The present disclosure provides an encapsulated fluorescent adhesive layer, a method for manufacturing the same, and a quantum dot backlight. The quantum dot backlight includes a substrate, a light emitting chip, and the encapsulated fluorescent adhesive layer. The encapsulated fluorescent adhesive layer is used for heat transfer and heat dissipation.

There is provided a one-pack type room-temperature-curable 2-cyanoacrylate based composition having magnetism. The 2-cyanoacrylate based composition having magnetism is characterized by containing (a) a 2-cyanoacrylic acid ester and (b) a magnetic powder dispersible in the 2-cyanoacrylic acid ester, wherein the content of the magnetic powder (b) is 5 to 500 parts by weight relative to 100 parts by weight of the 2-cyanoacrylic acid ester (a). The magnetic powder (b) is preferably a stainless steel.

There is provided a one-pack type room-temperature-curable 2-cyanoacrylate based composition having magnetism. The 2-cyanoacrylate based composition having magnetism is characterized by containing (a) a 2-cyanoacrylic acid ester and (b) a magnetic powder dispersible in the 2-cyanoacrylic acid ester, wherein the content of the magnetic powder (b) is 5 to 500 parts by weight relative to 100 parts by weight of the 2-cyanoacrylic acid ester (a). The magnetic powder (b) is preferably a stainless steel.

A circuit assembly includes a circuit board, a heat dissipation member on which the circuit board is placed and that is configured to release heat of the circuit board, an insulating layer that is formed on a surface on the circuit board side of the heat dissipation member, a bonding portion made of a bonding agent that is arranged in a predetermined region between the circuit board and the heat dissipation member, and an adhesive portion that is arranged in a region other than the predetermined region between the circuit board and the heat dissipation member and that is made of an adhesive with which the circuit board and the heat dissipation member are bonded to each other with lower bonding force than with the bonding agent.

A circuit assembly includes a circuit board, a heat dissipation member on which the circuit board is placed and that is configured to release heat of the circuit board, an insulating layer that is formed on a surface on the circuit board side of the heat dissipation member, a bonding portion made of a bonding agent that is arranged in a predetermined region between the circuit board and the heat dissipation member, and an adhesive portion that is arranged in a region other than the predetermined region between the circuit board and the heat dissipation member and that is made of an adhesive with which the circuit board and the heat dissipation member are bonded to each other with lower bonding force than with the bonding agent.

The invention relates to a composition for a structural acrylic adhesive that comprises an adhesion promoter including a phosphate ester and a high molecular-weight polyamine as a polymerization accelerator.

The invention relates to a composition for a structural acrylic adhesive that comprises an adhesion promoter including a phosphate ester and a high molecular-weight polyamine as a polymerization accelerator.

A method for producing pressure-responsive particles includes: adding an aggregating agent to a dispersion containing composite resin particles containing a styrene-based resin including a styrene compound and a vinyl monomer other than the styrene compound as polymer components and a (meth)acrylic acid ester-based resin including a (meth)acrylic acid ester compound as a polymer component to aggregate the composite resin particles so as to form aggregated particles A; forming a shell by adding an aggregating agent and styrene-based resin particles containing a styrene compound and a vinyl monomer other than the styrene compound as polymer components to a dispersion containing the aggregated particles A to aggregate the styrene-based resin particles so as to form aggregated particles B; and heating and fusing the aggregated particles B to form pressure-responsive particles. The amount of the styrene-based resin particles added in the formation of the shell is 5 mass % or more and 40 mass % or less relative to the total mass of the composite resin particles. The amount of the aggregating agent added in the formation of the shell is 0.1 mass % or more and 1.0 mass % or less relative to the total mass of the composite resin particles. The mass ratio of the styrene-based resin to the (meth)acrylic acid ester-based resin in the pressure-responsive particles is from 80:20 to 20:80. A difference between the lowest glass transition temperature and the highest glass transition temperature of resins contained in the pressure-responsive particles is 30° C. or more.

A method for producing pressure-responsive particles includes: adding an aggregating agent and a dispersion containing silica particles to a dispersion containing composite resin particles containing a styrene-based resin including a styrene compound and a vinyl monomer other than the styrene compound as polymer components and a (meth)acrylic acid ester-based resin including a (meth)acrylic acid ester compound as a polymer component to cause aggregation so as to form aggregated particles; and heating and fusing the aggregated particles to form pressure-responsive particles. The amount of the silica particles added by the dispersion containing the silica particles is 0.5 mass % or more and 10 mass % or less relative to a total mass of the composite resin particles. The mass ratio of the styrene-based resin to the (meth)acrylic acid ester-based resin in the pressure-responsive particles is from 80:20 to 20:80. A difference between the lowest glass transition temperature and the highest glass transition temperature of resins contained in the pressure-responsive particles is 30° C. or more.

Disclosed is an electronic device including: a foldable display panel, a glass disposed in a first direction facing a front surface of the display panel, a protection layer disposed in the first direction of the glass, a first printing layer disposed between the glass and the protection layer, and a second printing layer disposed in a second direction opposite a first direction, the first printing layer being spaced apart from an edge of the glass in a third direction facing an active area of the display panel, and one end of the second printing layer corresponds to an edge of the display panel.