Adhesive compositions are disclosed. In some embodiments, the adhesive compositions comprise an organosiloxane block copolymer, wherein the blocks of the block copolymer consist of an —Si—O—Si— backbone. The organosiloxane block copolymer comprises at least two blocks that are phase-separated. The organosiloxane block copolymer has at least a first glass transition temperature (Tg.sup.1) and a second glass transition temperature (Tg.sup.2), the second glass transition temperature being at 25° C. or higher. A 1 mm thick cast film of the adhesive composition has, in some embodiments, a light transmittance of at least 95%. The adhesive composition of the various embodiments of the present invention can be B-staged at about Tg.sup.2 or at about 100° C. below Tg.sup.2.

The present invention provides an excellent optical pressure-sensitive adhesive sheet having an excellent adhesion property to an optical member. The present invention relates to an optical pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer, wherein a relative dielectric constant at a frequency of 1 MHz is 5 to 10, and an adhesion strength to a glass, which is measured with a peel angle of 180° and a tensile speed of 300 mm/min after 30 min of laminating the optical pressure-sensitive adhesive sheet to the glass, is 3 N/20 mm to 15 N/20 mm.

Disclosed are a sealing material for solar cell modules and a manufacturing method thereof capable of endowing good transparency and heat resistance to the sealing material for solar cell modules while using a polyethylene-based resin. The disclosed sealing material for solar cell modules uses a polyethylene-based resin with a density of 0.900 g/cm3 or less, and an MFR between 0.1 g/10 min and 1.0 g/10 min. The sealing material is obtained by melt molding a resin composition containing a polyethylene-based resin with density 0.890 g/cm3 or less, and a polymerization initiator contained at 0.02 mass % or more but less than 0.5 mass % of the composition, wherein the density difference of the resin composition before and after the melt molding is within 0.05 g/cm3, and the MFR difference of the resin composition before and after the melt molding is 1.0 g/10 min or greater.

The present invention is a block copolymer composition comprising an aromatic vinyl-isoprene-aromatic vinyl triblock copolymer (A) and an aromatic vinyl-isoprene diblock copolymer (B),

(i) a ratio (Mw.sub.Da/Mw.sub.Db) of a weight average molecular weight Mw.sub.Da of a polyisoprene block in the triblock copolymer (A) to a weight average molecular weight Mw.sub.Db of a polyisoprene block in the diblock copolymer (B) being 0.5 or more to less than 1,

(ii) a ratio of an aromatic vinyl monomer unit in all polymer components of the block copolymer composition being 10 to 30 mass %, and

(iii) the block copolymer composition having a breaking strength of less than 8 MPa and an elongation at break of less than 1,100%; a pressure-sensitive adhesive composition comprising the block copolymer composition and a tackifying resin; and a pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer that comprises the pressure-sensitive adhesive composition.

Provided is a method of manufacturing a liquid crystal panel employing a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends without forming a gap therebetween. The photocurable adhesive composition of the inventive method comprises (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight-average molecular weight of 20,000 to 100,000, (B) 5 parts to 70 parts by mass of a phenoxy resin, and (C) 0.1 parts to 10 parts by mass of a photopolymerization initiator. The uncured composition has a loss tangent (loss modulus/storage modulus) of less than 1 at 25° C. and the temperature at which the loss tangent of the uncured composition reaches 1 or more is 80° C. or less.

A method for increasing the adhesion between the first surface of a first web-type material and a first surface of a second web-type material, the first web-type material and the second web-type material being supplied to a lamination nip continuously and with the same direction of the web. In said nip, the first surface of the first web-type material and of the second web-type material are laminated together and both first surfaces are treated with a plasma over the whole surface. The lamination nip is formed by a pressure roller and a counter-pressure roller and at least one of the surfaces of the rollers or both are equipped with a dielectric. The first web-type material comprises an adhesive compound layer arranged in the first web-type material such as to form the first surface of the first web-type material.

A transparent adhesive sheet for optics, which is capable of satisfying both adhesion and rework property, in view of the above problems of prior art. A production method of a silicone-based transparent adhesive sheet for optics for assembling the optical components, includes a step of forming a surface activation treated surface, in which peel strength after laminating onto an adherend increases with time, as compared with peel strength before lamination. The surface activation treatment is performed by using UV-ray irradiation on at least a part or the entire surface of an adhesive face contacting with the adherend of said transparent adhesive sheet for optics.

Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.

An enhanced breakdown strength dielectric material comprises a base dielectric layer having first and second opposing major surfaces. A first stress mitigating layer is disposed on the first major surface of the base dielectric layer. A second stress mitigating layer disposed on the second major surface of the base dielectric layer. A volume conductivity of at least one of the first and second stress mitigating layers is at least 2 times a volume conductivity of the base dielectric layer.

A method of assembly of micro-scale objects includes forming a pattern of a first functional moiety on a surface of a substrate, contacting the surface of the substrate with a first liquid suspension including first micro-scale feedstock elements functionalized with a second functional moiety, complimentary to the first functional moiety, on first portions of the first micro-scale feedstock elements and functionalized with a third functional moiety on second portions of the first micro-scale feedstock elements, aligning the first portions of the first micro-scale feedstock elements with the surface of the substrate, and facilitating bonding the second functional moieties to the first functional moieties to form a first microstructure pattern of the first micro-scale feedstock elements on the surface of the substrate.