The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors that include about 0 to about 50 wt % C.sub.1-C.sub.9 alkyl(meth)acrylate, about 40 to about 99 wt % C.sub.10-C.sub.24 (meth)acrylate, about 0 to about 30 wt % hydroxyl (meth)acrylate, about 0 to about 10 wt % of a non-hydroxy functional polar monomer, and about 0 to about 5 wt % crosslinker.

The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors that include about 0 to about 50 wt % C.sub.1-C.sub.9 alkyl(meth)acrylate, about 40 to about 99 wt % C.sub.10-C.sub.24 (meth)acrylate, about 0 to about 30 wt % hydroxyl (meth)acrylate, about 0 to about 10 wt % of a non-hydroxy functional polar monomer, and about 0 to about 5 wt % crosslinker.

Fiber-containing composites are described that include woven or non-woven fibers, and a binder that holds the fibers together. The binder may include the reaction product of a starch and a polycarboxylic acid. The starch has a weight average molecular weight that ranges from 1×10.sup.6 Daltons to 10×10.sup.6 Daltons. The fiber-containing composite has an unaged tensile strength of greater than 4.0 and an aged tensile strength greater than 3.0. Also described are methods of making the fiber-containing composites. The methods may include applying a binder composition to fibers to form coated fibers, measuring a moisture content of the coated fibers, and curing the coated fibers in a curing oven to form the fiber-containing composite. The binder composition may include a starch having a weight average molecular weight that ranges from 1×10.sup.6 Daltons to 10×10.sup.6 Daltons, and a polycarboxylic acid.

Fiber-containing composites are described that include woven or non-woven fibers, and a binder that holds the fibers together. The binder may include the reaction product of a starch and a polycarboxylic acid. The starch has a weight average molecular weight that ranges from 1×10.sup.6 Daltons to 10×10.sup.6 Daltons. The fiber-containing composite has an unaged tensile strength of greater than 4.0 and an aged tensile strength greater than 3.0. Also described are methods of making the fiber-containing composites. The methods may include applying a binder composition to fibers to form coated fibers, measuring a moisture content of the coated fibers, and curing the coated fibers in a curing oven to form the fiber-containing composite. The binder composition may include a starch having a weight average molecular weight that ranges from 1×10.sup.6 Daltons to 10×10.sup.6 Daltons, and a polycarboxylic acid.

The present invention provides a pressure-sensitive adhesive composition, including: an acrylic copolymer and a crosslinking agent. The acrylic copolymer is a reaction product of a mixture of the following monomers: a first alkyl (meth)acrylate, an alkyl group in the first alkyl (meth)acrylate having at least 6 carbon atoms; a second alkyl (meth)acrylate, an alkyl group in the second alkyl (meth)acrylate having 1 to 5 carbon atoms; and a vinyl carboxylic acid, the weight ratio of the vinyl carboxylic acid to the mixture being 4% to 5%. The crosslinking agent is an organometallic chelating agent. The weight ratio of the organometallic chelating agent to the mixture is 0.05% to 0.25%. The pressure-sensitive adhesive composition does not contain an effective amount of a tackifier. The present invention further provides a pressure-sensitive adhesive solution, a pressure-sensitive adhesive tape, and a method for preparing the same. The pressure-sensitive adhesive of the present invention is a removable pressure-sensitive adhesive, and is applicable in hot weather and cold weather, and the adhesiveness of the pressure-sensitive adhesive does not decrease over time.

A curable resin or adhesive composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and at least one energy converting material, preferably a phosphor, capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.

A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below. ##STR00001##

A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below. ##STR00001##

This disclosure relates to a multilayer structure containing: a substrate; a coupling layer deposited on the substrate; and a dielectric layer deposited on the coupling layer, wherein shear strength is increased by a factor of at least about 2 in the presence of the coupling layer compared to a multilayer in the absence of the coupling layer.

This disclosure relates to a multilayer structure containing: a substrate; a coupling layer deposited on the substrate; and a dielectric layer deposited on the coupling layer, wherein shear strength is increased by a factor of at least about 2 in the presence of the coupling layer compared to a multilayer in the absence of the coupling layer.