH.sub.2, O, S, NR.sup.4, CR.sup.5R.sup.6 or C═O, wherein R.sup.4, R.sup.5, and R.sup.6 are each individually selected from hydrogen, halogen, amino, carboxyl, nitro, alkyl, alkenyl, alkynyl, hydroxyalkyl, hydroxyalkenyl, hydroxyalkynyl, or alkaryl; R is one or more of hydrogen, alkyl, alkenyl, alkynl, hydroxyalkyl, hydroxyalkenyl, or hydroxyalkynl; R.sup.1, R.sup.2, and R.sup.3 are each individually selected from hydrogen, halogen, amino, carboxyl, nitro, alkyl, alkenyl, alkynyl, hydroxyalkyl, hydroxyalkenyl, hydroxyalkynyl, or alkaryl; R.sup.7 is hydrogen or CHR.sup.8R.sup.9, where R.sup.8 and R.sup.9 are each individually selected from hydrogen, halogen, amino, carboxyl, nitro, alkyl, alkenyl, alkynyl, hydroxyalkyl, hydroxyalkenyl, hydroxyalkynyl, or alkaryl; and n is 0 or 1. A particularly desirable example is 1,2,3,4-tetrahydrobenzo-h-quinolin-3-ol.

A method for the production of pressure-sensitive adhesive tapes includes providing a web-shaped substrate, providing a pressure-sensitive adhesive composition and/or a precursor for a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition and/or the precursor for a pressure-sensitive adhesive composition comprising at least one polymerisable (meth)acrylate monomer and/or (meth)acrylate oligomer and/or (meth)acrylate polymer and at least one polymerisation initiator and having a solvent content of <5% by weight, based on the total mass of the pressure-sensitive adhesive composition, applying the pressure-sensitive adhesive composition and/or its precursor to one or both sides of at least sections of the web-shaped substrate, transporting a web-shaped substrate to which the pressure-sensitive adhesive composition and/or its precursor has been applied along a predetermined transport path, wherein the transport path extending at least in sections in the region of influence of an emitter for electromagnetic radiation, electrons or accelerated ions, electrons or accelerated ions, activation of the polymerisation initiator by acting upon with electromagnetic radiation, electrons or accelerated ions during the transport of the web-shaped substrate along the predetermined transport path, and polymerisation of the pressure-sensitive adhesive composition and/or of the precursor for a pressure-sensitive adhesive composition on the web-shaped substrate during its transport. Furthermore, an apparatus for carrying out this method and a pressure-sensitive adhesive tape produced according to this method are disclosed.

A method for the production of pressure-sensitive adhesive tapes includes providing a web-shaped substrate, providing a pressure-sensitive adhesive composition and/or a precursor for a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition and/or the precursor for a pressure-sensitive adhesive composition comprising at least one polymerisable (meth)acrylate monomer and/or (meth)acrylate oligomer and/or (meth)acrylate polymer and at least one polymerisation initiator and having a solvent content of <5% by weight, based on the total mass of the pressure-sensitive adhesive composition, applying the pressure-sensitive adhesive composition and/or its precursor to one or both sides of at least sections of the web-shaped substrate, transporting a web-shaped substrate to which the pressure-sensitive adhesive composition and/or its precursor has been applied along a predetermined transport path, wherein the transport path extending at least in sections in the region of influence of an emitter for electromagnetic radiation, electrons or accelerated ions, electrons or accelerated ions, activation of the polymerisation initiator by acting upon with electromagnetic radiation, electrons or accelerated ions during the transport of the web-shaped substrate along the predetermined transport path, and polymerisation of the pressure-sensitive adhesive composition and/or of the precursor for a pressure-sensitive adhesive composition on the web-shaped substrate during its transport. Furthermore, an apparatus for carrying out this method and a pressure-sensitive adhesive tape produced according to this method are disclosed.

An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

##STR00001##

An objective of the present invention is to provide: a novel thiol compound; a method for synthesizing the thiol compound; a curing agent containing the thiol compound; a resin composition containing the thiol compound and an epoxy compound; and a resin composition containing the thiol compound and an enic compound having an intramolecular carbon-carbon double bond. The thiol compound of the present invention, as exemplified by the compounds listed below, is a reaction product of a certain type of dialkene compound and a thiol compound, and has two or more intramolecular thioether bonds but no ester bonds.

##STR00001##

There are provided a composition having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting, includes a compound 1 or a compound group 2; and a solvent, in which the compound 1 and the like is a compound decomposable into two or more compounds in a case where a polarity conversion group is treated, and at least one compound has a molecular weight of 30 to 400, and at least one compound has a molecular weight of 1,000 or more, the compound 1: a compound is a resin having a polymerizable group and a polarity conversion group, in which the resin has the polarity conversion group in at least a main chain or a side chain, the polarity conversion group is bonded to the main chain of the resin via a linking group in a case where the polarity conversion group is provided in the side chain, and the number of atoms constituting a chain of the linking group is 8 or more; and the compound group 2: a compound that has a polymerizable group and does not have a polarity conversion group, and a compound that does not have a polymerizable group and has a polarity conversion group.

There are provided a composition having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting, includes a compound 1 or a compound group 2; and a solvent, in which the compound 1 and the like is a compound decomposable into two or more compounds in a case where a polarity conversion group is treated, and at least one compound has a molecular weight of 30 to 400, and at least one compound has a molecular weight of 1,000 or more, the compound 1: a compound is a resin having a polymerizable group and a polarity conversion group, in which the resin has the polarity conversion group in at least a main chain or a side chain, the polarity conversion group is bonded to the main chain of the resin via a linking group in a case where the polarity conversion group is provided in the side chain, and the number of atoms constituting a chain of the linking group is 8 or more; and the compound group 2: a compound that has a polymerizable group and does not have a polarity conversion group, and a compound that does not have a polymerizable group and has a polarity conversion group.

Provided is an adhesive composition including lysine, citric acid, and water, wherein the lysine and the citric acid are present in the form of an aqueous solution of a salt such that precipitates are not formed in the aqueous solution. In addition, provided is a method of preparing an adhesive composition including mixing lysine, citric acid, and water to thereby form a mixture of the lysine, the citric acid, and the water, and stirring the mixture at a temperature of 80° C. or less, wherein amounts of the lysine, the citric acid, and the water are adjusted such that precipitates of the lysine and the citric acid do not form in the adhesive composition.

Provided is an adhesive composition including lysine, citric acid, and water, wherein the lysine and the citric acid are present in the form of an aqueous solution of a salt such that precipitates are not formed in the aqueous solution. In addition, provided is a method of preparing an adhesive composition including mixing lysine, citric acid, and water to thereby form a mixture of the lysine, the citric acid, and the water, and stirring the mixture at a temperature of 80° C. or less, wherein amounts of the lysine, the citric acid, and the water are adjusted such that precipitates of the lysine and the citric acid do not form in the adhesive composition.

Provided is an adhesive composition including lysine, citric acid, and water, wherein the lysine and the citric acid are present in the form of an aqueous solution of a salt such that precipitates are not formed in the aqueous solution. In addition, provided is a method of preparing an adhesive composition including mixing lysine, citric acid, and water to thereby form a mixture of the lysine, the citric acid, and the water, and stirring the mixture at a temperature of 80° C. or less, wherein amounts of the lysine, the citric acid, and the water are adjusted such that precipitates of the lysine and the citric acid do not form in the adhesive composition.